JPH1139949A - Injection resin composition for electric apparatus insulation - Google Patents
Injection resin composition for electric apparatus insulationInfo
- Publication number
- JPH1139949A JPH1139949A JP19097197A JP19097197A JPH1139949A JP H1139949 A JPH1139949 A JP H1139949A JP 19097197 A JP19097197 A JP 19097197A JP 19097197 A JP19097197 A JP 19097197A JP H1139949 A JPH1139949 A JP H1139949A
- Authority
- JP
- Japan
- Prior art keywords
- mixed
- resin
- resin composition
- epoxy resin
- equivalent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 15
- 238000002347 injection Methods 0.000 title abstract 2
- 239000007924 injection Substances 0.000 title abstract 2
- 238000009413 insulation Methods 0.000 title description 2
- 239000003822 epoxy resin Substances 0.000 claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 22
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 239000004593 Epoxy Substances 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 10
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000010292 electrical insulation Methods 0.000 claims description 8
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 10
- 239000000945 filler Substances 0.000 abstract description 9
- 239000002245 particle Substances 0.000 abstract description 5
- 239000000377 silicon dioxide Substances 0.000 abstract description 5
- 229930185605 Bisphenol Natural products 0.000 abstract description 4
- 239000006087 Silane Coupling Agent Substances 0.000 abstract description 3
- 150000003512 tertiary amines Chemical class 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 abstract 1
- 239000012774 insulation material Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 18
- 150000008065 acid anhydrides Chemical class 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 3
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 "DMP-30" trade name Chemical class 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- JDBDDNFATWXGQZ-UHFFFAOYSA-N 5-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1=CC(C)CC2C(=O)OC(=O)C12 JDBDDNFATWXGQZ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電気機器絶縁用注型
樹脂組成物に関する。The present invention relates to a cast resin composition for insulating electrical equipment.
【０００２】[0002]
【従来の技術】従来より、高電圧機器の絶縁材料及び構
造材料として、エポキシ樹脂をマトリックスとした高分
子複合硬化物、いわゆるモールド注型品が広く用いられ
ている。また、近年の社会の高度化、集中化に伴い、機
器の大容量・小型・高信頼性化が強く要求されており、
モールド注型品においても、静止機器最高使用温度１０
５℃以上でも材料の物性が安定なガラス転移温度（以下
「Ｔｇ」という）１１５℃以上の耐熱性エポキシ注型品
を使用する傾向が強まってきている。2. Description of the Related Art Hitherto, as an insulating material and a structural material for high-voltage equipment, a polymer composite cured product using an epoxy resin as a matrix, that is, a so-called molded product has been widely used. In addition, with the recent sophistication and concentration of society, large capacity, small size and high reliability of equipment are strongly demanded.
Even for mold cast products, the maximum operating temperature of stationary equipment is 10
There is an increasing tendency to use heat-resistant epoxy cast products having a glass transition temperature (hereinafter referred to as “Tg”) of 115 ° C. or higher, in which the physical properties of the material are stable even at 5 ° C. or higher.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来技
術によるＴｇ＝１１５℃以上の耐熱性エポキシ樹脂は、
硬く脆いため、得られた注型品が割れやすいという問題
がある。この結果、鉄導体を用いた耐クラック性試験結
果が−３０℃以下を保持するために、作業性の悪い固形
エポキシ樹脂を使用したり、充填剤を多量に充填する必
要がある。この結果、粘度が著しく増粘し、作業可能時
間（ポットライフ）が短くなるために、作業性が大変悪
く工業的に非常に問題がある。However, the heat-resistant epoxy resin having a Tg of 115 ° C. or higher according to the prior art,
Since it is hard and brittle, there is a problem that the obtained cast product is easily broken. As a result, it is necessary to use a solid epoxy resin having poor workability or to fill a large amount of a filler in order to maintain a crack resistance test result of −30 ° C. or lower using an iron conductor. As a result, the viscosity is remarkably increased, and the operable time (pot life) is shortened.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決する本発
明の電気絶縁用樹脂組成物は、ビスフェノール型エポキ
シ樹脂からなる主剤と、硬化剤とからなる電気絶縁用樹
脂組成物であって、上記硬化剤がメチルヘキサヒドロ無
水フタル酸又はヘキサヒドロ無水フタル酸並びにこれら
の混合物からなることを特徴とする。The electric insulating resin composition of the present invention for solving the above-mentioned problems is an electric insulating resin composition comprising a main agent comprising a bisphenol-type epoxy resin and a curing agent, The curing agent is characterized in that it comprises methylhexahydrophthalic anhydride or hexahydrophthalic anhydride and a mixture thereof.
