JPH10329087A5

JPH10329087A5 -

Info

Publication number: JPH10329087A5
Application number: JP1997157831A
Authority: JP
Filing date: 1997-05-30
Publication date: 2004-07-08
Anticipated expiration: 2017-05-30

Description

【０００７】
【課題を解決するための手段】
上記課題を解決するため、本発明においては、円周部を有する半導体ウェハをテーブルに載せて半導体ウェハの表面に保護フィルムを貼付した後、前記保護フィルムを半導体ウェハの形状に合せてカッタで切断する際において、前記カッタの切断方向と前記半導体ウェハの円周部の接線方向とのなす角が所定の角度以下になるようにし、前記テーブルを回転させて前記円周部に沿って前記保護フィルムを切断するようにした。[0007]
[Means for solving the problem]
In order to solve the above problem, in the present invention, a semiconductor wafer having a circular circumferential portion is placed on a table, a protective film is attached to the surface of the semiconductor wafer , and then the protective film is cut with a cutter to match the shape of the semiconductor wafer , and the angle between the cutting direction of the cutter and the tangent direction of the circular circumferential portion of the semiconductor wafer is set to be less than a predetermined angle, and the table is rotated to cut the protective film along the circular circumferential portion.

Claims

A method for cutting a protective film for a semiconductor wafer, comprising placing a semiconductor wafer having a circumferential portion on a table, attaching a protective film to a surface of the semiconductor wafer, and then cutting the protective film with a cutter to match the shape of the semiconductor wafer ,
a first step of adjusting an angle between a cutting direction of the cutter and a tangent direction of a circumferential portion of the semiconductor wafer to be equal to or smaller than a predetermined angle;
a second step of rotating the table to cut the protective film along the circumferential portion;
A method for cutting a semiconductor wafer protective film, comprising:

2. The method for cutting a semiconductor wafer protective film according to claim 1, wherein the semiconductor wafer has an orientation flat portion, and in the first step, after the cutter cuts the orientation flat portion up to its corner, the angle between the cutting direction of the cutter and the tangent direction of the circumferential portion of the semiconductor wafer is set to a predetermined angle or less while maintaining the positional relationship between the cutter and the protective film at that time.

3. The method for cutting a semiconductor wafer protective film according to claim 1, wherein the cutting direction of the cutter is fixed.

a table on which a semiconductor wafer having a circumferential portion is placed, means for applying a protective film to a surface of the semiconductor wafer, a cutter for cutting the protective film, a moving means for moving the cutter and the table, a rotating means for rotating the table, and a control means for controlling the moving means and the rotating means;
The control means moves the cutter or the table so that the angle between the cutting direction of the cutter and the tangent direction of the circumferential portion of the semiconductor wafer is equal to or less than a predetermined angle, and then rotates the table.

5. The semiconductor wafer protective film cutting device of claim 4, wherein the control means controls the cutter or the table so that the cutting direction of the cutter and the tangent direction of the circumferential portion of the semiconductor wafer are equal to or less than a predetermined angle while maintaining the positional relationship between the cutter and the protective film.

6. The device for cutting a semiconductor wafer protective film according to claim 4, wherein the cutting direction of the cutter is fixed.

A wafer protective film cutting device that applies a protective film to the surface of a semiconductor wafer and then uses a cutter to cut the protective film to fit the wafer shape, characterized in that a guide roller is provided to press the protective film against the semiconductor wafer before or after the cutter's direction of travel.