JPH1117059A - Ball grid array substrate and its continuum - Google Patents

Abstract

(57) [Problem] To realize a multi-terminal package, high integration and miniaturization of a package, and to realize continuous processing from mounting of a semiconductor element to resin sealing, formation of external connection bumps and inspection.
It is to provide a GA substrate. SOLUTION: A build-up type multilayer wiring circuit board 100 in which an insulating layer and a conductor wiring layer are sequentially laminated on a metal substrate 11 and a connection electrode 18 is formed on an uppermost layer, and a base film made of a long polyimide film. Wiring layer 24 formed on square base film 22, external connection terminal 25
The film carrier including the leads 23 is fixed by bonding layers 32 and 33 via a square-shaped insulating substrate 31 and integrated. Furthermore, the external connection terminal 2 of the film carrier
The lead 5 is electrically connected to the connection electrode 18 of the multilayer wiring circuit by the lead 23 to obtain a BGA substrate and its continuum.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called ball grid array substrate used for mounting a semiconductor integrated circuit typified by an LSI, a VLSI, etc., and more specifically to a multi-terminal package, high integration, and miniaturization of a package. (Hereinafter, referred to as a BGA substrate).

[0002]

2. Description of the Related Art Conventional multi-chip module substrates are:
As shown in FIG. 3, a lowermost first wiring layer 44 of a multilayer wiring circuit formed by alternately laminating insulating layers and conductor wiring layers on one surface of a copper-bonded insulating substrate 41 made of epoxy, BT resin, or the like.
And an external connection terminal 43 formed on the other surface, and a BGA substrate electrically connected to the external connection terminal 43 through a through hole 42. Further, as shown in FIG. A multilayer wiring circuit formed by sequentially laminating an insulating layer and a conductor wiring layer on one side of the upper surface;
An external connection terminal 64 and a square-shaped wiring circuit board in which the connection electrodes 63 are electrically connected through through holes 62 are bonded to a square-shaped insulating substrate 61 such as a resin with an adhesive layer 71,
Connection electrode 58 of uppermost wiring layer 57 of multilayer wiring circuit board
There is a BGA substrate electrically connected to the connection electrode 63 of the square-shaped wiring circuit board by fusion bonding.

[0003] In the above-mentioned BGA substrate, a through hole is mechanically opened by a drill, so that the hole diameter is at least 200 mm.
μm large, multi-terminal BGA board, high integration,
There was a problem that miniaturization was impossible. Also, in the case of a form in which an insulating layer and a conductor layer are laminated on a metal plate, when bonding a multilayer wiring circuit board and a square-shaped wiring circuit board,
Since the connection electrode portion is not visible, it is necessary to further increase the size of the external connection terminal. In addition, since the mounting of the semiconductor element, the resin sealing, and the formation of the bumps for external connection are performed, each substrate is separately taken out from one case and stored in each step, so that continuous processing between the steps and the inspection is impossible. there were.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object the following:
Realization of multi-terminal package, high integration and miniaturization of package,
It is still another object of the present invention to provide a BGA substrate that realizes continuous processing from mounting of a semiconductor element to resin sealing, formation of external connection bumps, and inspection.

[0005]

Means for Solving the Problems In order to solve the above-mentioned problems in the present invention, first, in claim 1, an insulating layer and a conductor wiring layer are sequentially laminated on a metal substrate or an insulating substrate. In a ball grid array substrate composed of a multilayer wiring circuit and external connection terminals, the external connection terminals are formed of a film carrier, and are connected to the uppermost connection electrodes of the multilayer wiring circuit by leads. This is a ball grid array substrate.

According to a second aspect of the present invention, the film carrier is formed of a film carrier continuum that can be continuously processed from mounting of a semiconductor element to resin sealing or formation of external connection bumps. A continuous body of the ball grid array substrate according to claim 1.

[0007]

Embodiments of the present invention will be described below. 1A is a sectional view of the BGA substrate of the present invention, FIG. 1B is a partially enlarged sectional view of the BGA substrate of the present invention, and FIG. 2A is a plan view of a film carrier. FIG. 2B shows a cross-sectional view of the film carrier.