【０００５】上記電気絶縁用樹脂組成物において、上記
主剤がエポキシ樹脂のエポキシ当量が２５０のビスフェ
ノール型エポキシ樹脂とエポキシ当量が４００のビスフ
ェノール型エポキシ樹脂とが、８０：２０で混合してな
ることを特徴とする。In the above-mentioned resin composition for electric insulation, it is preferable that the main component is a mixture of a bisphenol type epoxy resin having an epoxy equivalent of 250 and an epoxy resin having an epoxy equivalent of 400 in a ratio of 80:20. Features.
【０００６】本発明のエポキシ樹脂注型品は、上記電気
絶縁用樹脂組成物を用いてなることを特徴とする。The epoxy resin cast product of the present invention is characterized by using the above-mentioned resin composition for electrical insulation.
【０００７】[0007]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。Embodiments of the present invention will be described below.
【０００８】本発明の電気絶縁用樹脂組成物は、ビスフ
ェノール型エポキシ樹脂からなる主剤と、硬化剤とから
なる電気絶縁用樹脂組成物であって、上記硬化剤がメチ
ルヘキサヒドロ無水フタル酸又はヘキサヒドロ無水フタ
ル酸並びにこれらの混合物からなるものである。ここ
で、ビスフェノール型エポキシ樹脂とは、例えばエポキ
シ当量２５０の「エピコート８３４」（商品名；油化シ
ェル社製）、エポキシ当量４００の「ＹＬ−６４２５
Ｂ」（商品名；油化シェル社製）、エポキシ当量４００
の「ＣＴ−２００」（商品名；チバガイギー社製）等を
挙げることができるが、本発明はこれに限定されるもの
ではない。[0008] The resin composition for electrical insulation of the present invention is a resin composition for electrical insulation comprising a main component comprising a bisphenol-type epoxy resin and a curing agent, wherein the curing agent is methylhexahydrophthalic anhydride or hexahydro- hydride. It is composed of phthalic anhydride and a mixture thereof. Here, the bisphenol type epoxy resin is, for example, “Epicoat 834” (trade name; manufactured by Yuka Shell Co., Ltd.) with an epoxy equivalent of 250, and “YL-6425 with an epoxy equivalent of 400”.
B "(trade name; Yuka Shell Co., Ltd.), epoxy equivalent 400
"CT-200" (trade name; manufactured by Ciba Geigy) and the like, but the present invention is not limited thereto.
【０００９】上記エポキシ樹脂の配合としては、例えば
エポキシ当量が２５０のビスフェノール型エポキシ樹脂
とエポキシ当量が４００のビスフェノール型エポキシ樹
脂とが、８０：２０で混合したものを主剤とするのが、
好ましいが、本発明はこれに限定されるものではない。The epoxy resin is mixed with a bisphenol-type epoxy resin having an epoxy equivalent of 250 and a bisphenol-type epoxy resin having an epoxy equivalent of 400 at a ratio of 80:20.
Although preferred, the invention is not so limited.
【００１０】上記硬化剤としては、酸無水物であるメチ
ルヘキサヒドロ無水フタル酸（例えば、「リカシッドＭ
Ｍ」商品名、新日本理化社製、酸無水物当量＝１６
８）、ヘキサヒドロ無水フタル酸（例えば、「ＨＨＰ
Ａ」商品名、新日本理化社製、酸無水物当量＝１５４）
等を挙げることができるが、本発明はこれに限定される
ものではない。As the above-mentioned curing agent, methylhexahydrophthalic anhydride which is an acid anhydride (for example, “Ricacid M”) is used.
M ", manufactured by Nippon Rika Co., Ltd., acid anhydride equivalent = 16
8), hexahydrophthalic anhydride (eg, “HHP
A "trade name, manufactured by Nippon Rika Co., Ltd., acid anhydride equivalent = 154)
Etc., but the present invention is not limited thereto.
