JPH1134560A - Non-contact IC card - Google Patents
Non-contact IC cardInfo
- Publication number
- JPH1134560A JPH1134560A JP20715597A JP20715597A JPH1134560A JP H1134560 A JPH1134560 A JP H1134560A JP 20715597 A JP20715597 A JP 20715597A JP 20715597 A JP20715597 A JP 20715597A JP H1134560 A JPH1134560 A JP H1134560A
- Authority
- JP
- Japan
- Prior art keywords
- card
- contact
- antenna coil
- chip
- lead portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】
【課題】 耐環境性が高く、曲げ応力に強く、シンプル
な構造で製造し易く、薄型のＩＣカードを得る。
【解決手段】 ＩＣチップ３と、リード部２１を有する
アンテナコイル２を、ベースフィルムとカバーフィルム
の間に設け、前記ベースフィルムとカバーフィルムの隙
間を充填剤により埋めてなり、アンテナコイル２のリー
ド部２１を偏平状に加工して、直接ＩＣチップ３の電極
３１に接続する非接触ＩＣカード。
(57) [Summary] [PROBLEMS] To obtain a thin IC card that has high environmental resistance, is resistant to bending stress, is easy to manufacture with a simple structure, and is thin. SOLUTION: An IC chip 3 and an antenna coil 2 having a lead portion 21 are provided between a base film and a cover film, and a gap between the base film and the cover film is filled with a filler. A non-contact IC card in which the portion 21 is processed into a flat shape and directly connected to the electrode 31 of the IC chip 3.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、非接触ＩＣカード
に関し、特に薄型カードにおけるＩＣチップとアンテナ
コイルのリード部との接続部の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC card, and more particularly, to a structure of a connecting portion between an IC chip and a lead portion of an antenna coil in a thin card.
【０００２】[0002]
【従来の技術】電磁結合型非接触ＩＣカードにおいて
は、少なくともアンテナコイルとＩＣチップとを何らか
の手段で電気的に接続する必要がある。2. Description of the Related Art In an electromagnetic coupling type non-contact IC card, it is necessary to electrically connect at least an antenna coil and an IC chip by some means.
【０００３】図７に、従来の非接触ＩＣカード（以下、
ＩＣカードと称す）の構造を示す。図７（ａ）は透過斜
視図、図７（ｂ）は部分断面図である。FIG. 7 shows a conventional non-contact IC card (hereinafter, referred to as a non-contact IC card).
(Referred to as an IC card). FIG. 7A is a transparent perspective view, and FIG. 7B is a partial sectional view.
【０００４】従来のＩＣカードは、図７に示すように、
ＩＣカード１の内部には、中継端子４１を有する端子基
板４にＩＣチップ３を搭載し、ＩＣチップの電極３１を
ボンディングワイヤ５により中継端子４１に接続すると
共に、アンテナコイル２のリード部２１を中継端子４１
に接続して構成されていた［図７（ａ）］。A conventional IC card is, as shown in FIG.
Inside the IC card 1, the IC chip 3 is mounted on the terminal board 4 having the relay terminal 41, the electrode 31 of the IC chip is connected to the relay terminal 41 by the bonding wire 5, and the lead portion 21 of the antenna coil 2 is connected. Relay terminal 41
[FIG. 7A].
【０００５】より詳しくは、ＩＣチップ３は、端子基板
４に接着剤６で接着固定され、ＩＣチップ３の電極３１
からボンディングワイヤ５により中継端子４１に接続さ
れ、又、アンテナコイル２のリード部２１は、中継端子
４１に半田付け９する構造となっていた［図７
（ｂ）］。More specifically, the IC chip 3 is bonded and fixed to the terminal substrate 4 with an adhesive 6, and the electrode 31 of the IC chip 3
And the bonding wire 5 is connected to the relay terminal 41, and the lead portion 21 of the antenna coil 2 is soldered 9 to the relay terminal 41 [FIG.
(B)].