The BGA substrate of the present invention realizes multi-terminal package, high integration and miniaturization of the package, and further realizes continuous processing from mounting of semiconductor elements, resin sealing, formation of bumps for external connection and inspection. A build-up type multilayer wiring circuit board 100 formed by sequentially laminating an insulating layer and a conductor wiring layer on a metal substrate or an insulating substrate is a square-shaped insulating substrate. It is fixed to the film carrier 200 by the adhesive layers 32 and 33 via 31 and is integrated. Further, the external connection terminals 25 of the film carrier 200 are electrically connected to the connection electrodes 18 of the multilayer wiring circuit by the leads 23, and a BGA substrate is manufactured. Further, the film carrier 200 is formed of a continuous film. Hereinafter, each configuration of the BGA substrate will be described.

First, a resin (for example, a filler-containing BCB (benzocyclobutene; manufactured by Dow Chemical Co., Ltd.)) solution is applied on a metal substrate 11 and dried by heat to form a first insulating layer 12.

Next, the first insulating layer 1 is formed by an excimer laser.
Then, via-holes are formed at predetermined positions 2 and copper is sputtered on the first insulating layer 12 to form a thin-film conductor layer.

Next, a photosensitive resin is coated on both sides of the substrate and dried to form a photosensitive layer having a thickness of 15 μm. The photosensitive layer on the thin-film conductor layer is exposed, developed and cured by a predetermined pattern. A pattern is formed, and the photosensitive layer on the other surface is exposed and cured to form a plating resist layer.

Next, the current density is 5 A / electrode by electrolytic plating using a copper sulfate plating solution, using the resist pattern as a mask.
A 10 μm-thick copper conductor pattern layer and a via hole are formed at dm ² , the resist pattern is peeled off using a dedicated stripper, and the thin film conductor layer is etched using the conductor pattern layer as a mask to form the first wiring layer 13. .

Further, the above steps are repeated as many times as necessary to produce a build-up type multilayer wiring circuit board 100 in which insulating layers and conductor wiring layers are sequentially laminated.

On the other hand, after bonding an adhesive film to one side of a base film 21 made of a long polyimide film, the base film 21 is punched with a die to form a sprocket hole 26, a character hole 27 and a square base film 22. After forming, a copper foil is attached. Further, after the external connection terminals 25 are formed on the square base film 22, the copper foil is patterned to form the leads 23 and the wiring layers 24, thereby manufacturing the film carrier 200.

Next, the film carrier 200 is bonded and fixed to a predetermined position of the multilayer printed circuit board 100 with adhesive layers 32 and 33 via a square-shaped insulating substrate 31 to be integrated. Furthermore, the external connection terminal 2 of the film carrier 200
5 is joined to the connection electrode 18 of the multilayer wiring circuit board 100 by the lead 23 by a method such as fusion bonding, thereby producing the BGA substrate of the present invention.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the following examples. A resin (BCB (trade name); Dow Chemical) solution is applied to one surface of a metal substrate 11 made of a 0.20 mm-thick Cu alloy at 100 ° C. 15 minutes, 150 ° C, 15 minutes, 210 ° C
The first insulating layer 12 having a thickness of 12 μm was formed by heating and drying for 30 minutes.

Next, an excimer laser (beam intensity 30 m
j, frequency of 500 Hz), a via hole forming hole was formed at a predetermined position of the first insulating layer 12.

Next, copper was sputtered on the insulating layer 12 in which the via hole forming hole was formed to form a thin film conductor layer having a thickness of 3000 mm. Further, a photosensitive resin (AZ (trade name); Hoechst) was applied to both surfaces of the metal substrate 11, and dried at 90 ° C. for 30 minutes to form a photosensitive layer having a thickness of 15 μm.

Next, a predetermined pattern is exposed and baked on the photosensitive layer on one side of the metal substrate 11 and developed, and the pattern is formed at 100 ° C.
Heating was performed for 30 minutes to form a resist pattern, and the photosensitive layer on the other side was exposed and cured to form a plating resist layer.

Next, by electroplating using copper sulfate plating, using the resist pattern as a mask, a current density of 5 A
A 10 μm thick copper conductor pattern layer and a via hole are formed at / dm ² , the resist pattern is stripped with a dedicated stripper, and the thin film conductor layer is etched using the conductor pattern layer as a mask to form a first wiring layer 13. did.

Next, the above process is repeated as many times as necessary to form a multilayer wiring circuit in which an insulating layer and a conductor wiring layer are laminated, and the uppermost wiring layer and the connection electrode are formed by electroless nickel plating to form a nickel wiring having a thickness of 5 μm. A layer and a 0.5 μm Au film are formed by electroless Au plating.
0 was produced.

On the other hand, an epoxy-based semi-cured adhesive film is laminated on one surface of a base film 21 made of a long polyimide film having a width of 48 mm and a thickness of 75 μm, and is punched with a die to form sprocket holes 26, character holes 27 and A square base film 22 was formed.

