JPS61122811U - - Google Patents

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Publication number
JPS61122811U
JPS61122811U JP559385U JP559385U JPS61122811U JP S61122811 U JPS61122811 U JP S61122811U JP 559385 U JP559385 U JP 559385U JP 559385 U JP559385 U JP 559385U JP S61122811 U JPS61122811 U JP S61122811U
Authority
JP
Japan
Prior art keywords
detector
feeding mechanism
cutting
rotating blade
axial displacement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP559385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP559385U priority Critical patent/JPS61122811U/ja
Publication of JPS61122811U publication Critical patent/JPS61122811U/ja
Pending legal-status Critical Current

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  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案を実施した結晶切断装置の一例
についての要部説明図、第２図は従来の結晶切断
装置の概略説明図で、イは側面図、ロは平面図で
ある。第３図はブレード変位とウエハの反りとの
相関関係を示すグラフで、イは結晶インゴツト切
削時のブレード刃先の挙動を表示し、ロは得られ
たウエハの反りを示している。 図中、１：ダイヤモンド切刃、２：ブレード、
３：結晶インゴツト、４：ウエハ、５：支持板、
６：噴射ノズル、７：検出器、８：制御機構、９
：送り機構、１０：理想的切断面。 FIG. 1 is an explanatory view of essential parts of an example of a crystal cutting apparatus embodying the present invention, and FIG. 2 is a schematic explanatory view of a conventional crystal cutting apparatus, with A being a side view and B being a plan view. FIG. 3 is a graph showing the correlation between blade displacement and wafer warpage, where (a) shows the behavior of the blade edge during cutting of a crystal ingot, and (b) shows the warpage of the obtained wafer. In the figure, 1: diamond cutting edge, 2: blade,
3: Crystal ingot, 4: Wafer, 5: Support plate,
6: Injection nozzle, 7: Detector, 8: Control mechanism, 9
: Feeding mechanism, 10: Ideal cutting surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 結晶インゴツトとその切削用の回転ブレードと
を軸方向に相対移動させる送り機構と、前記切削
部分の近傍にあつて回転ブレードの軸方向変位を
検出する検出器と、該検出器からの信号に基づい
て前記軸方向変位を解消すべく前記送り機構に指
令を送る制御機構とを具備せしめたことを特徴と
する結晶切断装置。 a feeding mechanism that relatively moves the crystal ingot and a rotating blade for cutting it in the axial direction; a detector that is located near the cutting portion and detects the axial displacement of the rotating blade; and based on a signal from the detector. and a control mechanism that sends a command to the feeding mechanism to eliminate the axial displacement.
JP559385U 1985-01-19 1985-01-19 Pending JPS61122811U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP559385U JPS61122811U (en) 1985-01-19 1985-01-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP559385U JPS61122811U (en) 1985-01-19 1985-01-19

Publications (1)

Publication Number Publication Date
JPS61122811U true JPS61122811U (en) 1986-08-02

Family

ID=30482238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP559385U Pending JPS61122811U (en) 1985-01-19 1985-01-19

Country Status (1)

Country Link
JP (1) JPS61122811U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01275010A (en) * 1988-04-26 1989-11-02 Mazda Motor Corp Slicing machine
JPH031536A (en) * 1989-05-29 1991-01-08 Naoetsu Denshi Kogyo Kk Method and device for halving signal wafer of semiconductor
JPH0342210A (en) * 1989-07-10 1991-02-22 Tokyo Seimitsu Co Ltd Cutting method of slicing machine
JPH0349907A (en) * 1989-07-17 1991-03-04 Toyo Eitetsuku Kk Slicing device
JPH0349906A (en) * 1989-07-17 1991-03-04 Toyo Eitetsuku Kk Slicing device
JPH03173610A (en) * 1989-02-27 1991-07-26 Wacker Chemitronic Ges Elektron Grundstoffe Mbh Method of slicing rod-like work piece into sheets using inner periphery blade saw and inner periphery blade saw using said method
JPH0415508U (en) * 1990-05-29 1992-02-07
JPH08267446A (en) * 1995-03-23 1996-10-15 Wacker Siltronic G Fuer Halbleitermaterialien Mbh Wire saw and method for cutting a wafer from a workpiece

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01275010A (en) * 1988-04-26 1989-11-02 Mazda Motor Corp Slicing machine
JPH03173610A (en) * 1989-02-27 1991-07-26 Wacker Chemitronic Ges Elektron Grundstoffe Mbh Method of slicing rod-like work piece into sheets using inner periphery blade saw and inner periphery blade saw using said method
JPH031536A (en) * 1989-05-29 1991-01-08 Naoetsu Denshi Kogyo Kk Method and device for halving signal wafer of semiconductor
JPH0342210A (en) * 1989-07-10 1991-02-22 Tokyo Seimitsu Co Ltd Cutting method of slicing machine
JPH0349907A (en) * 1989-07-17 1991-03-04 Toyo Eitetsuku Kk Slicing device
JPH0349906A (en) * 1989-07-17 1991-03-04 Toyo Eitetsuku Kk Slicing device
JPH0415508U (en) * 1990-05-29 1992-02-07
JPH08267446A (en) * 1995-03-23 1996-10-15 Wacker Siltronic G Fuer Halbleitermaterialien Mbh Wire saw and method for cutting a wafer from a workpiece

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