JPS49100965A - - Google Patents

Info

Publication number
JPS49100965A
JPS49100965A JP48011099A JP1109973A JPS49100965A JP S49100965 A JPS49100965 A JP S49100965A JP 48011099 A JP48011099 A JP 48011099A JP 1109973 A JP1109973 A JP 1109973A JP S49100965 A JPS49100965 A JP S49100965A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48011099A
Other languages
Japanese (ja)
Other versions
JPS5756212B2 (da
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48011099A priority Critical patent/JPS5756212B2/ja
Publication of JPS49100965A publication Critical patent/JPS49100965A/ja
Publication of JPS5756212B2 publication Critical patent/JPS5756212B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP48011099A 1973-01-29 1973-01-29 Expired JPS5756212B2 (da)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48011099A JPS5756212B2 (da) 1973-01-29 1973-01-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48011099A JPS5756212B2 (da) 1973-01-29 1973-01-29

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP56198558A Division JPS57122541A (en) 1981-12-11 1981-12-11 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS49100965A true JPS49100965A (da) 1974-09-24
JPS5756212B2 JPS5756212B2 (da) 1982-11-29

Family

ID=11768542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48011099A Expired JPS5756212B2 (da) 1973-01-29 1973-01-29

Country Status (1)

Country Link
JP (1) JPS5756212B2 (da)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55117271A (en) * 1979-02-28 1980-09-09 Toshiba Corp Semiconductor device
JPS57122541A (en) * 1981-12-11 1982-07-30 Hitachi Ltd Semiconductor device
JPS5957461A (ja) * 1982-09-27 1984-04-03 Fujitsu Ltd 半導体装置
JPS61199046U (da) * 1985-05-31 1986-12-12
JPS63288037A (ja) * 1987-05-20 1988-11-25 Kokusai Boeki Kk 半導体素子の製造方法
JP2007246145A (ja) * 2006-03-17 2007-09-27 Shigenori Saito 穀粒運搬用のコンテナ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55117271A (en) * 1979-02-28 1980-09-09 Toshiba Corp Semiconductor device
JPS57122541A (en) * 1981-12-11 1982-07-30 Hitachi Ltd Semiconductor device
JPS5957461A (ja) * 1982-09-27 1984-04-03 Fujitsu Ltd 半導体装置
JPS61199046U (da) * 1985-05-31 1986-12-12
JPS63288037A (ja) * 1987-05-20 1988-11-25 Kokusai Boeki Kk 半導体素子の製造方法
JP2007246145A (ja) * 2006-03-17 2007-09-27 Shigenori Saito 穀粒運搬用のコンテナ

Also Published As

Publication number Publication date
JPS5756212B2 (da) 1982-11-29

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