JPH11103177A - Electronic device housing and method of assembling the same - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To integrate a plurality of printed circuit boards in a die-casting frame requires many man-hours and parts, resulting in poor work efficiency. SOLUTION: A die casting frame 1 having an open upper surface.
A printed circuit board 2 fixed in the die-cast frame 1, a chassis 3 mounted on the die-cast frame 1 so as to cover the printed circuit board 2, and a printed circuit board 4 mounted on the upper surface of the chassis 3. Since the cover 9 covers the upper opening of the die casting frame 1, a plurality of printed boards 2 and 4 can be assembled without turning over the die casting frame 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing of a wireless device which is easy to assemble and a method of assembling the same.

[0002]

2. Description of the Related Art Conventionally, as a housing structure of a wireless device, for example, one shown in FIG.
No. 9 is known.

In the case structure shown in FIG. 10, a printed circuit board b is mounted on a die casting frame a formed by aluminum die casting or the like, and the printed circuit board b is shielded by a plurality of shield components c. The upper opening of the die casting frame a is covered with an upper cover d made of sheet metal.

[0004] A cable e is fixed by a crimping fitting f fixed to a die casting frame a.
A printed circuit board g is also attached below the die casting frame a, and a cable h provided below the die casting frame a is fixed to a resin component i via a bushing j.

The lower opening of the die-casting frame a is covered with a lower cover k made of sheet metal, and a speaker m,
The printed board n is attached, and the escutcheon o covering the front surface of the die-cast frame a has ID-R.
The OMp is attached with the holding lid q.

On the other hand, the housing described in the above-mentioned publication has an inside of a casing having two half cases which are opposed to each other while sandwiching the chassis from the thickness direction thereof and which are detachably connected to the chassis. In addition, three circuit boards are arranged, the three circuit boards are separately mounted on both sides of the chassis, and the other one is mounted on one inner surface of the half case.

[0007]

However, in the conventional case structure shown in FIG. 10, in order to shield the printed circuit board b mounted on the upper side of the die casting frame a, the work of soldering a plurality of shield parts c is required. Since there is a necessity or the printed circuit board b is fixed with many screws, there is a problem that a large number of man-hours are required for the assembling work.

Further, since the caulking fitting f and the bushing j are also used for fixing the cables e and h, a lot of time is required for assembling them, and the printed circuit board b is provided above the die casting frame a. After mounting, the die-casting frame a must be turned over and another printed circuit board g must be mounted, requiring a lot of man-hours for the assembling work, resulting in poor work efficiency.

On the other hand, the housing described in the publication also has a structure in which a circuit board is mounted on the upper and lower surfaces of the chassis. Therefore, after the circuit board is mounted on the upper surface of the chassis, it is necessary to turn over the chassis and mount another circuit board. As in the case of the housing structure shown in FIG. 10, there is a disadvantage that the assembling operation requires a lot of man-hours and the working efficiency is poor.

SUMMARY OF THE INVENTION The present invention has been made in order to solve such a conventional problem, and an object of the present invention is to provide a housing of an electronic device in which an assembling operation can be easily performed with a small number of steps and an assembling method thereof.

[0011]

According to the present invention, in order to achieve the above object, a printed circuit board is mounted in a die casting frame having an open upper surface, and a chassis is mounted on the die casting frame so as to cover above the printed circuit board. A bush is provided on the cable extending from the printed circuit board, the bush is fitted into a mounting groove formed in the die-cast frame, fixed in the mounting groove by the chassis, and separately provided on the upper surface of the chassis. After the printed circuit board is attached, the upper surface opening of the die casting frame is covered with a cover, so that the housing can be easily assembled with a small number of steps.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a die casting frame having an open upper surface, a printed board fixed in the die casting frame, and a die casting frame covering the printed board. It comprises a mounted chassis, a printed circuit board mounted on an upper surface of the chassis, and a cover for covering an opening on an upper surface of the die casting frame.

According to the above configuration, a plurality of printed circuit boards can be incorporated in the die casting frame without inverting the die casting frame, so that the number of assembling steps can be greatly reduced, and the printed circuit board is shielded by the chassis. There is no need to shield using multiple shield components.

