JPH11310683A - Resin composition and molded product thereof having wood grain pattern - Google Patents
Resin composition and molded product thereof having wood grain patternInfo
- Publication number
- JPH11310683A JPH11310683A JP13102998A JP13102998A JPH11310683A JP H11310683 A JPH11310683 A JP H11310683A JP 13102998 A JP13102998 A JP 13102998A JP 13102998 A JP13102998 A JP 13102998A JP H11310683 A JPH11310683 A JP H11310683A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- weight
- resin
- styrene
- aromatic vinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 58
- 239000002023 wood Substances 0.000 title claims description 17
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 72
- -1 aromatic vinyl compound Chemical class 0.000 claims abstract description 40
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 37
- 239000000178 monomer Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 239000000314 lubricant Substances 0.000 claims abstract description 14
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 14
- 239000000126 substance Substances 0.000 claims abstract description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 239000000049 pigment Substances 0.000 claims abstract description 9
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 9
- 229920001971 elastomer Polymers 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 12
- 238000004898 kneading Methods 0.000 claims description 9
- 125000000524 functional group Chemical group 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 229920001038 ethylene copolymer Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 abstract description 14
- 238000002156 mixing Methods 0.000 abstract description 7
- 239000003086 colorant Substances 0.000 abstract description 2
- 235000013339 cereals Nutrition 0.000 description 25
- 229920001577 copolymer Polymers 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 239000000975 dye Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000004088 foaming agent Substances 0.000 description 7
- 239000004711 α-olefin Substances 0.000 description 7
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- 229910052751 metal Chemical class 0.000 description 6
- 239000002184 metal Chemical class 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 229920003048 styrene butadiene rubber Polymers 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 3
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- 229920001890 Novodur Polymers 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- 235000013312 flour Nutrition 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000004678 hydrides Chemical class 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 235000014692 zinc oxide Nutrition 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical class C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 241000218685 Tsuga Species 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000008360 acrylonitriles Chemical class 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 2
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical class [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000012860 organic pigment Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- DGBWPZSGHAXYGK-UHFFFAOYSA-N perinone Chemical compound C12=NC3=CC=CC=C3N2C(=O)C2=CC=C3C4=C2C1=CC=C4C(=O)N1C2=CC=CC=C2N=C13 DGBWPZSGHAXYGK-UHFFFAOYSA-N 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 2
- 229920005573 silicon-containing polymer Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 description 1
- YTLYLLTVENPWFT-UPHRSURJSA-N (Z)-3-aminoacrylic acid Chemical compound N\C=C/C(O)=O YTLYLLTVENPWFT-UPHRSURJSA-N 0.000 description 1
- KCFXNGDHQPMIAQ-UHFFFAOYSA-N 1-(4-methylphenyl)pyrrole-2,5-dione Chemical compound C1=CC(C)=CC=C1N1C(=O)C=CC1=O KCFXNGDHQPMIAQ-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- WAEOXIOXMKNFLQ-UHFFFAOYSA-N 1-methyl-4-prop-2-enylbenzene Chemical group CC1=CC=C(CC=C)C=C1 WAEOXIOXMKNFLQ-UHFFFAOYSA-N 0.000 description 1
- QDOXQIRWYQMOKT-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione;styrene Chemical compound C=CC1=CC=CC=C1.O=C1C=CC(=O)N1C1=CC=CC=C1 QDOXQIRWYQMOKT-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- CYLVUSZHVURAOY-UHFFFAOYSA-N 2,2-dibromoethenylbenzene Chemical compound BrC(Br)=CC1=CC=CC=C1 CYLVUSZHVURAOY-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- BIOCRZSYHQYVSG-UHFFFAOYSA-N 2-(4-ethenylphenyl)-n,n-diethylethanamine Chemical compound CCN(CC)CCC1=CC=C(C=C)C=C1 BIOCRZSYHQYVSG-UHFFFAOYSA-N 0.000 description 1
- WCASXYBKJHWFMY-NSCUHMNNSA-N 2-Buten-1-ol Chemical compound C\C=C\CO WCASXYBKJHWFMY-NSCUHMNNSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- YMOONIIMQBGTDU-UHFFFAOYSA-N 2-bromoethenylbenzene Chemical compound BrC=CC1=CC=CC=C1 YMOONIIMQBGTDU-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- BQBSIHIZDSHADD-UHFFFAOYSA-N 2-ethenyl-4,5-dihydro-1,3-oxazole Chemical compound C=CC1=NCCO1 BQBSIHIZDSHADD-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- KBKNKFIRGXQLDB-UHFFFAOYSA-N 2-fluoroethenylbenzene Chemical compound FC=CC1=CC=CC=C1 KBKNKFIRGXQLDB-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- BYDRTKVGBRTTIT-UHFFFAOYSA-N 2-methylprop-2-en-1-ol Chemical compound CC(=C)CO BYDRTKVGBRTTIT-UHFFFAOYSA-N 0.000 description 1
- UWRZIZXBOLBCON-UHFFFAOYSA-N 2-phenylethenamine Chemical compound NC=CC1=CC=CC=C1 UWRZIZXBOLBCON-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- SNCMCDMEYCLVBO-UHFFFAOYSA-N 3-aminopropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCN SNCMCDMEYCLVBO-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- CNGYZEMWVAWWOB-VAWYXSNFSA-N 5-[[4-anilino-6-[bis(2-hydroxyethyl)amino]-1,3,5-triazin-2-yl]amino]-2-[(e)-2-[4-[[4-anilino-6-[bis(2-hydroxyethyl)amino]-1,3,5-triazin-2-yl]amino]-2-sulfophenyl]ethenyl]benzenesulfonic acid Chemical compound N=1C(NC=2C=C(C(\C=C\C=3C(=CC(NC=4N=C(N=C(NC=5C=CC=CC=5)N=4)N(CCO)CCO)=CC=3)S(O)(=O)=O)=CC=2)S(O)(=O)=O)=NC(N(CCO)CCO)=NC=1NC1=CC=CC=C1 CNGYZEMWVAWWOB-VAWYXSNFSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 235000007173 Abies balsamea Nutrition 0.000 description 1
- 241001311472 Abies sachalinensis Species 0.000 description 1
- 240000005020 Acaciella glauca Species 0.000 description 1
- 241000609240 Ambelania acida Species 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- 241000167854 Bourreria succulenta Species 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000218645 Cedrus Species 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920012753 Ethylene Ionomers Polymers 0.000 description 1
- 240000000731 Fagus sylvatica Species 0.000 description 1
- 235000010099 Fagus sylvatica Nutrition 0.000 description 1
- MBMLMWLHJBBADN-UHFFFAOYSA-N Ferrous sulfide Chemical compound [Fe]=S MBMLMWLHJBBADN-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241000218652 Larix Species 0.000 description 1
- 235000005590 Larix decidua Nutrition 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- WEGFOMCSVVYYPC-UHFFFAOYSA-N NON.CC(=C)C(O)=O Chemical compound NON.CC(=C)C(O)=O WEGFOMCSVVYYPC-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- GWFGDXZQZYMSMJ-UHFFFAOYSA-N Octadecansaeure-heptadecylester Natural products CCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCCCC GWFGDXZQZYMSMJ-UHFFFAOYSA-N 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
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- 239000004721 Polyphenylene oxide Substances 0.000 description 1
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- 239000004743 Polypropylene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
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- 239000002174 Styrene-butadiene Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 240000007313 Tilia cordata Species 0.000 description 1
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- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
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- 239000003513 alkali Substances 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
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- XRLSGYQIHTVOMC-UHFFFAOYSA-N aminomethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCN XRLSGYQIHTVOMC-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
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- 229940121375 antifungal agent Drugs 0.000 description 1
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- 125000003118 aryl group Chemical group 0.000 description 1
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- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 235000019693 cherries Nutrition 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 244000309146 drought grass Species 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- WOLATMHLPFJRGC-UHFFFAOYSA-N furan-2,5-dione;styrene Chemical compound O=C1OC(=O)C=C1.C=CC1=CC=CC=C1 WOLATMHLPFJRGC-UHFFFAOYSA-N 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- MOUPNEIJQCETIW-UHFFFAOYSA-N lead chromate Chemical compound [Pb+2].[O-][Cr]([O-])(=O)=O MOUPNEIJQCETIW-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- XESULCZVWZVTFC-UHFFFAOYSA-N n-[(4-ethenylphenyl)methyl]-n-ethylethanamine Chemical compound CCN(CC)CC1=CC=C(C=C)C=C1 XESULCZVWZVTFC-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- NKBWPOSQERPBFI-UHFFFAOYSA-N octadecyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCCCC NKBWPOSQERPBFI-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical compound [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000003349 semicarbazides Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、木目模様の発現を
可能とする樹脂組成物およびそれを成形してなる木目模
様を有する成形品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition capable of exhibiting a wood grain pattern and a molded article having the wood grain pattern obtained by molding the same.