【０００６】このような構造は、チップが端子基板に接
着されており、又、アンテナコイルも端子基板に接続さ
れるため、ＩＣカード１の曲げ等による応力が、直接Ｉ
Ｃチップに印加されにくいという利点がある。In such a structure, the chip is bonded to the terminal substrate, and the antenna coil is also connected to the terminal substrate.
There is an advantage that the voltage is not easily applied to the C chip.
【０００７】[0007]
【発明が解決しようとする課題】しかし、このような構
造は端子基板を使用し、接続箇所も多いため、構造及び
製造工程が複雑で、低価格化が非常に困難であった。
又、ＩＣカードの薄型化にも限界があったHowever, since such a structure uses a terminal board and has many connection points, the structure and the manufacturing process are complicated, and it is very difficult to reduce the cost.
Also, there was a limit to the thickness of IC cards.
【０００８】図８に、ＩＣカードに曲げ応力を加えた状
態を示す。図８に示すように、一般に、厚さがｔのＩＣ
カード１の偏平面を長手方向に曲げたとき、外（図８中
の上）側は、矢印７１の方向に伸び、内（図８中の下）
側は、矢印７２の方向に縮む。又、この中間には伸びも
縮みもしない中立面７０が存在する。FIG. 8 shows a state in which bending stress is applied to the IC card. As shown in FIG. 8, generally, an IC having a thickness of t
When the uneven plane of the card 1 is bent in the longitudinal direction, the outer side (upper in FIG. 8) extends in the direction of arrow 71 and the inner side (lower in FIG. 8).
The side contracts in the direction of arrow 72. In addition, a neutral surface 70 that does not expand or contract exists in the middle.
【０００９】アンテナコイルとＩＣチップを注意深くこ
の中立面に配置しても、アンテナコイルのリード部、お
よびＩＣチップの電極には、曲げ応力が加わる。アンテ
ナコイルやＩＣチップに比べ、アンテナコイルのリード
部およびＩＣチップの電極は、破断強度や曲げ強さが比
較的弱いため、アンテナコイルのリード部がＩＣチップ
の電極から剥がれたり、ＩＣチップの電極のＩＣチップ
からの剥離が発生しやすい。Even if the antenna coil and the IC chip are carefully arranged on this neutral plane, bending stress is applied to the lead portion of the antenna coil and the electrode of the IC chip. Since the lead portion of the antenna coil and the electrode of the IC chip have relatively low breaking strength and bending strength compared to the antenna coil and the IC chip, the lead portion of the antenna coil may peel off from the electrode of the IC chip, Easily peels off from the IC chip.
【００１０】又、熱によるＩＣカードの膨張収縮によっ
て、ＩＣチップの電極に応力が加わり、ＩＣチップの電
極が損傷することもある。[0010] In addition, due to expansion and contraction of the IC card due to heat, stress is applied to the electrodes of the IC chip, and the electrodes of the IC chip may be damaged.
【００１１】そこで、本発明は、上記の問題点を解決
し、耐環境性が高く、曲げ応力に強く、シンプルな構造
で製造し易く、薄型のＩＣカードを提供することであ
る。It is an object of the present invention to provide a thin IC card which solves the above-mentioned problems, has high environmental resistance, is resistant to bending stress, is easy to manufacture with a simple structure, and has a thin structure.
【００１２】[0012]
【課題を解決するための手段】上記課題を解決するため
の本発明は、ＩＣチップと、リード部を有するアンテナ
コイルを、ベースフィルムとカバーフィルムの間に設
け、前記ベースフィルムとカバーフィルムの隙間を充填
剤により埋める非接触ＩＣカードである。According to the present invention, there is provided an antenna coil having a lead portion and an IC chip provided between a base film and a cover film, wherein a gap between the base film and the cover film is provided. Is a non-contact IC card in which is filled with a filler.
【００１３】さらに、本発明は、前記アンテナコイルの
リード部を直接ＩＣチップに接続する上記のＩＣカード
である。Further, the present invention is the above-mentioned IC card, wherein the lead of the antenna coil is directly connected to an IC chip.
