JPS5756212B2 - - Google Patents

Info

Publication number: JPS5756212B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP48011099A

Other languages

Japanese (ja)

Other versions

JPS49100965A (da

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-01-29

Filing date

1973-01-29

Publication date

1982-11-29

1973-01-29 Application filed filed Critical

1973-01-29 Priority to JP48011099A priority Critical patent/JPS5756212B2/ja

1974-09-24 Publication of JPS49100965A publication Critical patent/JPS49100965A/ja

1982-11-29 Publication of JPS5756212B2 publication Critical patent/JPS5756212B2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/019—Manufacture or treatment of bond pads
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/922—Bond pads being integral with underlying chip-level interconnections
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/981—Auxiliary members, e.g. spacers
- H10W72/983—Reinforcing structures, e.g. collars

Landscapes

Wire Bonding (AREA)
Electrodes Of Semiconductors (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

JP48011099A 1973-01-29 1973-01-29 Expired JPS5756212B2 (da)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP48011099A JPS5756212B2 (da)	1973-01-29	1973-01-29

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP48011099A JPS5756212B2 (da)	1973-01-29	1973-01-29

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP56198558A Division JPS57122541A (en)	1981-12-11	1981-12-11	Semiconductor device

Publications (2)

Publication Number	Publication Date
JPS49100965A JPS49100965A (da)	1974-09-24
JPS5756212B2 true JPS5756212B2 (da)	1982-11-29

Family

ID=11768542

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP48011099A Expired JPS5756212B2 (da)	1973-01-29	1973-01-29

Country Status (1)

Country	Link
JP (1)	JPS5756212B2 (da)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS55117271A (en) *	1979-02-28	1980-09-09	Toshiba Corp	Semiconductor device
JPS57122541A (en) *	1981-12-11	1982-07-30	Hitachi Ltd	Semiconductor device
JPS5957461A (ja) *	1982-09-27	1984-04-03	Fujitsu Ltd	半導体装置
JPS61199046U (da) *	1985-05-31	1986-12-12
JPS63288037A (ja) *	1987-05-20	1988-11-25	Kokusai Boeki Kk	半導体素子の製造方法
JP4859496B2 (ja) *	2006-03-17	2012-01-25	成徳斎藤	穀粒運搬用のコンテナ

1973
- 1973-01-29 JP JP48011099A patent/JPS5756212B2/ja not_active Expired

Also Published As

Publication number	Publication date
JPS49100965A (da)	1974-09-24

Publication	Publication Date	Title
AR201758A1 (da)	1975-04-15
AR201235Q (da)	1975-02-21
AR201231Q (da)	1975-02-21
AU474593B2 (da)	1976-07-29
AU474511B2 (da)	1976-07-22
AU465453B2 (da)	1975-09-25
AU471343B2 (da)	1976-04-15
AU465434B2 (da)	1975-09-25
AU476714B2 (da)	1976-09-30
AR201229Q (da)	1975-02-21
JPS49100965A (da)	1974-09-24
AU476696B2 (da)	1976-09-30
AU472848B2 (da)	1976-06-03
AR199451A1 (da)	1974-08-30
AU466283B2 (da)	1975-10-23
JPS497072A (da)	1974-01-22
AU477823B2 (da)	1975-06-19
AR195311A1 (da)	1973-09-28
AR196382A1 (da)	1973-12-18
AR210729A1 (da)	1977-09-15
AU477824B2 (da)	1975-07-17
AR200256A1 (da)	1974-10-31
AU461342B2 (da)	1975-05-22
AR195948A1 (da)	1973-11-15
AR200885A1 (da)	1974-12-27