【0002】[0002]
【従来の技術】従来より、スチレン系樹脂は、その着色
性の良好なことから、OA・家電分野、車両分野などに
幅広く用いられている。しかしながら、用いられる分野
によっては、木目模様を施す必要があり、一般に成形
後、木目模様を施したシートを貼るなどの方法が行われ
ている。しかしながら、このような方法では、木目模様
のシートの値段が高いという問題や、シートを接着する
ための工程が必要であり、コストアップになるという問
題、さらには木目模様が単調であるという問題がある。2. Description of the Related Art Conventionally, styrene resins have been widely used in the fields of office automation (OA), home electric appliances, vehicles, etc. because of their good coloring properties. However, depending on the field in which it is used, it is necessary to apply a wood grain pattern. Generally, after molding, a method of applying a wood grained sheet or the like is performed. However, in such a method, there is a problem that the price of the wood-grained sheet is high, a process for bonding the sheets is required, the cost is increased, and further, a problem that the woodgrain pattern is monotonous. is there.
【0003】[0003]
【発明が解決しようとする課題】本発明は、上記従来技
術の課題を背景になされたもので、木目模様の発現を可
能とする樹脂組成物およびそれを成形してなる木目模様
を有する成形品を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and is directed to a resin composition capable of exhibiting a grain pattern and a molded article having the grain pattern obtained by molding the resin composition. The purpose is to provide.
【0004】[0004]
【課題を解決するための手段】本発明は、(A)ゴム質
重合体(a)の存在下または非存在下に、芳香族ビニル
化合物および必要に応じて芳香族ビニル化合物と共重合
可能な他のビニル系単量体からなる単量体成分(b)を
(共)重合して得られるスチレン系樹脂100重量部に
対して、(B)滑剤1〜12重量部を溶融混練りしてな
る樹脂組成物(I)100重量部に対し、(C)熱可塑
性樹脂65〜99重量%、ならびに(D)染料および/
または顔料35〜1重量%〔ただし、(C)+(D)=
100重量%〕を溶融混練りしてなる樹脂組成物(II)
を0.1〜30重量部ドライブレンドしてなる木目模様
の発現を可能とすることを特徴とする樹脂組成物を提供
するものである。上記樹脂組成物(I)は、(A)ゴム
質重合体(a)の存在下または非存在下に、芳香族ビニ
ル化合物および必要に応じて芳香族ビニル化合物と共重
合可能な他のビニル系単量体からなる単量体成分(b)
を(共)重合して得られるスチレン系樹脂20〜100
重量%、(E)セルロース系物質0〜80重量%、およ
び(F)無機フィラー0〜80重量%〔ただし、(A)
+(E)+(F)=100重量%〕からなる樹脂組成物
100重量部に対して、(B)滑剤1〜12重量部を溶
融混練りして得られる樹脂組成物であってもよい。ま
た、上記(B)滑剤は、長鎖アルキル基と官能基とを有
する化合物および/またはエチレン系の共重合体であっ
てもよい。本発明は、また、上記記載の樹脂組成物を成
形してなる木目模様を有する成形品を提供するものであ
る。SUMMARY OF THE INVENTION The present invention relates to a method for producing an aromatic vinyl compound and, if necessary, an aromatic vinyl compound in the presence or absence of (A) a rubbery polymer (a). (B) 1 to 12 parts by weight of a lubricant is melt-kneaded with 100 parts by weight of a styrene resin obtained by (co) polymerizing a monomer component (b) composed of another vinyl monomer. (C) 65 to 99% by weight of thermoplastic resin, and (D) dye and / or
Or 35 to 1% by weight of pigment [provided that (C) + (D) =
100% by weight] and a resin composition (II)
A dry-blend of 0.1 to 30 parts by weight to produce a wood grain pattern. The above-mentioned resin composition (I) can be obtained by preparing, in the presence or absence of (A) the rubbery polymer (a), an aromatic vinyl compound and, if necessary, another vinyl copolymer which can be copolymerized with the aromatic vinyl compound. Monomer component (b) consisting of a monomer
(Styrene) resin obtained by (co) polymerizing 20 to 100
Wt%, (E) 0-80 wt% of a cellulosic material, and (F) 0-80 wt% of an inorganic filler (provided that (A)
+ (E) + (F) = 100% by weight], and a resin composition obtained by melt-kneading (B) 1 to 12 parts by weight of a lubricant with respect to 100 parts by weight of the resin composition comprising: . Further, the lubricant (B) may be a compound having a long-chain alkyl group and a functional group and / or an ethylene-based copolymer. The present invention also provides a molded article having a grain pattern formed by molding the above-described resin composition.
【0005】[0005]
【発明の実施の形態】樹脂組成物(I) 本発明に用いられる樹脂組成物(I)は、本発明の樹脂
成形品の基材樹脂となるものである。ここで、樹脂組成
物(I)に用いられる(A)スチレン系樹脂は、ゴム質
重合体(a)の存在下または非存在下に、芳香族ビニル
化合物および必要に応じて芳香族ビニル化合物と共重合
可能な他のビニル系単量体からなる単量体成分(b)を
(共)重合して得られる。この(A)スチレン系樹脂と
しては、例えば ゴム質重合体(a)の存在下に、芳香族ビニル化合
物、または芳香族ビニル化合物および芳香族ビニル化合
物と共重合可能な他のビニル系単量体からなる単量体成
分(b)を(共)重合して得られるゴム強化スチレン系
重合体、 芳香族ビニル化合物、または芳香族ビニル化合物およ
び芳香族ビニル化合物と共重合可能な他のビニル系単量
体からなる単量体成分(b)を(共)重合して得られる
スチレン系重合体、あるいは 上記ゴム強化スチレン系重合体とスチレン系重合
体との混合物、などが挙げられ、これらは他の熱可塑性
樹脂と併用することもできる。BEST MODE FOR CARRYING OUT THE INVENTION Resin Composition (I) The resin composition (I) used in the present invention is to be a base resin of the resin molded article of the present invention. Here, the styrene resin (A) used in the resin composition (I) is mixed with an aromatic vinyl compound and optionally an aromatic vinyl compound in the presence or absence of the rubbery polymer (a). It can be obtained by (co) polymerizing a monomer component (b) composed of another copolymerizable vinyl monomer. As the styrene resin (A), for example, an aromatic vinyl compound, or another vinyl monomer copolymerizable with an aromatic vinyl compound and an aromatic vinyl compound in the presence of the rubbery polymer (a) Rubber-reinforced styrene-based polymer obtained by (co) polymerizing monomer component (b) consisting of an aromatic vinyl compound, or an aromatic vinyl compound and another vinyl monomer copolymerizable with aromatic vinyl compound. A styrene-based polymer obtained by (co) polymerizing the monomer component (b) consisting of a monomer, or a mixture of the rubber-reinforced styrene-based polymer and a styrene-based polymer. Can be used in combination with the thermoplastic resin.
【0006】ここで使用されるゴム質重合体(a)とし
ては、例えばポリブタジエン、ポリイソプレン、ブチル
ゴム、スチレン−ブタジエン共重合体(スチレン含有量
5〜60重量%が好ましい)、スチレン−イソプレン共
重合体、アクリロニトリル−ブタジエン共重合体、エチ
レン−α−オレフィン系共重合体、エチレン−α−オレ
フィン−ポリエン共重合体、シリコーンゴム、アクリル
ゴム、ブタジエン−(メタ)アクリル酸エステル共重合
体、スチレン−ブタジエンブロック共重合体、スチレン
−イソプレンブロック共重合体、水素化スチレン−ブタ
ジエンブロック共重合体、水素化ブタジエン系重合体、
エチレン系アイオノマーなどが挙げられる。Examples of the rubbery polymer (a) used herein include polybutadiene, polyisoprene, butyl rubber, styrene-butadiene copolymer (styrene content is preferably 5 to 60% by weight), and styrene-isoprene copolymer. Copolymer, acrylonitrile-butadiene copolymer, ethylene-α-olefin-based copolymer, ethylene-α-olefin-polyene copolymer, silicone rubber, acrylic rubber, butadiene- (meth) acrylate copolymer, styrene- Butadiene block copolymer, styrene-isoprene block copolymer, hydrogenated styrene-butadiene block copolymer, hydrogenated butadiene-based polymer,
Ethylene ionomers and the like can be mentioned.