As a result, it is possible to reduce the number of parts and the number of steps for mounting them.

According to a second aspect of the present invention, a cable connected to a printed board is provided with a bush,
The cable is fixed to the die casting frame by fitting the bush into a mounting groove formed in the die casting frame.

According to the above configuration, the cable can be fixed without using a caulking fitting or a screw, so that the number of parts and the number of steps for assembling the same can be reduced.

According to a third aspect of the present invention, a positioning pin is provided on a detachable escutcheon on a front surface of a die-casting frame, and a printed board provided on the front surface of the die-cut frame is positioned by the positioning pin. It is something to do.

According to the above configuration, since the printed circuit board can be mounted with high accuracy, the connection between the printed circuit board and the ID-ROM can be reliably performed.

According to a fourth aspect of the present invention, an elastic leg is protruded from a speaker retainer for mounting a speaker on the front surface of a die-cast frame, and a printed circuit board is clamped between the legs. is there.

According to the above configuration, when attaching the escutcheon to the die casting frame, the locating pins of the escutcheon can be easily and reliably inserted into the positioning holes of the printed circuit board.

According to a fifth aspect of the present invention, a printed circuit board is mounted in a die-cast frame having an open upper surface, a chassis is mounted on the die-cast frame so as to cover above the printed circuit board, and extends from the printed circuit board. A bush was provided on the output cable, this bush was fitted into the mounting groove formed in the die-cast frame, fixed in the mounting groove by the chassis, and another printed circuit board was mounted on the upper surface of the chassis. Then, the upper opening of the die casting frame is covered with a cover.

According to the above method, a plurality of printed circuit boards can be incorporated in the die casting frame without reversing the die casting frame, so that the number of assembling steps can be greatly reduced and the chassis shields the printed circuit board. There is no need to shield using multiple shield components.

As a result, it is possible to reduce the number of parts and the number of steps for mounting them.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings shown in FIGS.

FIG. 1 is an exploded perspective view of a housing, and FIG. 2 is a cross-sectional view of an assembled state. Reference numeral 1 denotes a die-casting frame formed by aluminum die-casting or the like and having an open upper surface. The board 2 and the chassis 3 are assembled, and another printed circuit board 4 is assembled on the chassis 3 and fixed to the die casting frame 1 by a plurality of screws 4.

The chassis 3 has a box-shaped structure having an open lower surface, and covers the printed circuit board 2 so as to shield the electronic components 2a mounted on the printed circuit board 2 and the printed circuit board 2 itself. A plurality of mounting seats 3a are formed on the chassis 3, and another printed circuit board 4 is mounted on these mounting seats 3a from above.

One end of each of the cables 5 and 6 is connected to one of the printed circuit boards 2 and 4, and plugs 5a and 6a such as connectors and pins are connected to the other ends of the cables 5 and 6. At the same time, as shown in FIG. 5, one ends of these cables 5, 6 are fixed to the die casting frame 1 by bushings 7, 8 made of resin.

The bushing 7 for fixing the cable 5 is formed of a block having an arcuate lower surface, and has concave grooves 7a formed on both sides and an arcuate lower surface. The cable 5 can be fixed to the die-casting frame 1 by being inserted into the ridge 1b of the U-shaped mounting groove 1a formed in the frame.

A bushing 8 for fixing the cable 6
As shown in FIG. 5, the upper surface is formed in a substantially cylindrical shape with a chamfered upper surface, and the concave groove 8a formed on the outer peripheral surface is fitted to the U-shaped mounting groove 1c formed on the rear surface of the die casting frame 1. The cable 6 can be fixed to the die casting frame 1 by being inserted into the ridge 1d.

The bushings 7, 8 are pressed from above and fixed to the rear of the chassis 3 covering the upper part of the printed circuit board 2, thereby preventing the bushings 7, 8 from coming out of the mounting grooves 1a, 1c. Pressing portions 3b and 3c are formed (see FIG. 6).

