JPH11106603A - Phenolic resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a phenolic resin composition having excellent toughness, moldability and heat-resistance. SOLUTION: This phenolic resin composition is produced by mixing and melting a phenolic resin with a polyamide obtained by the polycondensation of a diamine and carboxyl residue of a polymerized fatty acid and/or various 2-21C dicarboxylic acids at a weight ratio of 100:5 to 5:100. A polyamide having a melting point of 80-130 deg.C is used as the above polyamide. A bisepoxy compound is added as a crosslinking agent for the polyamide at a ratio of 0.1-1 based on the equivalent of the amide group of the polyamide.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a phenolic resin composition having excellent heat resistance, toughness and processability.

[0002]

2. Description of the Related Art A conventional phenol resin has a disadvantage that it is relatively brittle. As a method for improving this, a blend with various elastomers, engineering plastics, and the like has been performed. Among them, a blend of a polyamide and a phenolic resin shows good toughness because the compatibility between the resins is good. However, since the melting point of polyamide is high, the resin obtained by blending has a high softening point, the difference between the curing temperature and the softening point of the phenolic resin is small, and the fluidity becomes poor during processing, and the pot life is short. There was a disadvantage that it became.

[0003]

DISCLOSURE OF THE INVENTION The present invention has been intensively studied in order to obtain a phenolic resin composition which is excellent in toughness, workability and heat resistance.

[0004]

SUMMARY OF THE INVENTION The present invention provides a phenolic resin, a carboxyl residue and / or C
A phenolic resin composition characterized in that the weight ratio of the phenolic resin to the polyamide obtained by mixing and melting a polyamide obtained by polycondensation of various C2 to C21 dicarboxylic acids and diamines is 100: 5 to 5: 100. Wherein the polyamide is a phenolic resin composition having a melting point of 80 to 130 ° C., and as a cross-linking agent for the polyamide, a ratio of bisepoxy of 0.1 to 1 relative to the equivalent weight of the amide group of the polyamide. A phenolic resin composition characterized by being added in

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention provides a phenolic resin having a high toughness without impairing the processability by using a fatty acid polyamide having a relatively low melting point as a polymer to be blended, and further, by impairing the heat resistance by partially crosslinking the polyamide. Can be given.

As the phenol resin used in the present invention, any commonly used phenol resin can be used. Novolak,
Either resol may be used, and it may have a chemically modified structure.

The polyamide used in the present invention is a polyamide obtained by polycondensation of a carboxyl residue of a polymerized fatty acid and / or various dicarboxylic acids of C2 to C21 with a diamine, and preferably has a melting point of 80 to 130 ° C., more preferably 90 to 130 ° C.
１１０110 ° C.

In the present invention, any commonly used bisepoxy used for partial cross-linking of polyamide can be used, but liquid epoxy is preferred, and it is desirable to melt-mix it with polyamide in advance.

[0009]

【Example】

(Example 1) Phenol novolak (softening point 97 ° C) 1
12 g of diglycidylbisphenol A (epoxy equivalent: 180) was melt-mixed at 120 ° C. with 40 g and 60 g of a fatty acid-based polyamide (amide equivalent: 180) having a melting point of 100 ° C. at 120 ° C. to obtain a resin A (softening point: 98 ° C.). A100g, hexamine 15g, magnesium oxide 5g, glass fiber 20
After adding 0 g, the mixture was kneaded with a roll and then pulverized to obtain a pellet.
Test pieces were prepared at 175 ° C. for 3 minutes using a transfer molding machine. Table 1 shows the results.

Example 2 100 g of phenol novolak (softening point: 97 ° C.) and 100 g of a fatty acid-based polyamide (amide equivalent: 180) having a melting point of 110 ° C. were mixed with 40 g of diglycidylbisphenol A (epoxy equivalent: 180) by a kneader.
The mixture was melted and mixed at 20 ° C. to obtain resin B (softening point: 105 ° C.).
Pellets were obtained in the same manner as in Example 1 except that resin B was used instead of resin A. Test pieces were prepared at 175 ° C. for 3 minutes using a transfer molding machine. Table 1 shows the results.

Comparative Example 1 Pellets were obtained in the same manner as in Example 1, except that phenol novolak (softening point: 95 ° C.) was used instead of resin A. Test pieces were prepared at 175 ° C. for 3 minutes using a transfer molding machine. Table 1 shows the results.

[0012]

[Table 1]

[0013]

The phenolic resin composition of the present invention is excellent in toughness, workability and heat resistance.

Claims (3)

[Claims] 1. A phenolic resin mixed with a carboxyl residue of a polymerized fatty acid and / or a polyamide obtained by polycondensation of diamines with various C2 to C21 dicarboxylic acids,
A phenol resin composition, wherein the weight ratio of the phenol resin and the polyamide obtained by melting is from 100: 5 to 5: 100. 2. The phenolic resin composition according to claim 1, wherein the polyamide has a melting point of 80 to 130 ° C. 3. The crosslinking agent for the polyamide according to claim 2,
A phenol resin composition, characterized in that bisepoxy is added at a ratio of 0.1 to 1 with respect to the equivalent of the amide group of the polyamide.