JPH10335542A - 封入材料を有する電子部品アセンブリおよびそれを形成する方法 - Google Patents

封入材料を有する電子部品アセンブリおよびそれを形成する方法

Info

Publication number
JPH10335542A
JPH10335542A JP10158423A JP15842398A JPH10335542A JP H10335542 A JPH10335542 A JP H10335542A JP 10158423 A JP10158423 A JP 10158423A JP 15842398 A JP15842398 A JP 15842398A JP H10335542 A JPH10335542 A JP H10335542A
Authority
JP
Japan
Prior art keywords
electronic component
trench
edge
mask layer
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10158423A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10335542A5 (2
Inventor
Phillip C Celaya
フィリップ・シー・セレイヤ
John R Kerr
ジョン・アール・カー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of JPH10335542A publication Critical patent/JPH10335542A/ja
Publication of JPH10335542A5 publication Critical patent/JPH10335542A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP10158423A 1997-05-30 1998-05-22 封入材料を有する電子部品アセンブリおよびそれを形成する方法 Pending JPH10335542A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/865,652 1997-05-30
US08/865,652 US5808873A (en) 1997-05-30 1997-05-30 Electronic component assembly having an encapsulation material and method of forming the same

Publications (2)

Publication Number Publication Date
JPH10335542A true JPH10335542A (ja) 1998-12-18
JPH10335542A5 JPH10335542A5 (2) 2005-10-06

Family

ID=25345964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10158423A Pending JPH10335542A (ja) 1997-05-30 1998-05-22 封入材料を有する電子部品アセンブリおよびそれを形成する方法

Country Status (5)

Country Link
US (1) US5808873A (2)
JP (1) JPH10335542A (2)
KR (1) KR19980086512A (2)
CN (1) CN1126168C (2)
MY (1) MY117410A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220305A (ja) * 2013-05-06 2014-11-20 株式会社デンソー 多層基板およびこれを用いた電子装置、電子装置の製造方法

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US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
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US20030161086A1 (en) 2000-07-18 2003-08-28 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
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Publication number Priority date Publication date Assignee Title
JP2014220305A (ja) * 2013-05-06 2014-11-20 株式会社デンソー 多層基板およびこれを用いた電子装置、電子装置の製造方法

Also Published As

Publication number Publication date
CN1201255A (zh) 1998-12-09
US5808873A (en) 1998-09-15
MY117410A (en) 2004-06-30
KR19980086512A (ko) 1998-12-05
CN1126168C (zh) 2003-10-29

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