JPH1065330A - Electronic component mounting machine - Google Patents

Abstract

(57) [Summary] [Problem] An I in which solder ball terminals are arranged vertically and horizontally on the back surface.
Provided is an electronic component mounting machine that can securely mount an electronic component such as a C chip at a predetermined position of a pad provided on a substrate without displacement. SOLUTION: A heater for heating and melting part or all of solder ball terminals arranged in rows and columns on the back surface of an electronic component is provided in an electronic component mounting machine, and this heater heats a part or all of the solder ball terminals. An electronic component is soldered and mounted at a predetermined position on a pad provided on the substrate after being melted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine.

[0002]

2. Description of the Related Art In recent years, as shown in FIG. 3, there has been developed an electronic component 10 such as an IC chip having solder ball terminals 11 arranged vertically and horizontally on the back surface. In order to mount the electronic component on the board, as shown in FIGS. 5 and 6, the electronic component reciprocates between the component tray 12 and the board 15 conveyed by the conveyor 20.
And an electronic component mounting machine 1 having a vertically movable head 2
Accordingly, the electronic component 10 is mounted on a predetermined pad 16 provided on the substrate 15.

[0003] A cream solder 17 or a solder coat is applied to the upper surface of the pad 16 provided on the substrate 15 in a predetermined pattern by a screen printing machine. Electronic components 10
Is fixed to the substrate 15. In this state, the electronic component mounting board 1
5 is conveyed by a conveyor 20 to a reflow furnace (not shown), and the electronic component 10 is mounted on a board 15 by soldering.

[0004]

However, the solder ball terminals 11 arranged vertically and horizontally on the back surface of the electronic component 10 are used.
Is less flexible than the conventional lead terminals, and has a small contact area with the solder 17 applied to the upper surface of the pad 16, so that the electronic component mounting machine 1 mounts the electronic component 10 on the substrate 15. However, there is a problem in that, when it is mounted at a predetermined position or when it is transported to a reflow furnace, it is displaced by a slight impact.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting machine capable of securely mounting electronic components having solder ball terminals arranged in rows and columns on a back surface thereof without being displaced at predetermined positions of pads provided on a substrate. And

[0006]

SUMMARY OF THE INVENTION The present invention is directed to an electronic component mounting machine for mounting electronic components having solder ball terminals arranged on the back side of a substrate in a matrix, wherein a part or all of the solder ball terminals are heated and melted. The electronic component mounting machine is configured by providing a heater.

[0007] An electronic component is mounted on a predetermined position of a pad provided on a substrate by an electronic component mounting machine, and one of solder ball terminals arranged vertically and horizontally on the back surface of the electronic component by a heater provided on the electronic component mounting machine. A part or the whole is heated and melted, and the electronic component is mounted on the board by soldering.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an elevational view showing a first embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a rear view of the electronic component. In the drawing, reference numeral 1 denotes an electronic component mounting machine, and 2 denotes a head provided with a chuck section 3 for chucking an electronic component 10 by suction or the like.
The electronic component 10 such as an IC chip is moved to a predetermined position of the pad 16 provided on the substrate 15
Attach. Reference numeral 4 denotes a heater comprising a hot air blower, a laser, a light beam, or the like. The position where the heater 4 is provided is not particularly limited. Reference numeral 5 denotes nozzles provided on both sides of the lower surface of the head 16. The nozzles 5 are connected to the heater 4. For example, when a hot air blower is used as the heater 4, the electronic component 10 is provided on the substrate 15. Pad 16
At the stage where it is fixed at the predetermined position,
Hot air heated to about 50 ° C. (solder melting temperature 180 ° C.) blows out from the nozzle 5. The hot air causes the solder ball terminals 11 arranged in rows and columns on the back surface of the electronic component 10.
(See FIG. 3).
Is soldered to a predetermined position of a pad 16 provided on a substrate 15. When a laser or a light beam is used as the heater 4, a part or all of the solder ball terminals 11 are heated and melted by a laser or a light beam emitted from the tip of the nozzle 5, and the electronic component 10 is placed on the substrate 15. Is soldered to a predetermined position of the pad 16 provided in the above. Reference numeral 20 denotes a substrate transport conveyor.

The solder 17 is applied to the upper surface of the pad 16 provided on the substrate 15 in a predetermined pattern by a cream solder printing machine. The solder ball terminals 11 arranged in rows and columns are fixed at predetermined positions on pads 16 provided on a substrate 15 and positioned and fixed by a chuck portion 3 provided on a head 2 of the electronic component mounting machine 1. In this state, a part or all of the solder ball terminals 11 arranged in rows and columns on the back surface of the electronic component 10 are heated and melted by the heater 4 and soldered to predetermined positions of the pads 16 provided on the substrate 15. Even if an impact is applied to the substrate 15 conveyed to the reflow furnace (not shown) by the conveyor 20, there is no possibility that the electronic component 10 is displaced. Further, it can be expected that the solder is completely melted in the reflow furnace and returns to a regular position by a self-alignment effect.

FIG. 4 is an elevational view showing a second embodiment of the present invention using a heating plate 4a having a built-in heater 4b as the heater 4. In this embodiment, the heating plate 4a The solder ball terminals 11 (see FIG. 3) provided on the back surface of the electronic component 10 mounted on predetermined positions of the pads 16 provided on the substrate 15 are melted by heating the bottom 15 from the lower surface. An electronic component mounting machine is configured to mount the electronic component 10 by soldering.

The type of the heater 4 constituting the electronic component mounting machine 1 is not particularly limited, and the design can be changed as needed.

[0012]

According to the present invention, as described above, the electronic components 10 in which the solder ball terminals 11 are arranged vertically and horizontally on the back surface are securely mounted at predetermined positions on the pads 16 provided on the substrate 15 without displacement. There is an excellent advantage that an electronic component mounting machine capable of performing the above can be provided.

[Brief description of the drawings]

FIG. 1 is an elevation view showing a first embodiment of the present invention.

FIG. 2 is a plan view of FIG. 1;

FIG. 3 is a rear view of the electronic component.

FIG. 4 is an elevation view showing a second embodiment of the present invention.

FIG. 5 is an elevation view showing a conventional electronic component mounting machine.

FIG. 6 is a plan view of FIG. 5;

[Explanation of symbols]

1 Electronic component mounting machine
4 Heater 10 Electronic component
11 Solder ball terminal 15 Substrate

Claims (1)

[Claims] 1. An electronic component mounting machine for mounting an electronic component having solder ball terminals arranged on a back surface in rows and columns on a back surface.
An electronic component mounting machine comprising a heater for heating and melting part or all of the solder ball terminals.