【００１１】上記硬化促進剤としては、三級アミンを挙
げることができるが、本発明はこれに限定されるもので
はない。As the curing accelerator, a tertiary amine can be mentioned, but the present invention is not limited to this.
【００１２】本発明のエポキシ樹脂注型品は、上記配合
の電気絶縁用樹脂組成物に充填材を加えて所定の形状で
加熱硬化してなるものである。The epoxy resin cast product of the present invention is obtained by adding a filler to the above-mentioned resin composition for electrical insulation and heating and curing the resin composition in a predetermined shape.
【００１３】上記充填材としては、平均粒径１０〜１５
μｍのシリカを挙げることができ、シランカップリング
剤を所定量配合してなるものである。そして、主剤と硬
化剤・硬化促進剤を当量比１：0.９で混合し、これに４
２〜４６容量％の上記充填材を添加し均一になるまで混
合し、所定条件で加熱硬化処理をすることで、樹脂注型
品を得る。[0013] As the filler, an average particle diameter of 10 to 15 is used.
μm of silica can be used, and a predetermined amount of a silane coupling agent is blended. Then, the main agent and the curing agent / curing accelerator are mixed at an equivalent ratio of 1: 0.9, and
2 to 46% by volume of the above filler is added, mixed until uniform, and heat-cured under predetermined conditions to obtain a resin cast product.
【００１４】[0014]
【実施例】以下、本発明の効果を示す実施例を説明す
る。Embodiments of the present invention will be described below.
【００１５】（実施例１） ａ）主剤の調整 ベースの樹脂として一般的な特性を持つエポキシ当量２
５０のビスフェノールＡ型エポキシ樹脂（例えば、「エ
ピコート８３４」商品名、油化シェル社製）とエポキシ
当量４００のビスフェノールＡ型エポキシ樹脂（例え
ば、「ＣＴ−２００」商品名、チバガイギー社製）を８
０：２０の一定比率でブレンドした物を用いた。この樹
脂の所定量をステンレスビーカーにとり、１００℃で加
熱しながら均一になるまで攪拌した。 ｂ）硬化剤・硬化促進剤の調整 硬化剤は酸無水物であるメチルヘキサヒドロ無水フタル
酸（例えば、「リカシッドＭＭ」商品名、新日本理化社
製、酸無水物当量＝１６８）を用い、硬化時間を短縮す
るため三級アミン（例えば、「ＤＭＰ−３０」商品名、
化薬アクゾ社製）を硬化促進剤として少量（0.２重量
％）添加し、均一になるまで攪拌した。 ｃ）充填材 充填材として結晶状態が溶融で平均粒径１１μｍのシリ
カ（例えば「ＭＣＦ−４」商品名：龍森社製）にシラン
カップリング剤（例えば「ＫＢＭ−４０３」商品名：信
越シリコーン社製）を１ｐｈｒ添加し、（ａ）の主剤と
（ｂ）の硬化剤・硬化促進剤を当量比１：０．９で混合
し、均一になるまで混合し、１００℃−２ｈｒ＋１５０
℃−１５ｈｒで加熱硬化を行った。上記充填材の添加量
は４２容量％とした。得られた樹脂は、下記「表２」に
示すように、Ｔｇが１１５℃以上で且つ耐クラック性の
高い耐熱性注型樹脂であった。(Example 1) a) Preparation of main agent Epoxy equivalent 2 having general properties as base resin
50 bisphenol A type epoxy resin (for example, “Epicoat 834” trade name, manufactured by Yuka Shell Co., Ltd.) and an epoxy equivalent of 400 bisphenol A type epoxy resin (for example, “CT-200” trade name, manufactured by Ciba Geigy Co., Ltd.)
What was blended at a fixed ratio of 0:20 was used. A predetermined amount of this resin was placed in a stainless beaker and stirred while heating at 100 ° C. until uniform. b) Adjustment of Curing Agent / Curing Accelerator The curing agent used was an acid anhydride, methylhexahydrophthalic anhydride (for example, “Ricacid MM” trade name, manufactured by Shin Nippon Rika Co., acid anhydride equivalent = 168), Tertiary amines (e.g., "DMP-30" trade name,
(Akazo Co., Ltd.) was added as a curing accelerator in a small amount (0.2% by weight), and the mixture was stirred until it became uniform. c) Filler Silica (for example, “MCF-4” trade name: manufactured by Tatsumori Co., Ltd.) having a crystalline state of melting and having a mean particle size of 11 μm and a silane coupling agent (eg, “KBM-403” trade name: Shin-Etsu Silicone) as a filler 1 phr), the main ingredient (a) and the curing agent / curing accelerator (b) are mixed at an equivalent ratio of 1: 0.9, and mixed until uniform, and the mixture is mixed at 100 ° C.-2 hr + 150.
