JPH1126773A5 - - Google Patents

Info

Publication number
JPH1126773A5
JPH1126773A5 JP1997182165A JP18216597A JPH1126773A5 JP H1126773 A5 JPH1126773 A5 JP H1126773A5 JP 1997182165 A JP1997182165 A JP 1997182165A JP 18216597 A JP18216597 A JP 18216597A JP H1126773 A5 JPH1126773 A5 JP H1126773A5
Authority
JP
Japan
Prior art keywords
insulating film
bonding
manufacturing
semiconductor device
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997182165A
Other languages
English (en)
Other versions
JPH1126773A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9182165A priority Critical patent/JPH1126773A/ja
Priority claimed from JP9182165A external-priority patent/JPH1126773A/ja
Publication of JPH1126773A publication Critical patent/JPH1126773A/ja
Publication of JPH1126773A5 publication Critical patent/JPH1126773A5/ja
Withdrawn legal-status Critical Current

Links

Claims (1)

  1. 上記絶縁膜を形成する工程の後に、該絶縁膜の表面を支持基板の表面に貼り合わせる工程をさらに含むことを特徴とする請求項記載の半導体装置の製造方法。
JP9182165A 1997-07-08 1997-07-08 半導体装置及びその製造方法 Withdrawn JPH1126773A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9182165A JPH1126773A (ja) 1997-07-08 1997-07-08 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9182165A JPH1126773A (ja) 1997-07-08 1997-07-08 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPH1126773A JPH1126773A (ja) 1999-01-29
JPH1126773A5 true JPH1126773A5 (ja) 2005-03-17

Family

ID=16113496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9182165A Withdrawn JPH1126773A (ja) 1997-07-08 1997-07-08 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPH1126773A (ja)

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