【００１４】さらに、本発明は、前記アンテナコイルの
リード部を扁平状に加工する上記の非接触ＩＣカードで
ある。Further, the present invention is the above-mentioned non-contact IC card in which a lead portion of the antenna coil is processed into a flat shape.
【００１５】さらに、本発明は、前記アンテナコイルの
リード部をＩＣカードの厚さ方向にＵ字型に成形し、前
記ＩＣチップに接続した上記のＩＣカードである。Further, the present invention is the above-mentioned IC card, wherein the lead portion of the antenna coil is formed in a U-shape in the thickness direction of the IC card and connected to the IC chip.
【００１６】又、本発明は、前記アンテナコイルのリー
ド部をＩＣカードの面内方向にＵ字型に成形し、前記Ｉ
Ｃチップに接続した上記のＩＣカードである。Further, according to the present invention, the lead portion of the antenna coil is formed in a U-shape in the in-plane direction of the IC card,
The above IC card connected to a C chip.
【００１７】又、本発明は、前記アンテナコイルのリー
ド部をＩＣカードの厚さ方向に波形に成形し、ＩＣチッ
プに接続した上記のＩＣカードである。Further, the present invention is the above-mentioned IC card wherein the lead portion of the antenna coil is formed into a waveform in the thickness direction of the IC card and connected to an IC chip.
【００１８】又、本発明は、前記アンテナコイルのリー
ド部をカードの面内方向に波形に成形し、前記ＩＣチッ
プに接続した上記のＩＣカードである。Further, the present invention is the above-mentioned IC card, wherein the lead portion of the antenna coil is formed into a waveform in the in-plane direction of the card and connected to the IC chip.
【００１９】又、本発明は、前記アンテナコイルの二つ
のリード部を電気的絶縁を保ちつつ、互いに交差するよ
うに引き回し、配置した上記の非接触ＩＣカードであ
る。Further, the present invention is the above-mentioned non-contact IC card, wherein the two lead portions of the antenna coil are arranged so as to cross each other while maintaining electrical insulation.
【００２０】さらに、本発明は、偏平に加工した前記ア
ンテナコイルの二つのリード部の偏平な面が重なるよう
に交差させた上記のＩＣカードである。Further, the present invention is the above-mentioned IC card wherein the flat surfaces of the two lead portions of the flattened antenna coil intersect so that the flat surfaces thereof overlap.
【００２１】又、本発明は、前記アンテナコイルの二つ
のリード部を互いに対称なＵ字状に成形し、且つＵ字の
底部付近をＩＣチップに接続した上記のＩＣカードであ
る。Further, the present invention is the above-mentioned IC card in which the two lead portions of the antenna coil are formed in a U-shape symmetrical to each other, and the vicinity of the bottom of the U-shape is connected to an IC chip.
【００２２】又、本発明は、アンテナコイルの二つのリ
ード部を互いに対称なＶ字状に成形し、且つＶ字の底部
付近をＩＣチップに接続した上記のＩＣカードである。Further, the present invention is the above-mentioned IC card in which the two lead portions of the antenna coil are formed in a symmetrical V-shape, and the vicinity of the bottom of the V-shape is connected to an IC chip.
【００２３】さらに、本発明は、前記アンテナコイルの
リード部を覆う充填剤が、可撓性を有する樹脂組成物で
ある上記のＩＣカードである。Further, the present invention is the above-described IC card, wherein the filler covering the lead portion of the antenna coil is a resin composition having flexibility.
【００２４】又、本発明は、前記アンテナコイルのリー
ド部を覆う充填剤が、ゴム系の組成物である上記のＩＣ
カードである。Further, according to the present invention, there is provided the above-described IC, wherein the filler covering the lead portion of the antenna coil is a rubber-based composition.
Card.
【００２５】さらに、本発明は、前記アンテナコイルの
リード部を覆う充填剤が、前記ベースフィルムとカバー
フィルム間の隙間の外周部を埋める充填剤より高い可撓
性を有する上記のＩＣカードである。Further, the present invention is the above-described IC card, wherein the filler covering the lead portion of the antenna coil has higher flexibility than the filler filling the outer peripheral portion of the gap between the base film and the cover film. .