On the other hand, a holding portion 3b for fixing the bushing 7
Is protruded so as to press the upper surface of the bushing 7 as shown in FIG. 7B, and the pressing portion 3c for fixing the other bushing 8 is provided with a bushing as shown in FIG. 8 that presses a flat surface 8b formed on the upper surface of the projection 8
f is formed, and the upper surface opening of the die casting frame 1 is covered with a cover 9 made of sheet metal.

On the other hand, a circular opening 1e is opened on the front surface of the die casting frame 1, and a cylindrical speaker mounting portion 1f protrudes around the opening.

The speaker 11 is connected to the speaker mounting portion 1f via a rubber bushing 10 having a buffer function.
Is attached via a holding bracket 12.

The presser fitting 12 is provided with a leg portion 12a having an elasticity from an outer peripheral portion thereof, and the printed circuit board 14 can be fixed to the front surface of the die casting frame 1 by the leg portion 12a. At the same time, the positioning pins 15a protruding from the escutcheon 15 that covers the front surface of the die casting frame 1 are inserted into the printed circuit board 14, so that the positioning holes 14a for positioning the printed circuit board 14 and the escutcheon 15 are attached. A connector 16 connected to the ID-ROM 18 is provided (see FIG. 9).

As shown in FIG. 8, the escutcheon 15 has projecting portions 15b projecting from both ends, and a locking recess 15c is formed on the inner surface of the tip side of the projecting portion 15b.

By engaging these locking recesses 15b with locking projections 1g formed on both front side surfaces of the die casting frame 1 as shown in FIG. 8D, the front surface of the die casting frame 1 is formed. The escutcheon 15 is detachably attached to the escutcheon.

On the front surface of the escutcheon 15, the printed circuit board 1 mounted on the front surface of the die casting frame 1 is mounted.
4, a concave step 15 d is formed, and an ID-ROM 18 is attached to the concave step 15 d via a holding lid 19.

Next, a method of assembling the above housing will be described.
In assembling the housing, first, when the printed circuit board 2 is assembled from the upper opening of the die casting frame 1, the bushings 7, 8 of the cables 5, 6 extended from the printed circuit board 2 are attached to the mounting grooves 1a of the die casting frame 1, 1c is inserted as shown in FIG.

Next, the chassis 3 is assembled so as to cover the upper surface of the printed board 2, and the printed board 2 and the chassis 3 are fastened together by screws 5, and the bushes 7, 3 are pressed by the holding portions 3 b and 3 c of the chassis 3. After fixing the printed circuit board 8, another printed circuit board 4 is mounted on the mounting seat 3 a on the upper surface of the chassis 3.

When the mounting of the printed circuit boards 2 and 4 and the chassis 3 is completed, the speaker 11 is inserted from the front side of the die-casting frame 1 to the speaker mounting portion 1 f via the bush 10.
When the printed circuit board 14 is attached by the presser fitting 12, the printed circuit board 14 is positioned on the front surface of the die casting frame 1, and the presser fitting 1 is
The printed circuit board 14 is sandwiched between the two legs 12a.

In this state, the escutcheon 15 is attached to the front surface of the die casting frame 1 from the front, and the positioning pins 15a projecting from the escutcheon 15 are inserted into the positioning holes 14a of the printed circuit board 14, thereby positioning the printed circuit board 14. At the same time, escussion 15
Locking recesses 15b on the inner surface of protruding portions 15b protruding from both ends of
Is engaged with the locking projection 1g of the die casting frame 1, and the escutcheon 15 is fixed to the front surface of the die casting frame 1.

Finally, the upper surface opening of the die casting frame 1 is covered with a cover, the ID-ROM 18 is mounted on the concave step 15d on the front of the escutcheon 15, and the holding lid 19 is fitted to the concave step 15c. , A plurality of printed circuit boards 2 without assembling the die casting frame 1
4 can be mounted in the die-casting frame 1, and the cables 5, 6 can be fixed to the die-casting frame 1 without using caulking fittings or screws.

Although the above embodiment has been described with reference to the housing of an electronic device such as a vehicle-mounted wireless device, the present invention can be similarly applied to an electronic device such as a portable wireless device.