Next, the punched base film 2
1 was laminated with a copper foil having a thickness of 18 μm.

Next, a photosensitive dry film (Photec (trade name); manufactured by Hitachi Chemical Co., Ltd.) was laminated on both sides of the base film to which the copper foil was attached to form a photosensitive layer having a thickness of 40 μm.

Next, an excimer laser (beam intensity 30 m
j, frequency 500 Hz), a via hole forming hole was formed at a predetermined position on the photosensitive layer surface with the square base film to which the copper foil was bonded.

Next, by electroplating using copper sulfate plating, copper plating was performed on the via hole forming hole at a current density of 5 A / dm ² , and the photosensitive layer was peeled off with a dedicated peeling solution, and the square base was formed. External connection terminals 25 were formed on the film 22.

Next, a photosensitive resin (AZ (trade name); Hoechst) was applied to both sides of the base film on which the copper foil was bonded, and heated at 90 ° C. for 30 minutes to form a 10 μm thick photosensitive layer.

Next, a predetermined pattern is exposed and baked on the photosensitive layer, developed with a dedicated developer, washed with water and heated at 100 ° C. for 30 minutes to form a resist pattern. After the copper foil was etched using an iron solution, the resist pattern was stripped off using a dedicated stripping solution to form a wiring layer 24 and leads 23.

Next, the surface of the external connection terminal 25 is electroless S
A 3 μm thick Su film was formed by u-plating to produce a film carrier 200.

On the other hand, epoxy adhesive layers 32, 3
Square-shaped insulating substrate 31 made of BT resin with 3 formed thereon
The film carrier 200 and the multilayer printed circuit board 100 were adhered to each other via the substrate, and the film carrier 200 was fixed at a predetermined position of the multilayer printed circuit board 100. Furthermore, the connection electrodes 18 of the multilayer wiring circuit board 100 and the tips of the leads 23 of the film carrier 200 were melt-bonded by thermocompression bonding to produce the ball grid array substrate of the present invention and its continuous body.

[0031]

As described above, according to the ball grid array substrate and the continuum thereof according to the present invention, the film carrier having the external connection terminals and the multilayer wiring circuit board are manufactured in separate steps, and the integrated structure is formed in the last step. Therefore, a microfabrication process can be applied from wiring to external connection terminals, and multi-terminals, high integration, and miniaturization can be achieved. Furthermore, continuous processing from mounting of a semiconductor element to resin sealing, formation of bumps for external connection, and inspection can be realized, and manufacturing cost and time can be reduced.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view illustrating a configuration of a ball grid array substrate according to the present invention. (B) is a partial enlarged sectional view showing the configuration of the ball grid array substrate according to the present invention.

FIG. 2A is a plan view showing a configuration of a continuous film carrier used for a ball grid array substrate according to the present invention. (B) is the XX ′ of the film carrier continuum used for the ball grid array substrate according to the present invention
It is a sectional view taken along a line

FIG. 3 is a cross-sectional view showing one configuration of a conventional ball grid array substrate.

FIG. 4 is a cross-sectional view illustrating another configuration of a conventional ball grid array substrate.

[Explanation of symbols]

 11, 51 metal substrate 12, 45, 52 first insulating layer 13, 44, 53 first wiring layer 14, 47, 54 second insulating layer 15, 46, 55 second wiring Layers 16, 56 Third insulating layer 17, 48, 57 Third wiring layer 18, 58, 63 Connection electrode 21 Base film 22 Square-shaped base film 23 Lead 24 ... wiring layers 25, 43, 64 ... external connection terminals 26 ... sprocket holes 27 ... character holes 31, 61 ... square shaped insulating substrates 32, 33, 71 ... adhesive layers 41 ... insulating substrates 42 62 through-hole 100 multilayer wiring circuit board 200 film carrier

Claims (2)

[Claims] A ball grid array substrate comprising a multilayer wiring circuit formed by sequentially laminating an insulating layer and a conductor wiring layer on a metal substrate or an insulating substrate and external connection terminals,
The ball grid array substrate, wherein the external connection terminal is formed of a film carrier, and is connected to a connection electrode on an uppermost layer of the multilayer wiring circuit by a lead. 2. The ball grid according to claim 1, wherein the film carrier is formed of a film carrier continuum that can be continuously processed from mounting of a semiconductor element to resin sealing or formation of external connection bumps. Array substrate continuum.