【００２６】本発明は、アンテナコイルのリード部を直
接ＩＣチップの電極に接続するようにして、接続を容易
にすると共に、カードの屈曲などによるアンテナコイル
からの曲げや伸びなどの応力をリード部近傍で解放又は
緩和する緩衝機構を設けたことを特徴とするものであ
る。According to the present invention, the lead portion of the antenna coil is directly connected to the electrode of the IC chip to facilitate the connection, and stress such as bending or elongation from the antenna coil due to bending of the card is reduced. It is characterized in that a buffer mechanism for releasing or relaxing in the vicinity is provided.
【００２７】[0027]
【発明の実施の形態】以下に、本発明による実施の形態
を、図を用いて説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００２８】図１に、本発明のＩＣカードのアンテナコ
イルのリード部をＩＣチップの電極に接続した状態を示
す。FIG. 1 shows a state in which the leads of the antenna coil of the IC card of the present invention are connected to the electrodes of the IC chip.
【００２９】本発明は、中継端子を有する端子基板をな
くし、アンテナコイルのリード部を直接ＩＣチップの電
極に接続するようにしたもので、図１に示すように、断
面が丸のマグネットワイヤで形成したアンテナコイルの
リード部２１を扁平状に加工した。ＩＣチップ３の電極
３１へのリード部２１の接続は、丸線のままの状態に比
べ、接触面が、線から面になるので、超音波や熱圧着に
よる接続でも、あるいは導電接着剤による接続でも、あ
るいはろう付けによる接続でも、容易に、且つ高い信頼
性で可能となる。According to the present invention, a terminal board having a relay terminal is eliminated, and a lead portion of an antenna coil is directly connected to an electrode of an IC chip. As shown in FIG. 1, a magnet wire having a circular cross section is used. The formed lead portion 21 of the antenna coil was processed into a flat shape. In the connection of the lead portion 21 to the electrode 31 of the IC chip 3, the contact surface is changed from a wire to a surface as compared with a state in which the wire is a round wire. However, even connection by brazing can be easily and reliably performed.
【００３０】尚、一般的に、アンテナコイルの線径は、
３０〜１５０μｍであり、扁平部の厚さは１５μｍない
し３０μｍ程度が望ましい。Generally, the wire diameter of the antenna coil is
The thickness of the flat portion is desirably about 15 μm to 30 μm.
【００３１】図２に、本発明のＩＣカードの一例の断面
を示す。図２に示すように、ベースフィルム１１にアン
テナコイル２とＩＣチップ３が貼付けられ、アンテナコ
イルのリード部２１は、ＩＣカード１の厚さ方向にＵ字
状に成形され（Ｕ字部２２）、ＩＣチップ３の電極３１
に接続されている。さらに、Ｕ字部２２を含むアンテナ
コイルのリード部２１は、扁平に加工され、可撓性を増
している。FIG. 2 shows a cross section of an example of the IC card of the present invention. As shown in FIG. 2, the antenna coil 2 and the IC chip 3 are attached to the base film 11, and the lead portion 21 of the antenna coil is formed in a U-shape in the thickness direction of the IC card 1 (U-shaped portion 22). , Electrode 31 of IC chip 3
It is connected to the. Further, the lead portion 21 of the antenna coil including the U-shaped portion 22 is flattened to increase flexibility.
【００３２】又、ＩＣチップ３と、アンテナコイル２
が、ベースフィルム１１とカバーフィルム１２の間にな
るように、カバーフィルム１２が張り付けられる。さら
に、ベースフィルム１１とカバーフィルム１２の隙間に
は、充填接着剤１３が充填されている。又、ＩＣチップ
３は、より硬質の樹脂組成物１４で封止され、且つ前記
Ｕ字部２２は、樹脂組成物１４に比べ可撓性の高い樹脂
組成物１５で封止されている。The IC chip 3 and the antenna coil 2
However, the cover film 12 is stuck so as to be between the base film 11 and the cover film 12. Further, a gap between the base film 11 and the cover film 12 is filled with a filling adhesive 13. The IC chip 3 is sealed with a harder resin composition 14, and the U-shaped portion 22 is sealed with a resin composition 15 having higher flexibility than the resin composition 14.