[0044]

As described above in detail, according to the present invention, a printed circuit board is mounted in a die-casting frame having an open upper surface, a portion above the printed circuit board is covered with a chassis, and another printed circuit board is mounted on the upper surface of the chassis. Therefore, a plurality of printed circuit boards can be mounted without turning over the die casting frame, and the number of steps required for the assembling work can be greatly reduced.

Further, since the chassis covering the printed circuit board functions as a shield, it is not necessary to attach a plurality of shield parts to the printed circuit board, thereby reducing the number of parts and the number of steps for assembling these parts. The cable can also be fixed to the die-cast frame without using caulking metal fittings or screws, so that the cable assembling work is also easy.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a housing of an electronic device according to an embodiment of the present invention.

FIG. 2 is an exemplary sectional view showing an assembled state of a housing of the electronic apparatus according to the embodiment of the present invention;

FIG. 3 is an exemplary perspective view showing a process of assembling the housing of the electronic device according to the embodiment of the present invention;

FIG. 4 is an exemplary perspective view showing a process of assembling the housing of the electronic device according to the embodiment of the present invention;

FIG. 5 is an exemplary perspective view showing a process of assembling the housing of the electronic device according to the embodiment of the present invention;

6A is a side view showing a process of assembling the housing of the electronic device according to the embodiment of the present invention. FIG. 6B is a view taken in the direction of arrow A in FIG.

7A is a cross-sectional view taken along line BB of FIG. 6B. FIG. 7B is a cross-sectional view taken along line CC of FIG. 6B. View from arrow D

8A is an exploded perspective view of an escutcheon portion of the housing of the electronic device according to the embodiment of the present invention. FIG. 8B is a view taken in the direction of arrow E in FIG. (B) Enlarged view inside the F circle (d) Cross-sectional view of the assembled escutcheon

9A is an exploded perspective view of the escutcheon of the housing of the electronic device and the speaker portion according to the embodiment of the present invention. FIG. 9B is a view taken in the direction of arrow G in FIG. 9 (a) as viewed from the direction of arrow H. (d) Cross-sectional view along the line II in FIG. 9 (a).

FIG. 10 is an exploded perspective view showing a housing of a conventional electronic device.

[Explanation of symbols]

 Reference Signs List 1 die-cast frame 1a, 1c mounting groove 1b, 1d ridge 1e opening 1f speaker mounting part 2 printed board 3 chassis 3a mounting seat 3b, 3c holding part 4 printed board 5, 6 cable 7, 8 bushing 7a, 8a concave groove 9 Cover 10 Bush 11 Speaker 12 Speaker holder 12a Leg 14 Printed circuit board 14a Positioning hole 15 Escussion 15a Positioning pin 15b Projection 15c Engagement recess 15d Recessed step 18 ID-ROM 19 Holding lid

Claims (5)

[Claims] 1. A die casting frame having an open upper surface,
A printed circuit board fixed in the die casting frame, a chassis mounted on the die casting frame so as to cover the printed circuit board, a printed circuit board mounted on an upper surface of the chassis, and a cover covering an upper opening of the die casting frame A housing for an electronic device, comprising: 2. The cable connected to the printed circuit board is provided with a bush, and the bush is fitted into a mounting groove formed in the die casting frame, thereby fixing the cable to the die casting frame. 2. The housing of the electronic device according to 1. 3. The electronic apparatus according to claim 1, wherein a positioning pin is projected from a detachable escutcheon on a front surface of the die-casting frame, and a printed board provided on the front surface of the die-cut frame is positioned by the positioning pin. Housing. 4. A housing for an electronic device according to claim 1, wherein an elastic leg is protruded from a speaker holding member for mounting a speaker on a front surface of the die casting frame, and the printed circuit board is clamped by the leg. . 5. A printed circuit board is mounted in a die-cast frame having an open upper surface, a chassis is mounted on the die-cast frame so as to cover above the printed circuit board, and a bush is provided on a cable extending from the printed circuit board. This bush is fitted in the mounting groove formed in the die-casting frame, and is fixed in the mounting groove by the chassis. After another printed circuit board is mounted on the upper surface of the chassis, the upper surface opening of the die-casting frame is covered with a cover. A method for assembling a housing of an electronic device, comprising covering the electronic device.