【0007】なお、スチレン−ブタジエンブロック共重
合体、スチレン−イソプレンブロック共重合体には、A
B型、ABA型、テーパー型、ラジアルテレブロック型
の構造を有するものなどが含まれる。また、水素化ブタ
ジエン系重合体には、上記ブロック共重合体の水素化物
のほかに、スチレンブロックとスチレン−ブタジエンラ
ンダム共重合体のブロック体の水素化物、ポリブタジエ
ン中の1,2−ビニル結合含量が20重量%以下のブロ
ックと1,2−ビニル結合含量が20重量%を超えるポ
リブタジエンブロックからなる重合体の水素化物などが
挙げられる。The styrene-butadiene block copolymer and the styrene-isoprene block copolymer include A
B-type, ABA-type, taper-type, and those having a radial teleblock-type structure are included. The hydrogenated butadiene-based polymer includes, in addition to the hydride of the above block copolymer, a hydride of a block of a styrene block and a styrene-butadiene random copolymer, and a 1,2-vinyl bond content in polybutadiene. Hydride of a polymer comprising a block having a polybutadiene block content of not more than 20% by weight and a 1,2-vinyl bond content of more than 20% by weight.
【0008】また、エチレン−α−オレフィン系共重合
体におけるエチレンとα−オレフィンの重量比は、95
/5〜5/95、好ましくは95/5〜20/80、さ
らに好ましくは92/8〜60/40である。エチレン
−α−オレフィン系共重合体のムーニー粘度(M
L1+4 ,100℃)は、耐衝撃性の面から5〜200、
好ましくは5〜100、さらに好ましくは5〜50であ
る。ここで使用されるα−オレフィンは、炭素数3〜2
0個を有する不飽和炭化水素化合物であり、具体的に
は、プロピレン、ブテン−1、ペンテン−1、ヘキセン
−1、ヘプテン−1、4−メチルブテン−1、4−メチ
ルペンテン−1などが挙げられる。[0008] The weight ratio of ethylene to α-olefin in the ethylene-α-olefin copolymer is 95%.
/ 5 to 5/95, preferably 95/5 to 20/80, and more preferably 92/8 to 60/40. Mooney viscosity of ethylene-α-olefin copolymer (M
L 1 + 4 , 100 ° C.) is 5 to 200 from the viewpoint of impact resistance.
Preferably it is 5-100, more preferably 5-50. The α-olefin used here has 3 to 2 carbon atoms.
0 unsaturated hydrocarbon compounds, specifically, propylene, butene-1, pentene-1, hexene-1, heptene-1, 4-methylbutene-1, 4-methylpentene-1 and the like. Can be
【0009】さらに、エチレン−α−オレフィン−ポリ
エン共重合体中の不飽和基は、ヨウ素価に換算して4〜
40の範囲が好ましい。用いられるポリエンの種類は、
アルケニルノルボルネン類、環状ジエン類、脂肪族ジエ
ン類などであり、好ましくは5−エチリデン−2−ノル
ボルネン、ジシクロペンタジエンなどが挙げられる。以
上のゴム質重合体(a)は、1種単独で使用すること
も、あるいは2種以上を混合して用いることもできる。Further, the unsaturated group in the ethylene-α-olefin-polyene copolymer is from 4 to 4 in terms of iodine value.
A range of 40 is preferred. The type of polyene used is
Examples thereof include alkenyl norbornenes, cyclic dienes, and aliphatic dienes, and preferably include 5-ethylidene-2-norbornene, dicyclopentadiene, and the like. The above rubbery polymers (a) can be used alone or in combination of two or more.
【0010】なお、(A)スチレン系樹脂としては、耐
衝撃性の面から、上記ゴム質重合体の存在下に得られる
ゴム強化スチレン系重合体、またはゴム質重合体の存在
下に得られるゴム強化スチレン系重合体とゴム質重合体
の非存在下に芳香族ビニル化合物(および共重合可能な
他のビニル系単量体)を(共)重合して得られるスチレ
ン系重合体との混合物を使用することが好ましい。The styrene resin (A) is obtained in the presence of a rubber-reinforced styrene-based polymer or a rubbery polymer obtained in the presence of the above-mentioned rubbery polymer in terms of impact resistance. A mixture of a rubber-reinforced styrene polymer and a styrene polymer obtained by (co) polymerizing an aromatic vinyl compound (and other copolymerizable vinyl monomers) in the absence of a rubbery polymer It is preferred to use
【0011】ここで、(A)スチレン系樹脂中のゴム質
重合体(a)の割合は、ゴム質重合体(a)および単量
体成分(b)の合計量に対し、好ましくは3〜80重量
%、さらに好ましくは5〜60重量%であり、3重量%
未満では、衝撃強度が低下し好ましくなく、一方、80
重量%を超えると、成形加工性、弾性率、熱変形温度が
低下し好ましくない。また、本発明の樹脂組成物(I)
中のゴム質重合体(a)の含有量は、好ましくは1〜3
0重量%、さらに好ましくは3〜25重量%である。The ratio of the rubbery polymer (a) in the styrene resin (A) is preferably 3 to 3 times the total amount of the rubbery polymer (a) and the monomer component (b). 80% by weight, more preferably 5 to 60% by weight, 3% by weight
If it is less than 80, the impact strength is undesirably reduced.
If the amount is more than the weight percentage, the moldability, elastic modulus and heat deformation temperature are undesirably lowered. Further, the resin composition (I) of the present invention
The content of the rubbery polymer (a) therein is preferably from 1 to 3.
0% by weight, more preferably 3 to 25% by weight.
【0012】一方、(A)スチレン系樹脂に用いられる
単量体成分(b)を構成する芳香族ビニル化合物として
は、スチレン、t−ブチルスチレン、α−メチルスチレ
ン、p−メチルスチレン、ジビニルベンゼン、1,1−
ジフェニルスチレン、N,N−ジエチル−p−アミノメ
チルスチレン、N,N−ジエチル−p−アミノエチルス
チレン、ビニルピリジン、ビニルキシレン、モノクロル
スチレン、ジクロロスチレン、モノブロモスチレン、ジ
ブロモスチレン、フルオロスチレン、エチルスチレン、
ビニルナフタレンなどが挙げられ、特にスチレン、α−
メチルスチレンが好ましい。これらの芳香族ビニル化合
物は、1種単独で使用することも、あるいは2種以上を
混合して用いることもできる。芳香族ビニル化合物の使
用量は、単量体成分中に、好ましくは20〜100重量
%、さらに好ましくは30〜90重量%、特に好ましく
は40〜80重量%である。20重量%未満では、充分
な成形加工性が得られない。On the other hand, (A) the aromatic vinyl compound constituting the monomer component (b) used in the styrene resin includes styrene, t-butylstyrene, α-methylstyrene, p-methylstyrene, divinylbenzene. , 1,1-
Diphenylstyrene, N, N-diethyl-p-aminomethylstyrene, N, N-diethyl-p-aminoethylstyrene, vinylpyridine, vinylxylene, monochlorostyrene, dichlorostyrene, monobromostyrene, dibromostyrene, fluorostyrene, ethyl styrene,
Vinyl naphthalene and the like, particularly styrene, α-
Methylstyrene is preferred. These aromatic vinyl compounds can be used alone or in combination of two or more. The amount of the aromatic vinyl compound used is preferably 20 to 100% by weight, more preferably 30 to 90% by weight, and particularly preferably 40 to 80% by weight in the monomer component. If it is less than 20% by weight, sufficient moldability cannot be obtained.
【0013】また、他のビニル系単量体としては、アク
リロニトリル、メタクリロニトリルなどのシアン化ビニ
ル化合物;メチルアクリレート、エチルアクリレート、
プロピルアクリレート、ブチルアクリレート、アミノア
クリレート、ヘキシルアクリレート、オクチルアクリレ
ート、2−エチルヘキシルアクリレート、シクロヘキシ
ルアクリレート、ドデシルアクリレート、オクタデシル
アクリレート、フェニルアクリレート、ベンジルアクリ
レートなどのアクリル酸アルキルエステル;メチルメタ
クリレート、エチルメタクリレート、プロピルメタクリ
レート、ブチルメタクリレート、アミノメタクリレー
ト、ヘキシルメタクリレート、オクチルメタクリレー
ト、2−エチルヘキシルメタクリレート、シクロヘキシ
ルメタクリレート、ドデシルメタクリレート、オクタデ
シルメタクリレート、フェニルメタクリレート、ベンジ
ルメタクリレートなどのメタクリル酸アルキルエステ
ル;無水マレイン酸、無水イタコン酸、無水シトラコン
酸などの不飽和酸無水物;アクリル酸、メタクリル酸、
マレイン酸などの不飽和酸;マレイミド、N−メチルマ
レイミド、N−エチルマレイミド、N−プロピルマレイ
ミド、N−ブチルマレイミド、N−(p−メチルフェニ
ル)マレイミド、N−フェニルマレイミド、N−シクロ
ヘキシルマレイミドなどのα,β−不飽和ジカルボン酸
のイミド化合物;グリシジルメタクリレート、アリルグ
リシジルエーテルなどのエポキシ基含有不飽和化合物;
アクリルアミド、メタクリルアミドなどの不飽和カルボ
ン酸アミド;アクリルアミン、メタクリル酸アミノメチ
ル、メタクリル酸アミノエーテル、メタクリル酸アミノ
プロピル、アミノスチレンなどのアミノ基含有不飽和化
合物;3−ヒドロキシ−1−プロペン、4−ヒドロキシ
−1−ブテン、シス−4−ヒドロキシ−2−ブテン、ト
ランス−4−ヒドロキシ−2−ブテン、3−ヒドロキシ
−2−メチル−1−プロペン、2−ヒドロキシエチルア
クリレート、2−ヒドロキシエチルメタクリレート、ヒ
ドロキシスチレンなどの水酸基含有不飽和化合物;ビニ
ルオキサゾリンなどのオキサゾリン基含有不飽和化合物
などが挙げられる。Further, other vinyl monomers include vinyl cyanide compounds such as acrylonitrile and methacrylonitrile; methyl acrylate, ethyl acrylate, and the like.