【００３３】すなわち、ＩＣカード１の断面中アンテナ
コイルのリード部のＵ字部の可撓性をもっとも高く（柔
らかく）しているため、ＩＣカードに曲げ応力がかかっ
たとき、変形は該Ｕ字部に集中し、ＩＣチップおよびＩ
Ｃチップの電極に加わる応力は緩和される。That is, since the U-shaped portion of the lead portion of the antenna coil in the cross section of the IC card 1 has the highest flexibility (softness), when a bending stress is applied to the IC card, the U-shaped portion is deformed. And IC chip and I
The stress applied to the electrode of the C chip is reduced.
【００３４】又、前記Ｕ字部２２を、樹脂組成物１５に
替えて、ゴム系の組成物で封止したが、樹脂組成物で覆
うのと同じ効果が得られる。Although the U-shaped portion 22 is sealed with a rubber-based composition instead of the resin composition 15, the same effect as covering with the resin composition can be obtained.
【００３５】又、図３に、本発明のＩＣカードの他の例
の透過平面図を示す。図３に示すように、アンテナコイ
ル２のリード部のＵ字部２４をＩＣカード１の面方向に
Ｕ字状に成形し、ＩＣチップ３の電極３１に接続してい
るが、前例と同様の効果が得られている。又、本例でも
前例と同様、Ｕ字部を扁平にし、且つ可撓性の高い樹脂
で封止した。FIG. 3 is a transparent plan view of another example of the IC card of the present invention. As shown in FIG. 3, the U-shaped portion 24 of the lead portion of the antenna coil 2 is formed in a U-shape in the surface direction of the IC card 1 and connected to the electrode 31 of the IC chip 3. The effect has been obtained. Also in this example, as in the previous example, the U-shaped portion was flattened and sealed with a highly flexible resin.
【００３６】図４に、アンテナコイルのリード部を交差
させた本発明のＩＣカード１の透過平面図を示す。図４
に示すように、アンテナコイル２の偏平に加工した二つ
のリード部の偏平な面が重なるように、前記リード部２
１を、電気的絶縁（図示せず）を保ちつつ、交差させ、
ＩＣチップ３の電極３１に接続するようにして、前記と
同様の効果が得られた。FIG. 4 is a transparent plan view of the IC card 1 of the present invention in which the leads of the antenna coil are crossed. FIG.
As shown in the figure, the lead portions 2 are flattened so that the flat surfaces of the two flat portions of the antenna coil 2 overlap.
1 are crossed while maintaining electrical insulation (not shown),
By connecting to the electrode 31 of the IC chip 3, the same effect as described above was obtained.
【００３７】図５に、アンテナコイルのＵ字部のＵ字の
底部付近をＩＣチップに接続した本発明のＩＣカード１
の透過平面図を示す。図５に示すように、アンテナコイ
ル２の二つのリード部２１を互いに対称なＵ字状に成形
してＵ字部２５とし、Ｕ字部２５のＵ字の底部付近をＩ
Ｃチップ３の電極３１に接続して、前記と同様の効果が
得られた。FIG. 5 shows an IC card 1 according to the present invention in which the U-shaped bottom of the U-shaped portion of the antenna coil is connected to an IC chip.
FIG. As shown in FIG. 5, the two lead portions 21 of the antenna coil 2 are formed into a U-shape which is symmetrical to each other to form a U-shaped portion 25.
By connecting to the electrode 31 of the C chip 3, the same effect as described above was obtained.