Heat curing was performed at -15 hours. The amount of the filler added was 42% by volume. The obtained resin was a heat-resistant cast resin having a Tg of 115 ° C. or higher and a high crack resistance, as shown in Table 2 below.
【００１６】（比較例）比較例としては、ベースの樹脂
として一般的な特性を持つエポキシエポキシ当量４００
のビスフェノールＡ型エポキシ樹脂（例えば、「ＣＴ−
２００」商品名、チバガイギー社製）を１００とし、硬
化剤として４−メチルテトラヒドロ無水フタル酸（例え
ば、「ＨＮ−２２００」商品名、新日本理化社製、酸無
水物当量＝１６６）を用いた以外は、実施例１と同様に
操作した。(Comparative Example) As a comparative example, an epoxy epoxy equivalent having a general property of 400 as a base resin was used.
Bisphenol A type epoxy resin (for example, “CT-
200 "(trade name, manufactured by Ciba Geigy) and 100 as the curing agent, and 4-methyltetrahydrophthalic anhydride (for example," HN-2200 ", manufactured by Shin Nippon Rika Co., acid anhydride equivalent = 166) was used. Other than that, it operated similarly to Example 1.
【００１７】（実施例２）上記実施例１において、
「ｂ）硬化剤」として、ヘキサヒドロ無水フタル酸（例
えば、「リカシッドＨＨ」商品名、新日本理化社製）と
メチルヘキサヒドロ無水フタル酸（例えば、「リカシッ
ドＭＭ」商品名、新日本理化社製、酸無水物当量＝１６
８）とを重量比８０：２０で混合すると共に、シリカの
粒径を１２μｍのもの（例えば「ＭＣＦ−４」商品名：
龍森社製）を用いた以外は、実施例１と同様に操作し
た。得られた樹脂は、下記「表３」に示すように、Ｔｇ
が１１５℃以上で且つ耐クラック性の高い耐熱性注型樹
脂であった。(Embodiment 2) In Embodiment 1 described above,
As the “b) curing agent”, hexahydrophthalic anhydride (for example, “Ricacid HH” trade name, manufactured by Shin Nippon Rika Co., Ltd.) and methyl hexahydrophthalic anhydride (for example, “Ricacid MM” trade name, manufactured by Nippon Rika Co., Ltd.) , Acid anhydride equivalent = 16
8) and a silica having a particle size of 12 μm (for example, “MCF-4” trade name:
The same operation as in Example 1 was performed except that Tatsumori Co., Ltd.) was used. The obtained resin had a Tg as shown in Table 3 below.
Was 115 ° C. or higher and a heat-resistant cast resin having high crack resistance.
【００１８】（実施例３）上記実施例１において、
「ｂ）硬化剤」として、ヘキサヒドロ無水フタル酸（例
えば、「リカシッドＨＨ」商品名、新日本理化社製）と
メチルヘキサヒドロ無水フタル酸（例えば、「リカシッ
ドＭＭ」商品名、新日本理化社製、酸無水物当量＝１６
８）とを重量比５０：５０で混合すると共に、シリカの
粒径を１５μｍのもの（例えば「ＲＤ−８ＡＬ」商品
名：龍森社製）を用いた以外は、実施例１と同様に操作
した。得られた樹脂は、下記「表４」に示すように、Ｔ
ｇが１１５℃以上で且つ耐クラック性の高い耐熱性注型
樹脂であった。Example 3 In Example 1 described above,
As the “b) curing agent”, hexahydrophthalic anhydride (for example, “Ricacid HH” trade name, manufactured by Shin Nippon Rika Co., Ltd.) and methyl hexahydrophthalic anhydride (for example, “Ricacid MM” trade name, manufactured by Nippon Rika Co., Ltd.) , Acid anhydride equivalent = 16
8) was mixed at a weight ratio of 50:50, and the same operation as in Example 1 was carried out, except that silica having a particle size of 15 μm (for example, “RD-8AL” (trade name, manufactured by Tatsumori)) was used. did. As shown in Table 4 below, the obtained resin
g was 115 ° C. or higher and a heat-resistant cast resin having high crack resistance.