Alkyl acrylates such as propyl acrylate, butyl acrylate, amino acrylate, hexyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate, dodecyl acrylate, octadecyl acrylate, phenyl acrylate, and benzyl acrylate; methyl methacrylate, ethyl methacrylate, propyl methacrylate; Alkyl methacrylates such as butyl methacrylate, amino methacrylate, hexyl methacrylate, octyl methacrylate, 2-ethylhexyl methacrylate, cyclohexyl methacrylate, dodecyl methacrylate, octadecyl methacrylate, phenyl methacrylate and benzyl methacrylate; Itaconic acid, unsaturated acid anhydrides such as citraconic anhydride, acrylic acid, methacrylic acid,
Unsaturated acids such as maleic acid; maleimide, N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, N-butylmaleimide, N- (p-methylphenyl) maleimide, N-phenylmaleimide, N-cyclohexylmaleimide, etc. An imide compound of an α, β-unsaturated dicarboxylic acid; an epoxy group-containing unsaturated compound such as glycidyl methacrylate or allyl glycidyl ether;
Unsaturated carboxylic acid amides such as acrylamide and methacrylamide; unsaturated compounds containing an amino group such as acrylamine, aminomethyl methacrylate, aminoether methacrylate, aminopropyl methacrylate and aminostyrene; 3-hydroxy-1-propene; -Hydroxy-1-butene, cis-4-hydroxy-2-butene, trans-4-hydroxy-2-butene, 3-hydroxy-2-methyl-1-propene, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate And oxazoline group-containing unsaturated compounds such as vinyl oxazoline.
【0014】上記他のビニル系単量体のなかで、特に好
ましくは、シアン化ビニル化合物、(メタ)アクリル酸
アルキルエステル、不飽和酸無水物、不飽和酸、α,β
−不飽和ジカルボン酸のイミド化物、エポキシ基含有不
飽和化合物、および水酸基含有不飽和化合物の群から選
ばれた少なくとも1種のビニル系単量体である。好まし
い他のビニル系単量体の具体例としては、アクリロニト
リル、メタクリル酸、メチルメタクリレート、ブチルア
クリレート、無水マレイン酸、N−フェニルマレイミ
ド、グリシジルメタクリレート、2−ヒドロキシエチル
メタクリレートなどである。Among the other vinyl monomers, particularly preferred are vinyl cyanide compounds, alkyl (meth) acrylates, unsaturated acid anhydrides, unsaturated acids, α, β
-At least one vinyl monomer selected from the group consisting of imidized unsaturated dicarboxylic acids, unsaturated compounds containing epoxy groups, and unsaturated compounds containing hydroxyl groups. Specific examples of preferred other vinyl monomers include acrylonitrile, methacrylic acid, methyl methacrylate, butyl acrylate, maleic anhydride, N-phenylmaleimide, glycidyl methacrylate, 2-hydroxyethyl methacrylate, and the like.
【0015】(A)スチレン系樹脂を構成する単量体成
分(b)の好ましい組み合わせは、次の〜である。 スチレン/アクリロニトリル スチレン/メチルメタクリレート スチレン/N−フェニルマレイミド スチレン/N−フェニルマレイミド/無水マレイン酸 スチレン/アクリロニトリル/水酸基含有不飽和化合
物 スチレン/アクリロニトリル/不飽和酸 スチレン/アクリロニトリル/エポキシ基含有不飽和
化合物 スチレン/アクリロニトリル/オキサゾリン基含有不
飽和化合物Preferred combinations of (A) the monomer component (b) constituting the styrenic resin are as follows. Styrene / acrylonitrile styrene / methyl methacrylate styrene / N-phenylmaleimide styrene / N-phenylmaleimide / maleic anhydride styrene / acrylonitrile / hydroxyl group-containing unsaturated compound styrene / acrylonitrile / unsaturated acid styrene / acrylonitrile / epoxy group-containing unsaturated compound styrene / Acrylonitrile / Oxazoline group-containing unsaturated compound
【0016】なお、上記α,β−不飽和ジカルボン酸の
イミド化合物において、上記芳香族ビニル化合物と上記
不飽和酸無水物との共重合体を、後イミド化(完全また
は部分)したものも、本発明の(A)成分を構成する単
量体成分に含まれる。また、上記他のビニル系単量体の
量は、単量体成分中に、好ましくは80重量%以下、さ
らに好ましくは70〜10重量%、特に好ましくは60
〜20重量%である。以上の他のビニル系単量体は、1
種単独で使用することも、あるいは2種以上を混合して
用いることもできる。In the above-mentioned imide compounds of α, β-unsaturated dicarboxylic acids, those obtained by post-imidization (completely or partially) of a copolymer of the above-mentioned aromatic vinyl compound and the above-mentioned unsaturated acid anhydride may also be used. It is included in the monomer component constituting the component (A) of the present invention. The amount of the other vinyl monomer is preferably 80% by weight or less, more preferably 70 to 10% by weight, and particularly preferably 60% by weight in the monomer component.
-20% by weight. The other vinyl monomers described above include 1
Species can be used alone or in combination of two or more.
【0017】なお、本発明の(A)スチレン系樹脂に
は、上記したように、他の熱可塑性樹脂、例えば下記
(C)成分と同様の樹脂を、(A)成分の好ましくは8
0重量%以下、さらに好ましくは70重量%以下、特に
好ましくは50重量%以下の割合で配合したものも、本
発明の(A)成分に含まれる。また、必要に応じて、各
種充填剤を配合することもできる。As described above, the styrene resin (A) of the present invention includes, as described above, another thermoplastic resin, for example, the same resin as the following component (C), and preferably contains
Components blended in an amount of 0% by weight or less, more preferably 70% by weight or less, and particularly preferably 50% by weight or less are also included in the component (A) of the present invention. Further, various fillers can be blended as required.
【0018】上記樹脂組成物(I)には、(B)滑剤が
配合される。上記(B)滑剤としては、公知の滑剤を使
用することができる。具体的には、長鎖のアルキル基と
官能基とを有する化合物、エチレン、プロピレンなどの
α−オレフィン(共)重合体、ジメチルポリシロキサン
などのシリコン含有重合体、α−オレフィンと官能基含
有不飽和化合物との共重合体、エチレン系共重合体、プ
ロピレン系共重合体、エチレン−プロピレン共重合体、
シリコン含有重合体などの重合体に官能基含有不飽和化
合物を付加した重合体、ポリエチレン、ポリプロピレ
ン、エチレン−プロピレン共重合体などを酸化し、カル
ボキシル基などを付加する方法によって得られる重合体
などが挙げられる。The resin composition (I) contains (B) a lubricant. As the lubricant (B), a known lubricant can be used. Specifically, compounds having a long-chain alkyl group and a functional group, α-olefin (co) polymers such as ethylene and propylene, silicon-containing polymers such as dimethylpolysiloxane, and α-olefins and Copolymer with a saturated compound, ethylene-based copolymer, propylene-based copolymer, ethylene-propylene copolymer,
Polymers obtained by adding a functional group-containing unsaturated compound to a polymer such as a silicon-containing polymer, or a polymer obtained by oxidizing a polyethylene, polypropylene, ethylene-propylene copolymer or the like and adding a carboxyl group or the like. No.
【0019】ここで、上記官能基としては、カルボキシ
ル基またはその金属塩、水酸基、オキサゾリン基、酸無
水物基、エステル基、アミノ基、アミド基、エポキシ
基、イソシアネート基、ウレタン基、ユリア基などが挙
げられる。好ましい官能基としては、カルボキシル基ま
たはその2価の金属塩、エステル基、アミド基である。
カルボキシル基の塩としては、ナトリウム、カリウム、
リチウム、カルシウム、マグネシウム、アルミニウム、
亜鉛、バリウム、カドミウム、マンガン、コバルト、
鉛、スズなどの金属塩が挙げられる。上記官能基含有不
飽和化合物としては、上記したものがすべて使用され
る。好ましくは、長鎖のアルキル基と官能基とを有する
化合物、エチレン系共重合体である。Here, the functional group includes a carboxyl group or a metal salt thereof, a hydroxyl group, an oxazoline group, an acid anhydride group, an ester group, an amino group, an amide group, an epoxy group, an isocyanate group, a urethane group, a urea group and the like. Is mentioned. Preferred functional groups are a carboxyl group or a divalent metal salt thereof, an ester group, and an amide group.