【００３８】図６に、アンテナコイルの二つのリード部
を互いに対称なＶ字状に成形してＶ字部とし、Ｖ字部の
Ｖ字の底部付近をＩＣチップに接続した本発明のＩＣカ
ードの透過平面図を示す。FIG. 6 shows an IC card of the present invention in which two lead portions of an antenna coil are formed into a V-shape which is symmetrical to each other to form a V-shape, and a portion near the bottom of the V-shape of the V-shape is connected to an IC chip. FIG.
【００３９】図６に示すように、アンテナコイル２の二
つのリード部２１のＶ字部２６のＶ字の底部付近をＩＣ
チップ３の電極３１に接続して、前記と同様の効果が得
られた。又、Ｖ字部２６の底部をＩＣチップ３の電極３
１に配置し、接続することにより、応力緩和の効果と共
に、リード部２１の線端（図示せず）と電極との位置合
わせも容易になった。As shown in FIG. 6, the vicinity of the V-shaped bottom of the V-shaped portion 26 of the two leads 21 of the antenna coil 2 is an IC.
By connecting to the electrode 31 of the chip 3, the same effect as described above was obtained. Further, the bottom of the V-shaped portion 26 is connected to the electrode 3 of the IC chip 3.
By arranging and connecting them to each other, the effect of stress relaxation and the alignment between the wire end (not shown) of the lead portion 21 and the electrode were also facilitated.
【００４０】本実施の形態では、アンテナコイルのリー
ド部をＵ字状、あるいはＶ字状に成形した場合を説明し
たが、アンテナコイルのリード部を波状に成形しても、
その効果に変わりはない。In this embodiment, the case where the lead portion of the antenna coil is formed into a U-shape or V-shape has been described.
The effect remains the same.
【００４１】上記した本発明のＩＣカードは、いずれも
（従来のＩＣカードが備えていた）端子基板の厚さ分だ
け薄くできた。又、上記したように、シンプルな構造で
あり、製造し易く、耐環境性も高く、曲げ応力にも強い
ＩＣカードが得られた。Each of the IC cards of the present invention described above could be made thinner by the thickness of the terminal board (provided by the conventional IC card). In addition, as described above, an IC card having a simple structure, easy to manufacture, high in environmental resistance, and strong in bending stress was obtained.
【００４２】[0042]
【発明の効果】本発明によれば、耐環境性が高く、曲げ
応力に強く、シンプルな構造で製造し易く、薄型の非接
触ＩＣカードが得られる。According to the present invention, it is possible to obtain a thin non-contact IC card which has high environmental resistance, is resistant to bending stress, is easy to manufacture with a simple structure, and is thin.
【図１】本発明のＩＣカードのアンテナコイルのリード
部をＩＣチップの電極に接続した状態を示す説明図。FIG. 1 is an explanatory diagram showing a state where a lead portion of an antenna coil of an IC card of the present invention is connected to an electrode of an IC chip.
【図２】本発明のＩＣカードの一例の断面図。FIG. 2 is a cross-sectional view of an example of the IC card of the present invention.
【図３】本発明のＩＣカードの他の例の透過平面図。FIG. 3 is a transparent plan view of another example of the IC card of the present invention.
【図４】アンテナコイルのリード部を交差させた本発明
のＩＣカードの透過平面図。FIG. 4 is a transparent plan view of the IC card of the present invention in which the leads of the antenna coil intersect.
【図５】アンテナコイルのＵ字部のＵ字の底部付近をＩ
Ｃチップに接続した本発明のＩＣカードの透過平面図。FIG. 5 shows a portion near the U-shaped bottom of the U-shaped portion of the antenna coil
FIG. 3 is a transparent plan view of the IC card of the present invention connected to a C chip.
【図６】アンテナコイルの二つのリード部を互いに対称
なＶ字状に成形してＶ字部とし、Ｖ字部のＶ字の底部付
近をＩＣチップに接続した本発明のＩＣカードの透過平
面図。FIG. 6 is a transmission plane of an IC card according to the present invention in which two lead portions of an antenna coil are formed into a V-shape which is symmetrical to each other to form a V-shape; FIG.
