JPS4931747A - - Google Patents

Info

Publication number
JPS4931747A
JPS4931747A JP48041516A JP4151673A JPS4931747A JP S4931747 A JPS4931747 A JP S4931747A JP 48041516 A JP48041516 A JP 48041516A JP 4151673 A JP4151673 A JP 4151673A JP S4931747 A JPS4931747 A JP S4931747A
Authority
JP
Japan
Prior art keywords
microcircuit
bonded
novolac
epoxy
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48041516A
Other languages
English (en)
Japanese (ja)
Other versions
JPS521738B2 (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4931747A publication Critical patent/JPS4931747A/ja
Publication of JPS521738B2 publication Critical patent/JPS521738B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP48041516A 1972-05-31 1973-04-13 Expired JPS521738B2 (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25816772A 1972-05-31 1972-05-31

Publications (2)

Publication Number Publication Date
JPS4931747A true JPS4931747A (2) 1974-03-22
JPS521738B2 JPS521738B2 (2) 1977-01-18

Family

ID=22979383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48041516A Expired JPS521738B2 (2) 1972-05-31 1973-04-13

Country Status (5)

Country Link
JP (1) JPS521738B2 (2)
DE (1) DE2315714A1 (2)
FR (1) FR2186732A1 (2)
GB (1) GB1419163A (2)
IT (1) IT981202B (2)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5179533A (ja) * 1975-01-06 1976-07-10 Nippon Telegraph & Telephone Kikairohakyohenkanshi
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
JPS5491180A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS5491178A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS54121673A (en) * 1978-03-15 1979-09-20 Hitachi Ltd Insulator coating material and semiconductor device using the said material
JPS5582125A (en) * 1978-12-19 1980-06-20 Dainippon Toryo Co Ltd Preparation of resin particle

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2097998B (en) * 1981-05-06 1985-05-30 Standard Telephones Cables Ltd Mounting of integrated circuits
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5179533A (ja) * 1975-01-06 1976-07-10 Nippon Telegraph & Telephone Kikairohakyohenkanshi
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
JPS5491180A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS5491178A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS54121673A (en) * 1978-03-15 1979-09-20 Hitachi Ltd Insulator coating material and semiconductor device using the said material
JPS5582125A (en) * 1978-12-19 1980-06-20 Dainippon Toryo Co Ltd Preparation of resin particle

Also Published As

Publication number Publication date
FR2186732A1 (2) 1974-01-11
IT981202B (it) 1974-10-10
GB1419163A (en) 1975-12-24
DE2315714A1 (de) 1973-12-20
JPS521738B2 (2) 1977-01-18

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