As the salt of the carboxyl group, sodium, potassium,
Lithium, calcium, magnesium, aluminum,
Zinc, barium, cadmium, manganese, cobalt,
Metal salts such as lead and tin are exemplified. As the functional group-containing unsaturated compound, all those described above are used. Preferred are compounds having a long-chain alkyl group and a functional group, and ethylene-based copolymers.
【0020】樹脂組成物(I)における(B)滑剤の使
用量は、上記(A)スチレン系樹脂100重量部に対
し、1〜12重量部、好ましくは2〜8重量部である。
1重量部未満では、鮮明な木目模様が得られず、一方、
12重量部を超えると、溶融混練り時にサージングを生
じ混練りできない。The amount of the lubricant (B) used in the resin composition (I) is 1 to 12 parts by weight, preferably 2 to 8 parts by weight, based on 100 parts by weight of the styrene resin (A).
If the amount is less than 1 part by weight, a clear grain pattern cannot be obtained, while
If it exceeds 12 parts by weight, surging occurs during melt-kneading, and kneading cannot be performed.
【0021】次に、本発明の樹脂組成物(I)には、必
要に応じて(E)セルロース系物質や(F)無機フィラ
ーを配合することができる。(E)セルロース系物質と
しては、木粉、紙、パルプ、モミガラ、バガスなどの植
物性物質、またはこれらの粉砕品が挙げられる。(E)
セルロース系物質の形状としては、粉末や繊維状など、
すべての形状が含まれる。このうち、木粉としては、種
々の種類が限定せずに使用でき、例えばエゾマツ、トド
マツ、カラマツなどのマツ類、ツガ、サクラ、スギ、ナ
ラ、ヒノキ、シナノキ、ブナ、ラワン、モミなどが挙げ
られる。これらの原木を裁断し、製材する際に発生する
ノコくずやオガクズおよび木材の細片などを粉砕したも
のが使用される。また、例えば竹草などの粉砕物、粉末
および紙、パルプ、モミガラなどの粉末も含まれる。さ
らに、これらセルロース系物質の脱リグニン品アルカリ
処理品、脱脂品も使用することができる。(E)セルロ
ース系物質は、粉砕品で使用することが好ましく、より
好ましくは100メッシュパス以下の粉末にしたもので
ある。これらの(E)セルロース系物質は、1種単独で
使用することも、あるいは2種以上を混合して用いるこ
ともできる。Next, the resin composition (I) of the present invention may optionally contain (E) a cellulosic substance or (F) an inorganic filler. (E) Examples of the cellulosic substances include plant substances such as wood flour, paper, pulp, firgrass, and bagasse, and crushed products thereof. (E)
The shape of the cellulosic material, such as powder or fibrous,
All shapes are included. Among them, as the wood flour, various types can be used without limitation, for example, pine, such as Scots pine, Abies sachalinensis, larch, hemlock, cherry, cedar, oak, hinoki, linden, beech, lauan, fir, etc. Can be Saw chips, sawdust, and small pieces of wood, which are generated when the raw wood is cut and sawn, are used. Also, for example, pulverized materials such as bamboo grass, powders, and powders such as paper, pulp, and firgrass are included. Further, a delignified product of these cellulosic substances, an alkali-treated product, and a defatted product can also be used. (E) The cellulosic material is preferably used in the form of a pulverized product, more preferably a powder of 100 mesh pass or less. These (E) cellulosic substances can be used alone or in combination of two or more.
【0022】(F)無機フィラーとしては、ガラス繊
維、炭素繊維、金属繊維、ガラスビーズ、ワラストナイ
ト、ガラスのミルドファイバー、ロックフィラー、炭酸
カルシウム、タルク、マイカ、カオリン、硫酸バリウ
ム、黒鉛、二硫化モリブデン、酸化マグネシウム、酸化
亜鉛ウィスカー、チタン酸カリウムウィスカー、ガラス
バルーン、セラミックバルーンなどが挙げられ、好まし
くは炭酸カルシウム、タルク、カオリン、チタン酸カリ
ウムウィスカーである。これらの無機フィラーのうち、
ガラス繊維、炭素繊維の形状としては、6〜60μmの
繊維径と30μm以上の繊維長を有するものが好まし
い。これらの(F)無機フィラーは、1種単独で、ある
いは2種以上を併用することができる。(F) As the inorganic filler, glass fiber, carbon fiber, metal fiber, glass bead, wollastonite, milled fiber of glass, rock filler, calcium carbonate, talc, mica, kaolin, barium sulfate, graphite, Examples include molybdenum sulfide, magnesium oxide, zinc oxide whiskers, potassium titanate whiskers, glass balloons, ceramic balloons, and the like, and preferably calcium carbonate, talc, kaolin, and potassium titanate whiskers. Of these inorganic fillers,
As the shape of the glass fiber and the carbon fiber, those having a fiber diameter of 6 to 60 μm and a fiber length of 30 μm or more are preferable. These (F) inorganic fillers can be used alone or in combination of two or more.
【0023】本発明の樹脂組成物(I)に、(E)セル
ロース系物質および(F)無機フィラーを配合した場
合、(A)+(E)+(F)=100重量%として、
(E)成分の使用量は0〜80重量%、好ましくは0〜
60重量%、さらに好ましくは0〜40重量%である。
その使用量が80重量%を超えると、材料強度が劣り好
ましくない。(F)成分の使用量は、0〜80重量%、
好ましくは0〜60重量%、さらに好ましくは0〜40
重量%である。その使用量が80重量%を超えると、成
形品の材料強度が劣る。When the resin composition (I) of the present invention contains (E) a cellulosic substance and (F) an inorganic filler, (A) + (E) + (F) = 100% by weight,
Component (E) is used in an amount of 0 to 80% by weight, preferably 0 to 80% by weight.
It is 60% by weight, more preferably 0 to 40% by weight.
If the amount used exceeds 80% by weight, the material strength is inferior and is not preferred. Component (F) is used in an amount of 0 to 80% by weight,
It is preferably 0 to 60% by weight, more preferably 0 to 40% by weight.
% By weight. If the amount used exceeds 80% by weight, the material strength of the molded product is inferior.
【0024】樹脂組成物(II) 本発明の樹脂組成物(II) は、(C)熱可塑性樹脂、な
らびに(D)染料および/または顔料を溶融混合して得
られる組成物である。このうち、樹脂組成物(II) を構
成する(C)成分の熱可塑性樹脂としては公知の熱可塑
性樹脂がすべて使用でき、上記(A)成分のスチレン系
樹脂も使用できる。具体的には、上記(A)成分のスチ
レン系樹脂、ポリエチレン、ポリプロピレン、ポリブテ
ン−1などのポリオレフィン系樹脂、ナイロン6,6、
ナイロン6、ナイロン11、ナイロン12、ナイロン
4,6などのポリアミド、ポリブチレンテレフタレー
ト、ポリエチレンテレフタレートなどのポリエステル、
全芳香族ポリエステル、ポリカーボネート樹脂、ポリオ
キシメチレンなどのポリエーテル樹脂、ポリフェニレン
スルフィド、ポリアミドエラストマーなどが挙げられ、
これらは、1種単独で、あるいは2種以上を併用するこ
とができる。特に好ましい樹脂としては、スチレン系樹
脂、ポリアミド、ポリエステル、ポリカーボネート樹脂
である。樹脂組成物(II) 中の(C)熱可塑性樹脂の使
用量は、65〜99重量%、好ましくは70〜98重量
%、さらに好ましくは75〜97重量%である。(C)
成分の使用量が、本発明の範囲外では、鮮明な木目模様
が得られない。 Resin Composition (II) The resin composition (II) of the present invention is a composition obtained by melt-mixing (C) a thermoplastic resin and (D) a dye and / or a pigment. Among them, as the thermoplastic resin of the component (C) constituting the resin composition (II), all known thermoplastic resins can be used, and the styrene resin of the component (A) can also be used. Specifically, the styrene resin as the component (A), a polyolefin resin such as polyethylene, polypropylene, and polybutene-1, nylon 6,6,
Polyamides such as nylon 6, nylon 11, nylon 12, and nylon 4, 6, polyesters such as polybutylene terephthalate and polyethylene terephthalate;
Wholly aromatic polyester, polycarbonate resin, polyether resin such as polyoxymethylene, polyphenylene sulfide, polyamide elastomer and the like,
These can be used alone or in combination of two or more. Particularly preferred resins are styrene resins, polyamides, polyesters, and polycarbonate resins. The amount of the thermoplastic resin (C) used in the resin composition (II) is 65 to 99% by weight, preferably 70 to 98% by weight, and more preferably 75 to 97% by weight. (C)
When the amount of the component is out of the range of the present invention, a clear grain pattern cannot be obtained.