【図７】従来のＩＣカードの構造を示す図で、図７
（ａ）は透過斜視図、図７（ｂ）は部分断面図。FIG. 7 is a diagram showing the structure of a conventional IC card.
7A is a transparent perspective view, and FIG. 7B is a partial sectional view.
【図８】ＩＣカードに曲げ応力を加えた状態を示す説明
図。FIG. 8 is an explanatory view showing a state in which bending stress is applied to the IC card.
１ ＩＣカード ２ アンテナコイル ２１ （アンテナコイルの）リード部 ２２ （ＩＣカードの厚さ方向に成形した）Ｕ字部 ２４ （ＩＣカードの面方向に成形した）Ｕ字部 ２５ （対称的に成形した）Ｕ字部 ２６ Ｖ字部 ３ ＩＣチップ ３１ （ＩＣチップの）電極 ４ 端子基板 ４１ 中継端子 ５ ボンディングワイヤ ６ 接着剤 ９ 半田付け １１ ベースフィルム １２ カバーフィルム １３ 充填接着材 １４ （より硬質の）樹脂組成物 １５ （可撓性の高い）樹脂組成物 ７１ （伸びる方向を示す）矢印 ７２ （縮む方向を示す）矢印 ７０ 中立面 ｔ 厚さ DESCRIPTION OF SYMBOLS 1 IC card 2 Antenna coil 21 Lead part (of antenna coil) 22 U-shaped part (formed in the thickness direction of the IC card) 24 U-shaped part (formed in the surface direction of the IC card) 25 (symmetrically formed) ) U-shaped part 26 V-shaped part 3 IC chip 31 Electrode (of IC chip) 4 Terminal board 41 Relay terminal 5 Bonding wire 6 Adhesive 9 Soldering 11 Base film 12 Cover film 13 Filling adhesive 14 (Harder) Resin Composition 15 (highly flexible) resin composition 71 Arrow (indicating the direction of elongation) 72 Arrow (indicating the direction of shrinking) 70 Neutral surface t Thickness
Claims (14)
ナコイルを、ベースフィルムとカバーフィルムの間に設
け、前記ベースフィルムとカバーフィルムの隙間を充填
剤により埋めてなることを特徴とする非接触ＩＣカー
ド。1. A non-contact IC wherein an IC chip and an antenna coil having a lead portion are provided between a base film and a cover film, and a gap between the base film and the cover film is filled with a filler. card.
前記ＩＣチップに接続することを特徴とする請求項１記
載の非接触ＩＣカード。2. A lead portion of the antenna coil is directly
2. The non-contact IC card according to claim 1, wherein the non-contact IC card is connected to the IC chip.
に加工することを特徴とする請求項１または２のいずれ
かに記載の非接触ＩＣカード。3. The non-contact IC card according to claim 1, wherein a lead portion of the antenna coil is processed into a flat shape.
ＩＣカードの厚さ方向にＵ字状に成形し、前記ＩＣチッ
プに接続したことを特徴とする請求項１ないし３のいず
れかに記載の非接触ＩＣカード。4. The non-contact IC card according to claim 1, wherein a lead portion of the antenna coil is formed in a U-shape in a thickness direction of the non-contact IC card and connected to the IC chip. Non-contact IC card.
ＩＣカードの面内方向にＵ字状に成形し、前記ＩＣチッ
プに接続したことを特徴とする請求項１ないし３のいず
れかに記載の非接触ＩＣカード。5. The non-contact IC card according to claim 1, wherein a lead portion of the antenna coil is formed in a U-shape in an in-plane direction of the non-contact IC card and connected to the IC chip. Non-contact IC card.
ＩＣカードの厚さ方向に波形に成形し、前記ＩＣチップ
に接続したことを特徴とする請求項１ないし３のいずれ
かに記載の非接触ＩＣカード。6. The non-contact device according to claim 1, wherein a lead portion of the antenna coil is formed into a waveform in a thickness direction of the non-contact IC card and connected to the IC chip. IC card.