【００１９】下記「表１」に試験項目及びその条件を、
「表２」〜「表４」にその結果を示す。Table 1 below shows the test items and their conditions.
"Table 2" to "Table 4" show the results.
【００２０】[0020]
【表１】 [Table 1]
【００２１】[0021]
【表２】 [Table 2]
【００２２】[0022]
【表３】 [Table 3]
【００２３】[0023]
【表４】 [Table 4]
【００２４】「表２乃至４」に示すように、本実施例の
組成からなる樹脂は注型用樹脂としての諸特性に優れ、
しかも、Ｔｇが１１５℃以上で耐熱性が高く、かつ耐ク
ラック性も鉄ボルトナットで≦−３０℃をクリアーする
ものであった。また、ポットライフも従来のものに比べ
１０倍も長かった。As shown in Tables 2 to 4, the resin having the composition of the present embodiment has excellent properties as a casting resin.
In addition, the heat resistance was high when Tg was 115 ° C. or more, and the crack resistance was ≦ −30 ° C. with an iron bolt and nut. Also, the pot life was ten times longer than the conventional one.
【００２５】[0025]
【発明の効果】以上のように、これらの組成からなる樹
脂は注型用樹脂としての諸特性に優れ、しかも、Ｔｇが
１１５℃以上で耐熱性が高く、かつ耐クラック性も鉄ボ
ルトナットで≦−３０℃をクリアーする優れた実力をも
つため、電気機器のコンパクト化、高出力化に伴う絶縁
材料の高耐熱性化に対応できる。また、工業的にもポッ
トライフも長いため量産に対応できる。As described above, a resin having these compositions is excellent in various properties as a casting resin, and has a high heat resistance at a Tg of 115 ° C. or more, and has a crack resistance of an iron bolt and nut. Since it has an excellent ability to clear ≦ −30 ° C., it can cope with the downsizing of electric devices and the increase in heat resistance of insulating materials accompanying high output. In addition, since the pot life is long industrially, it can be used for mass production.
Claims (3)
主剤と、硬化剤とからなる電気絶縁用樹脂組成物であっ
て、 上記硬化剤がメチルヘキサヒドロ無水フタル酸又はヘキ
サヒドロ無水フタル酸並びにこれらの混合物からなるこ
とを特徴とする電気絶縁用樹脂組成物。1. An electrical insulating resin composition comprising a main agent comprising a bisphenol-type epoxy resin and a curing agent, wherein the curing agent comprises methylhexahydrophthalic anhydride or hexahydrophthalic anhydride and a mixture thereof. A resin composition for electrical insulation, comprising:
て、 上記主剤がエポキシ樹脂のエポキシ当量が２５０のビス
フェノール型エポキシ樹脂とエポキシ当量が４００のビ
スフェノール型エポキシ樹脂とが、８０：２０で混合し
てなることを特徴とする電気絶縁用樹脂組成物。2. The resin composition for electrical insulation according to claim 1, wherein said base resin is a bisphenol-type epoxy resin having an epoxy equivalent of 250 and a bisphenol-type epoxy resin having an epoxy equivalent of 400 mixed at a ratio of 80:20. A resin composition for electrical insulation characterized by comprising:
を用いてなることを特徴とするエポキシ樹脂注型品。3. An epoxy resin cast product comprising the resin composition for electrical insulation according to claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19097197A JPH1139949A (en) | 1997-07-16 | 1997-07-16 | Injection resin composition for electric apparatus insulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19097197A JPH1139949A (en) | 1997-07-16 | 1997-07-16 | Injection resin composition for electric apparatus insulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1139949A true JPH1139949A (en) | 1999-02-12 |
Family
ID=16266729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19097197A Pending JPH1139949A (en) | 1997-07-16 | 1997-07-16 | Injection resin composition for electric apparatus insulation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1139949A (en) |
-
1997
- 1997-07-16 JP JP19097197A patent/JPH1139949A/en active Pending
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