【0025】また、樹脂組成物(II) には、(D)染料
および/または顔料が配合される。(D)染料および/
または顔料としては、樹脂の着色に用いられる公知の染
料、有機顔料、無機顔料が挙げられ、これらは、1種単
独で、あるいは2種以上を併用することができる。この
うち、染料としては、複素環系、アンスラキノン系、ア
ゾ系、ペリノン系、ローダミンレーキなどの塩素性染料
系レーキなどが挙げられる。有機顔料としては、ペリノ
ン系、蛍光増白剤、フタロシアニン系、キナクリドン
系、パーマネントレッド、レーキレッド、ファーストイ
エローなどのアゾ系、ニトロソ系、ニトロ系などが挙げ
られる。これらの中では、アゾ系やフタロシアニン系な
どが好ましく使用できる。無機顔料としては、亜鉛華、
チタンイエローなどの酸化亜鉛、チタン白などの酸化チ
タン系、焼成系、群青系、コバルトブルー系、ベンガラ
などの酸化鉄系、カーボンブラック系、硫化鉄、硫化カ
ドミウムなどの硫化物系、クロム酸鉛、クロム酸亜鉛な
どのクロム酸塩系、炭酸塩系、金属粉系などが挙げられ
る。これらの中では、酸化鉄系、カーボンブラック系、
群青系などが好ましく使用できる。The resin composition (II) contains (D) a dye and / or a pigment. (D) a dye and / or
Examples of the pigment include known dyes, organic pigments, and inorganic pigments used for coloring a resin. These may be used alone or in combination of two or more. Among them, examples of the dye include chlorinated dye lakes such as heterocyclic, anthraquinone, azo, perinone and rhodamine lakes. Examples of the organic pigment include perinone type, fluorescent brightener, phthalocyanine type, quinacridone type, azo type such as permanent red, lake red, first yellow, nitroso type, nitro type and the like. Of these, azo-based and phthalocyanine-based are preferably used. As inorganic pigments, zinc white,
Zinc oxide such as titanium yellow, titanium oxide such as titanium white, calcined, ultramarine, cobalt blue, iron oxide such as red iron, carbon black, sulfide such as iron sulfide and cadmium sulfide, and lead chromate And chromate such as zinc chromate, carbonate, metal powder and the like. Among these, iron oxide, carbon black,
Ultramarine blue can be preferably used.
【0026】樹脂組成物(II) 中の(D)成分の使用量
は、35〜1重量%、好ましくは30〜2重量%、さら
に好ましくは25〜3重量%である。(D)成分の使用
量が、本発明の範囲外では、鮮明な木目模様が得られな
い。なお、樹脂組成物(II) は、1種単独で、あるいは
2種以上を併用することができる。2種以上を併用する
ことにより、複雑な木目模様が得られる。The amount of the component (D) used in the resin composition (II) is 35 to 1% by weight, preferably 30 to 2% by weight, and more preferably 25 to 3% by weight. If the amount of the component (D) is out of the range of the present invention, a clear grain pattern cannot be obtained. The resin composition (II) may be used alone or in combination of two or more. By using two or more kinds, a complicated grain pattern can be obtained.
【0027】本発明の樹脂組成物は、上記(A)スチレ
ン系樹脂および(B)滑剤〔さらには、(E)セルロー
ス系物質および/または(F)無機フィラー〕を主成分
とする樹脂組成物(I)と、上記(C)熱可塑性樹脂な
らびに(D)染料および/または顔料を主成分とする樹
脂組成物(II) とを、ドライブレンドすることにより得
られる。ドライブレンドすることにより、成形したとき
に鮮明な木目模様が得られる。樹脂組成物(I)と樹脂
組成物(II) の配合割合は、樹脂組成物(I)100重
量部に対し、樹脂組成物(II) が0.1〜30重量部、
好ましくは0.2〜20重量部、さらに好ましくは0.
5〜15重量部である。この範囲外では、鮮明な木目模
様が得られない。The resin composition of the present invention comprises a resin composition comprising (A) a styrenic resin and (B) a lubricant (further, (E) a cellulosic substance and / or (F) an inorganic filler). It is obtained by dry-blending (I) and the above-mentioned (C) thermoplastic resin and (D) a resin composition (II) containing a dye and / or a pigment as a main component. By dry blending, a clear grain pattern can be obtained when molded. The mixing ratio of the resin composition (I) and the resin composition (II) is such that the resin composition (II) is 0.1 to 30 parts by weight with respect to 100 parts by weight of the resin composition (I).
Preferably 0.2 to 20 parts by weight, more preferably 0.1 to 0.2 parts by weight.
5 to 15 parts by weight. Outside this range, a clear grain pattern cannot be obtained.
【0028】なお、上記樹脂組成物(I)および(II)
には、公知のカップリング剤、抗菌剤、防カビ剤、難燃
剤、難燃助剤、酸化防止剤、耐候(耐光)剤、可塑剤、
シリコーンオイル、ミネラルオイル、および他の各種伸
展油、界面活性剤、着色剤(顔料、染料など)、滑剤、
金属粉、帯電防止剤、加工助剤などの添加剤を配合する
ことができる。これら添加剤は、混練り時に配合しても
よく、また外部添加することもできる。また、これらの
各種添加剤を高濃度に配合したマスターバッチを添加す
ることもできる。The above resin compositions (I) and (II)
Include known coupling agents, antibacterial agents, antifungal agents, flame retardants, flame retardant aids, antioxidants, weather (light) resistant, plasticizers,
Silicone oils, mineral oils and various other extending oils, surfactants, colorants (pigments, dyes, etc.), lubricants,
Additives such as a metal powder, an antistatic agent and a processing aid can be blended. These additives may be added at the time of kneading, or may be added externally. Further, a master batch in which these various additives are blended at a high concentration can be added.
【0029】さらに、本発明の樹脂組成物は、発泡成形
によって成形しても同様の効果が得られる。この場合、
使用される発泡剤および発泡方法については、公知の方
法で行うことができる。発泡剤としては、物理発泡剤ま
たは化学発泡剤が使用できる。物理発泡剤としては、空
気、炭酸ガス、窒素ガスなどの無機系、ブタン、ペンタ
ン、ヘキサン、フロンなどの有機系が使用できる。ま
た、化学発泡剤としては、重炭酸ナトリウム+酸、重炭
酸塩、炭酸塩などの無機系があり、有機系としては、イ
ソシアネート化合物、アゾ化合物、ヒドラジン誘導体、
セミカルバジド化合物、アジド化合物、ニトロソ化合
物、トリアゾール化合物などがある。また、これらの発
泡剤を高濃度に配合したマスターバッチを使用すること
ができる。これらの発泡剤は、樹脂組成物(I)および
/または(II) に添加することができる。また、ドライ
ブレンドにより、添加することもできる。Further, the same effect can be obtained by molding the resin composition of the present invention by foam molding. in this case,
The known foaming agent and foaming method can be used. As the foaming agent, a physical foaming agent or a chemical foaming agent can be used. As the physical foaming agent, inorganic materials such as air, carbon dioxide gas, and nitrogen gas, and organic materials such as butane, pentane, hexane, and chlorofluorocarbon can be used. Examples of the chemical foaming agent include inorganic systems such as sodium bicarbonate + acid, bicarbonate, and carbonate, and examples of the organic system include isocyanate compounds, azo compounds, and hydrazine derivatives.
There are semicarbazide compounds, azide compounds, nitroso compounds, triazole compounds and the like. Further, a masterbatch in which these foaming agents are blended at a high concentration can be used. These blowing agents can be added to the resin composition (I) and / or (II). Also, it can be added by dry blending.
【0030】本発明における樹脂組成物(I)および
(II) は、各種押し出し機、バンバリーミキサー、ニー
ダー、ロールなどを用い、各成分を混練りすることによ
って得られる。好ましい製造方法は、押し出し機を用い
る方法である。また、各成分を混練りするに際しては、
各成分を一括混練りしてもよく、多段階添加方式で混練
りしてもよい。The resin compositions (I) and (II) of the present invention can be obtained by kneading the components using various extruders, Banbury mixers, kneaders, rolls and the like. A preferred production method is a method using an extruder. Also, when kneading each component,
The components may be kneaded at once, or may be kneaded by a multi-stage addition method.