ＩＣカードの面内方向に波形に成形し、前記ＩＣチップ
に接続したことを特徴とする請求項１ないし３のいずれ
かに記載の非接触ＩＣカード。7. The non-contact device according to claim 1, wherein the lead portion of the antenna coil is formed into a waveform in the in-plane direction of the non-contact IC card and connected to the IC chip. IC card.
電気的絶縁を保ちつつ互いに交差するように引き回し、
配置したことを特徴とする請求項１ないし７のいずれか
に記載の非接触ＩＣカード。8. Routing the two lead portions of the antenna coil so as to cross each other while maintaining electrical insulation;
The non-contact IC card according to any one of claims 1 to 7, wherein the non-contact IC card is arranged.
つのリード部の偏平な面が重なるように交差させたこと
を特徴とする請求項８記載の非接触ＩＣカード。9. The non-contact IC card according to claim 8, wherein the flat surfaces of the two lead portions of the flattened antenna coil intersect with each other so as to overlap.
を互いに対称なＵ字状に成形し、且つＵ字の底部付近を
前記ＩＣチップに接続したことを特徴とする請求項１な
いし３または５のいずれかに記載の非接触ＩＣカード。10. The antenna according to claim 1, wherein two lead portions of said antenna coil are formed in a U-shape symmetrical to each other, and a portion near the bottom of the U-shape is connected to said IC chip. The non-contact IC card according to any one of the above.
を互いに対称なＶ字状に成形し、且つＶ字の底部付近を
ＩＣチップに接続したことを特徴とする請求項１ないし
３のいずれかに記載の非接触ＩＣカード。11. The method according to claim 1, wherein the two lead portions of the antenna coil are formed in a V-shape symmetrical to each other, and a portion near the bottom of the V-shape is connected to an IC chip. The non-contact IC card described in the above.
充填剤は可撓性を有する樹脂組成物であることを特徴と
する請求項１ないし１１のいずれかに記載の非接触ＩＣ
カード。12. The non-contact IC according to claim 1, wherein the filler covering the lead portion of the antenna coil is a flexible resin composition.
card.
充填剤はゴム系の組成物であることを特徴とする請求項
１ないし１１のいずれかに記載の非接触ＩＣカード。13. The non-contact IC card according to claim 1, wherein the filler covering the lead portion of the antenna coil is a rubber-based composition.
充填剤は、前記ベースフィルムと前記カバーフィルム間
の隙間の外周部を埋める充填剤より高い可撓性を有する
ことことを特徴とする請求項１２または１３のいずれか
に記載の非接触ＩＣカード。14. The filler covering the lead portion of the antenna coil has higher flexibility than the filler filling a peripheral portion of a gap between the base film and the cover film. Or a non-contact IC card according to any one of the above items 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20715597A JP3844268B2 (en) | 1997-07-15 | 1997-07-15 | Non-contact IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20715597A JP3844268B2 (en) | 1997-07-15 | 1997-07-15 | Non-contact IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1134560A true JPH1134560A (en) | 1999-02-09 |
| JP3844268B2 JP3844268B2 (en) | 2006-11-08 |
Family
ID=16535146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20715597A Expired - Fee Related JP3844268B2 (en) | 1997-07-15 | 1997-07-15 | Non-contact IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3844268B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003044814A (en) * | 2001-07-31 | 2003-02-14 | Toppan Forms Co Ltd | Combination type IC card and manufacturing method thereof |
| JP2010505212A (en) * | 2006-09-26 | 2010-02-18 | エイチアイディー グローバル ジーエムビーエイチ | Method and apparatus for making a radio frequency inlay |
-
1997
- 1997-07-15 JP JP20715597A patent/JP3844268B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003044814A (en) * | 2001-07-31 | 2003-02-14 | Toppan Forms Co Ltd | Combination type IC card and manufacturing method thereof |
| JP2010505212A (en) * | 2006-09-26 | 2010-02-18 | エイチアイディー グローバル ジーエムビーエイチ | Method and apparatus for making a radio frequency inlay |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3844268B2 (en) | 2006-11-08 |
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