JPH10513611A - Ｚ軸電導フィルムを含むマイクロ電子組立体 - Google Patents
Ｚ軸電導フィルムを含むマイクロ電子組立体Info
- Publication number
- JPH10513611A JPH10513611A JP9513771A JP51377197A JPH10513611A JP H10513611 A JPH10513611 A JP H10513611A JP 9513771 A JP9513771 A JP 9513771A JP 51377197 A JP51377197 A JP 51377197A JP H10513611 A JPH10513611 A JP H10513611A
- Authority
- JP
- Japan
- Prior art keywords
- film
- metal
- holes
- hole
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
- H10W70/22—Conductive package substrates serving as an interconnection, e.g. metal plates having an heterogeneous or anisotropic structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/63—Vias, e.g. via plugs
- H10W70/635—Through-vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/654—Top-view layouts
- H10W70/655—Fan-out layouts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Insulated Conductors (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US440295P | 1995-09-27 | 1995-09-27 | |
| US441595P | 1995-09-27 | 1995-09-27 | |
| US439495P | 1995-09-27 | 1995-09-27 | |
| US439695P | 1995-09-27 | 1995-09-27 | |
| US439195P | 1995-09-27 | 1995-09-27 | |
| US60/004,415 | 1995-09-27 | ||
| US60/004,396 | 1995-09-27 | ||
| US60/004,402 | 1995-09-27 | ||
| US60/004,391 | 1995-09-27 | ||
| US60/004,394 | 1995-09-27 | ||
| PCT/US1996/016023 WO1997012397A1 (en) | 1995-09-27 | 1996-09-27 | Microelectronic assemblies including z-axis conductive films |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10513611A true JPH10513611A (ja) | 1998-12-22 |
Family
ID=27533065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9513771A Ceased JPH10513611A (ja) | 1995-09-27 | 1996-09-27 | Ｚ軸電導フィルムを含むマイクロ電子組立体 |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0811245A4 (de) |
| JP (1) | JPH10513611A (de) |
| CN (1) | CN1165584A (de) |
| AU (1) | AU703591B2 (de) |
| BR (1) | BR9606658A (de) |
| CA (1) | CA2205810A1 (de) |
| TW (1) | TW321789B (de) |
| WO (1) | WO1997012397A1 (de) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011525052A (ja) * | 2008-06-20 | 2011-09-08 | アルカテル−ルーセント ユーエスエー インコーポレーテッド | 伝熱構造体 |
| JPWO2016098865A1 (ja) * | 2014-12-19 | 2017-09-21 | 富士フイルム株式会社 | 多層配線基板 |
| US11032942B2 (en) | 2013-09-27 | 2021-06-08 | Alcatel Lucent | Structure for a heat transfer interface and method of manufacturing the same |
| JP2021515385A (ja) * | 2018-03-02 | 2021-06-17 | ノースロップ グラマン システムズ コーポレーション | 高い横方向熱伝導率を有する熱ガスケット |
| JPWO2023148848A1 (de) * | 2022-02-02 | 2023-08-10 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6512300B2 (en) | 2001-01-10 | 2003-01-28 | Raytheon Company | Water level interconnection |
| DE102005020453B4 (de) | 2005-04-29 | 2009-07-02 | Infineon Technologies Ag | Halbleiterbauteil mit einer Flachleiterstruktur und Verfahren zur Herstellung einer Flachleiterstruktur und Verfahren zur Herstellung eines Halbleiterbauteils |
| DE102007055017B4 (de) * | 2007-11-14 | 2010-11-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Verbinden zweier Fügeflächen und Bauteil mit zwei verbundenen Fügeflächen |
| KR101944898B1 (ko) | 2012-06-11 | 2019-02-01 | 에스케이케미칼 주식회사 | 폴리아릴렌 설파이드 수지 조성물 및 이의 제조 방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4283464A (en) * | 1979-05-08 | 1981-08-11 | Norman Hascoe | Prefabricated composite metallic heat-transmitting plate unit |
| JPS6148952A (ja) * | 1984-08-16 | 1986-03-10 | Toshiba Corp | 半導体装置 |
| EP0854506A3 (de) * | 1987-03-04 | 1999-03-31 | Canon Kabushiki Kaisha | Elektrisches Verbindungsteil und elektrisches Schaltungsteil |
| JPS6412406A (en) * | 1987-07-07 | 1989-01-17 | Nitto Denko Corp | Directional conductor and manufacture thereof |
| JP3047986B2 (ja) * | 1990-07-25 | 2000-06-05 | 株式会社日立製作所 | 半導体装置 |
| DE69216658T2 (de) * | 1991-02-25 | 1997-08-07 | Canon Kk | Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente |
| JPH0547219A (ja) * | 1991-08-13 | 1993-02-26 | Ricoh Co Ltd | 異方性導電膜およびそれを用いた電子部品の接続方法 |
| US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
| DE69217810T2 (de) * | 1991-10-12 | 1997-10-09 | Sumitomo Spec Metals | Verfahren zur Herstellung eines warmleitenden Materials |
-
1996
- 1996-09-27 AU AU73932/96A patent/AU703591B2/en not_active Ceased
- 1996-09-27 JP JP9513771A patent/JPH10513611A/ja not_active Ceased
- 1996-09-27 BR BR9606658A patent/BR9606658A/pt not_active IP Right Cessation
- 1996-09-27 WO PCT/US1996/016023 patent/WO1997012397A1/en not_active Ceased
- 1996-09-27 CA CA002205810A patent/CA2205810A1/en not_active Abandoned
- 1996-09-27 EP EP96936229A patent/EP0811245A4/de not_active Ceased
- 1996-09-27 CN CN96191124.7A patent/CN1165584A/zh active Pending
- 1996-10-03 TW TW085112057A patent/TW321789B/zh not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011525052A (ja) * | 2008-06-20 | 2011-09-08 | アルカテル−ルーセント ユーエスエー インコーポレーテッド | 伝熱構造体 |
| US8963323B2 (en) | 2008-06-20 | 2015-02-24 | Alcatel Lucent | Heat-transfer structure |
| US9308571B2 (en) | 2008-06-20 | 2016-04-12 | Alcatel Lucent | Heat-transfer structure |
| US11032942B2 (en) | 2013-09-27 | 2021-06-08 | Alcatel Lucent | Structure for a heat transfer interface and method of manufacturing the same |
| JPWO2016098865A1 (ja) * | 2014-12-19 | 2017-09-21 | 富士フイルム株式会社 | 多層配線基板 |
| JP2021515385A (ja) * | 2018-03-02 | 2021-06-17 | ノースロップ グラマン システムズ コーポレーション | 高い横方向熱伝導率を有する熱ガスケット |
| JPWO2023148848A1 (de) * | 2022-02-02 | 2023-08-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| AU703591B2 (en) | 1999-03-25 |
| BR9606658A (pt) | 1997-11-04 |
| EP0811245A1 (de) | 1997-12-10 |
| MX9703780A (es) | 1998-05-31 |
| EP0811245A4 (de) | 1998-11-18 |
| TW321789B (de) | 1997-12-01 |
| WO1997012397A1 (en) | 1997-04-03 |
| CA2205810A1 (en) | 1997-04-03 |
| AU7393296A (en) | 1997-04-17 |
| CN1165584A (zh) | 1997-11-19 |
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