【0031】本発明の樹脂成形品は、上記樹脂組成物
を、異形押し出し成形、射出成形、シート押し出し成
形、真空成形、プレス成形、ブロー成形、インジェクシ
ョンプレス、ガスアシスト成形などの成形法によって成
形されて得られる。なお、色相の組み合わせによって
は、木目模様のみならず、大理石模様などの成形品を得
ることできる。上記成形法によって得られる本発明の樹
脂成形品は、その優れた性質を利用して、OA・家電分
野、車両・船舶分野、家具・建材分野などの住宅関連分
野、サニタリー分野、玩具・スポーツ用品分野、そのほ
か雑貨などの幅広い分野に使用することができる。The resin molded product of the present invention is obtained by molding the above resin composition by a molding method such as irregular extrusion molding, injection molding, sheet extrusion molding, vacuum molding, press molding, blow molding, injection press, gas assist molding and the like. Obtained. Depending on the combination of hues, it is possible to obtain a molded product having a marble pattern as well as a wood grain pattern. The resin molded product of the present invention obtained by the above-mentioned molding method, utilizing its excellent properties, is used in housing-related fields such as OA / home appliances field, vehicle / ship field, furniture / building material field, sanitary field, toys / sports goods. It can be used in a wide range of fields such as fields and miscellaneous goods.
【0032】[0032]
【実施例】以下、実施例および比較例を挙げて本発明を
さらに説明するが、本発明はその要旨を越えない限り、
以下の実施例に限定されるものではない。なお、実施例
および比較例中の部および%は、特に断らない限り重量
基準である。また、実施例および比較例中の各種評価
は、次のようにして測定した値である。EXAMPLES Hereinafter, the present invention will be further described with reference to Examples and Comparative Examples.
The present invention is not limited to the following embodiments. Parts and% in Examples and Comparative Examples are based on weight unless otherwise specified. Various evaluations in Examples and Comparative Examples are values measured as follows.
【0033】平均粒径 大塚電子(株)製、レーザー粒径解析システムLPA−
3100を用いて、平均粒径を測定した。材料強度 押し出し成形により、2×0.5×10cmの平板を成
形し、試験片として、曲げ試験を行い、破断までの破壊
エネルギーを測定した。 試験速度;15mm/min成形品表面外観 押し出し成形で平板を成形し、試験片とした。得られた
試験片の表面の木目模様を下記評価基準で目視判定し
た。 ○;鮮やかな木目模様 ×;不良 Average particle size Laser size analysis system LPA- manufactured by Otsuka Electronics Co., Ltd.
The average particle size was measured using 3100. A 2 × 0.5 × 10 cm flat plate was formed by material strength extrusion molding, and a bending test was performed as a test piece to measure the breaking energy up to breaking. Test speed: 15 mm / min Molded product surface appearance A flat plate was formed by extrusion molding to obtain a test piece. The grain pattern of the surface of the obtained test piece was visually judged according to the following evaluation criteria. ;: Vivid wood grain pattern ×: Poor
【0034】実施例および比較例に用いた各成分は、下
記のとおりである。(A)スチレン系樹脂の調製 ゴム質重合体(a)−1〜(a)−4;本発明の(A)
スチレン系樹脂に用いられるゴム質重合体(a)とし
て、表1のものを用いた。The components used in the examples and comparative examples are as follows. (A) Preparation of styrenic resin Rubbery polymers (a) -1 to (a) -4; (A) of the present invention
As the rubbery polymer (a) used for the styrene resin, those shown in Table 1 were used.
【0035】[0035]
【表1】 [Table 1]
【0036】スチレン系樹脂A−1〜4、(b)−1〜
4;上記ゴム質重合体(a)−1〜(a)−4の存在
下、または非存在下に、単量体成分を重合し、スチレン
系樹脂をそれぞれ得た。これらの樹脂の構成を表2に示
す。なお、表2中、*印は、固形分換算である。また、
A−1は乳化重合で、A−2〜4、(b)−1、(b)
−3〜4は溶液重合で、(b)−2は懸濁重合で得た。Styrene resins A-1 to A-4, (b) -1
4: A monomer component was polymerized in the presence or absence of the rubbery polymers (a) -1 to (a) -4 to obtain styrene resins. Table 2 shows the structures of these resins. In Table 2, an asterisk indicates a solid content conversion. Also,
A-1 is an emulsion polymerization, and A-2 to 4, (b) -1, (b)
-3 to 4 were obtained by solution polymerization, and (b) -2 was obtained by suspension polymerization.
【0037】[0037]
【表2】 [Table 2]
【0038】(B)滑剤の調製 B−1;ステアリン酸マグネシウム〔堺化学工業(株)
製、SM#1000〕を用いた。 B−2;ステアリルステアレート〔花王(株)製、ユニ
スターM−9676〕を用いた。 B−3;低分子ポリエチレン部分カルボキシル変性物
〔三洋化成(株)製、サンワックスE−250P〕を用
いた。 (B) Preparation of lubricant B-1; magnesium stearate [Sakai Chemical Industry Co., Ltd.
SM # 1000]. B-2: Stearyl stearate (Unistar M-9676, manufactured by Kao Corporation) was used. B-3: A low molecular weight polyethylene partially carboxyl-modified product (Sunwax E-250P, manufactured by Sanyo Chemical Co., Ltd.) was used.
【0039】(C)他の熱可塑性樹脂の調製 C−1;ポリカーボネート樹脂〔帝人化成(株)製、パ
ンライトL−1225〕を用いた。 C−2;ポリアミド6〔鐘紡(株)製、カネボウナイロ
ンMC−120〕を用いた。(D)染・顔料の調製 D−1;カーボンブラックを用いた。 D−2;ベンガラを用いた。 D−3;チタンイエローを用いた。 (C) Preparation of Other Thermoplastic Resin C-1: A polycarbonate resin [Panlite L-1225 manufactured by Teijin Chemicals Ltd.] was used. C-2: Polyamide 6 [manufactured by Kanebo Co., Ltd., Kanebo nylon MC-120] was used. (D) Preparation of Dyeing / Pigment D-1: Carbon black was used. D-2: Bengala was used. D-3: Titanium yellow was used.
【0040】(E)セルロース系物質の調製 E−1(木粉);マツ/ツガ=50/50(重量比)の
割合で混合した粉砕品で、100メッシュパスしたもの
を用いた。 E−2(セルロースファイバー);PPC用紙を粉砕
し、繊維状にしたものを使用した。(F)無機フィラーの調製 F−1;タルク〔日本タルク(株)製、ミクロエースK
1〕を用いた。 F−2;軽質炭酸カルシウム〔丸尾カルシウム(株)
製〕を用いた。 (E) Preparation of Cellulose-Based Material E-1 (wood flour); a crushed product mixed at a ratio of pine / tsuga = 50/50 (weight ratio), which was passed through 100 mesh was used. E-2 (cellulose fiber): PPC paper was pulverized and made into a fibrous form. (F) Preparation of inorganic filler F-1; Talc [Micro Ace K, manufactured by Nippon Talc Co., Ltd.
1] was used. F-2: Light calcium carbonate [Maruo Calcium Co., Ltd.]
Manufactured).
【0041】実施例1〜28、比較例1〜9 上記各成分を、水分率0.1%以下までそれぞれ乾燥
し、表3〜6の配合処方で混合し、押し出し機を使用し
て180〜200℃で溶融混練りしペレットを得た。得
られたペレットを、表7〜9の比率で混合し、押し出し
成形により平板を成形し、材料強度の測定および表面の
木目模様を目視で判定した。結果を表7〜9に示す。Examples 1-28, Comparative Examples 1-9 Each of the above-mentioned components was dried to a moisture content of 0.1% or less, mixed according to the formulation shown in Tables 3-6, and mixed with an extruder to obtain The mixture was melt-kneaded at 200 ° C. to obtain pellets. The obtained pellets were mixed at a ratio shown in Tables 7 to 9, and a flat plate was formed by extrusion, and the material strength was measured and the grain pattern on the surface was visually determined. The results are shown in Tables 7-9.
【0042】[0042]
【表3】 [Table 3]
【0043】[0043]
【表4】 [Table 4]
【0044】[0044]
【表5】 [Table 5]
【0045】[0045]
【表6】 [Table 6]
【0046】[0046]
【表7】 [Table 7]
【0047】[0047]
【表8】 [Table 8]
【0048】[0048]
【表9】 [Table 9]
【0049】表7〜8から明らかなように、本発明の組
成物から得られる成形品である実施例1〜28は、すべ
て鮮明な木目模様が得られ、材料強度も優れている。こ
れに対し、表9から明らかなように、比較例1は、本発
明の樹脂組成物(I)の(A)成分の使用量が本発明の
範囲外で少なく、(E)成分の使用量が本発明の範囲外
で多い例であり、材料強度が劣る。比較例2は、本発明
の樹脂組成物(I)の(A)成分の使用量が本発明の範
囲外で少なく、(F)成分の使用量が本発明の範囲外で
多い例であり、材料強度が劣る。比較例3、5は、本発
明の樹脂組成物(I)の(B)成分の使用量が本発明の
範囲外で少ない例であり、鮮明な木目模様が得られな
い。比較例4は、本発明の樹脂組成物(I)の(B)成
分の使用量が本発明の範囲外で多い例であり、溶融混練
りができなかった。比較例6は、本発明の樹脂組成物
(II) の(C)成分の使用量が本発明の範囲外で多く、
(D)成分の使用量が本発明の範囲外で少ない例であ
り、鮮明な木目模様が得られない。比較例7は、本発明
の樹脂組成物(II) の(C)成分の使用量が本発明の範
囲外で少なく、(D)成分の使用量が本発明の範囲外で
多い例であり、鮮明な木目模様が得られない。比較例8
は、本発明の樹脂組成物(II) の使用量が本発明の範囲
外で少ない例であり、鮮明な木目模様が得られない。比
較例9は、本発明の樹脂組成物(II) の使用量が本発明
の範囲外で多い例であり、鮮明な木目模様が得られな
い。As is clear from Tables 7 and 8, Examples 1 to 28, which are molded articles obtained from the composition of the present invention, all have clear grain patterns and are excellent in material strength. On the other hand, as is clear from Table 9, in Comparative Example 1, the amount of the component (A) of the resin composition (I) of the present invention was small outside the range of the present invention, and the amount of the component (E) used was small. Are examples outside the scope of the present invention, and the material strength is inferior. Comparative Example 2 is an example in which the amount of the component (A) used in the resin composition (I) of the present invention is small outside the range of the present invention, and the amount of the component (F) used is large outside the range of the present invention. Poor material strength. Comparative Examples 3 and 5 are examples in which the amount of the component (B) of the resin composition (I) of the present invention is small outside the range of the present invention, and a clear grain pattern cannot be obtained. Comparative Example 4 was an example in which the amount of the component (B) used in the resin composition (I) of the present invention was outside the range of the present invention, and melt kneading was not possible. Comparative Example 6 shows that the amount of the component (C) used in the resin composition (II) of the present invention was large outside the scope of the present invention,
This is an example in which the amount of the component (D) used is small outside the range of the present invention, and a clear grain pattern cannot be obtained. Comparative Example 7 is an example in which the amount of the component (C) used in the resin composition (II) of the present invention is small outside the range of the present invention, and the amount of the component (D) used is large outside the range of the present invention. A clear grain pattern cannot be obtained. Comparative Example 8
Is an example in which the amount of the resin composition (II) of the present invention is small outside the range of the present invention, and a clear grain pattern cannot be obtained. Comparative Example 9 is an example in which the amount of the resin composition (II) of the present invention used is out of the range of the present invention, and a clear grain pattern cannot be obtained.
【0050】[0050]
【発明の効果】本発明の木目模様を有する樹脂成形品
は、鮮やかな木目模様を有するため、広範囲の用途、例
えばOA・家電分野、車両・船舶分野、家具・建材分野
などの住宅関連分野、サニタリー分野、玩具・スポーツ
用品分野、そのほか雑貨などの幅広い分野に使用するこ
とができる。Since the resin molded article having a wood grain pattern of the present invention has a vivid wood grain pattern, it can be used in a wide range of applications, for example, OA and home appliances, vehicles and ships, furniture and building materials, and other housing-related fields. It can be used in a wide range of fields such as sanitary, toys and sports goods, and other miscellaneous goods.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI C08L 23:00 83:04) ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI C08L 23:00 83:04)
Claims (4)
は非存在下に、芳香族ビニル化合物および必要に応じて
芳香族ビニル化合物と共重合可能な他のビニル系単量体
からなる単量体成分(b)を(共)重合して得られるス
チレン系樹脂100重量部に対して、(B)滑剤1〜1
2重量部を溶融混練りしてなる樹脂組成物(I)100
重量部に対し、(C)熱可塑性樹脂65〜99重量%、
ならびに(D)染料および/または顔料35〜1重量%
〔ただし、(C)+(D)=100重量%〕を溶融混練
りしてなる樹脂組成物(II) を0.1〜30重量部ドラ
イブレンドしてなる木目模様の発現を可能とすることを
特徴とする樹脂組成物。1. An aromatic vinyl compound and, if necessary, another vinyl monomer copolymerizable with an aromatic vinyl compound in the presence or absence of (A) the rubbery polymer (a). (B) lubricants 1 to 1 with respect to 100 parts by weight of a styrene resin obtained by (co) polymerizing the monomer component (b).
Resin composition (I) 100 obtained by melt-kneading 2 parts by weight
(C) 65 to 99% by weight of a thermoplastic resin,
And (D) 35 to 1% by weight of a dye and / or pigment
The resin composition (II) obtained by melt-kneading (C) + (D) = 100% by weight is dry-blended with 0.1 to 30 parts by weight of the resin composition (II) to enable the appearance of a wood grain pattern. The resin composition characterized by the above-mentioned.
芳香族ビニル化合物および必要に応じて芳香族ビニル化
合物と共重合可能な他のビニル系単量体からなる単量体
成分(b)を(共)重合して得られるスチレン系樹脂2
0〜100重量%、 (E)セルロース系物質0〜80重量%、および(F)
無機フィラー0〜80重量%〔ただし、(A)+(E)
+(F)=100重量%〕からなる樹脂組成物100重
量部に対して、(B)滑剤1〜12重量部を溶融混練り
してなる請求項1記載の樹脂組成物。2. A resin composition (I) comprising: (A) in the presence or absence of a rubbery polymer (a),
Styrene resin 2 obtained by (co) polymerizing a monomer component (b) composed of an aromatic vinyl compound and another vinyl monomer copolymerizable with the aromatic vinyl compound if necessary
0 to 100% by weight, (E) 0 to 80% by weight of a cellulosic substance, and (F)
0 to 80% by weight of inorganic filler [however, (A) + (E)
+ (F) = 100% by weight], and 1 to 12 parts by weight of a lubricant (B) is melt-kneaded with respect to 100 parts by weight of the resin composition comprising:
鎖アルキル基と官能基とを有する化合物および/または
エチレン系の共重合体である請求項1または2に記載の
樹脂組成物。3. The resin according to claim 1, wherein the lubricant (B) in the resin composition (I) is a compound having a long-chain alkyl group and a functional group and / or an ethylene copolymer. Composition.
成物を成形してなる木目模様を有する成形品。4. A molded article having a wood pattern formed by molding the resin composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13102998A JP4117713B2 (en) | 1998-04-27 | 1998-04-27 | Resin composition and molded product having wood grain pattern formed by molding the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13102998A JP4117713B2 (en) | 1998-04-27 | 1998-04-27 | Resin composition and molded product having wood grain pattern formed by molding the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11310683A true JPH11310683A (en) | 1999-11-09 |
| JP4117713B2 JP4117713B2 (en) | 2008-07-16 |
Family
ID=15048358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13102998A Expired - Lifetime JP4117713B2 (en) | 1998-04-27 | 1998-04-27 | Resin composition and molded product having wood grain pattern formed by molding the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4117713B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002097327A (en) * | 2000-06-28 | 2002-04-02 | Mitsubishi Rayon Co Ltd | Resin composition, resin molded product, and method for producing the molded product |
| JP2006002007A (en) * | 2004-06-16 | 2006-01-05 | Umg Abs Ltd | Thermoplastic composite resin composition and wood grain resin molded product formed by molding the same |
| JP2006233112A (en) * | 2005-02-28 | 2006-09-07 | Asahi Kasei Chemicals Corp | Styrenic resin composition and extruded product thereof |
| JP2006233111A (en) * | 2005-02-28 | 2006-09-07 | Asahi Kasei Chemicals Corp | Styrenic resin composition and extruded product thereof |
| JP2007169384A (en) * | 2005-12-20 | 2007-07-05 | Techno Polymer Co Ltd | Low-thermal storage resin composition exhibiting woodgrain pattern |
| JP2010247354A (en) * | 2009-04-13 | 2010-11-04 | Denki Kagaku Kogyo Kk | Profile extrusion molding |
-
1998
- 1998-04-27 JP JP13102998A patent/JP4117713B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002097327A (en) * | 2000-06-28 | 2002-04-02 | Mitsubishi Rayon Co Ltd | Resin composition, resin molded product, and method for producing the molded product |
| JP2006002007A (en) * | 2004-06-16 | 2006-01-05 | Umg Abs Ltd | Thermoplastic composite resin composition and wood grain resin molded product formed by molding the same |
| JP2006233112A (en) * | 2005-02-28 | 2006-09-07 | Asahi Kasei Chemicals Corp | Styrenic resin composition and extruded product thereof |
| JP2006233111A (en) * | 2005-02-28 | 2006-09-07 | Asahi Kasei Chemicals Corp | Styrenic resin composition and extruded product thereof |
| JP2007169384A (en) * | 2005-12-20 | 2007-07-05 | Techno Polymer Co Ltd | Low-thermal storage resin composition exhibiting woodgrain pattern |
| JP2010247354A (en) * | 2009-04-13 | 2010-11-04 | Denki Kagaku Kogyo Kk | Profile extrusion molding |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4117713B2 (en) | 2008-07-16 |
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