JPS521738B2 - - Google Patents

Info

Publication number
JPS521738B2
JPS521738B2 JP48041516A JP4151673A JPS521738B2 JP S521738 B2 JPS521738 B2 JP S521738B2 JP 48041516 A JP48041516 A JP 48041516A JP 4151673 A JP4151673 A JP 4151673A JP S521738 B2 JPS521738 B2 JP S521738B2
Authority
JP
Japan
Prior art keywords
microcircuit
bonded
novolac
epoxy
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP48041516A
Other languages
English (en)
Japanese (ja)
Other versions
JPS4931747A (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4931747A publication Critical patent/JPS4931747A/ja
Publication of JPS521738B2 publication Critical patent/JPS521738B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP48041516A 1972-05-31 1973-04-13 Expired JPS521738B2 (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25816772A 1972-05-31 1972-05-31

Publications (2)

Publication Number Publication Date
JPS4931747A JPS4931747A (2) 1974-03-22
JPS521738B2 true JPS521738B2 (2) 1977-01-18

Family

ID=22979383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48041516A Expired JPS521738B2 (2) 1972-05-31 1973-04-13

Country Status (5)

Country Link
JP (1) JPS521738B2 (2)
DE (1) DE2315714A1 (2)
FR (1) FR2186732A1 (2)
GB (1) GB1419163A (2)
IT (1) IT981202B (2)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584842B2 (ja) * 1975-01-06 1983-01-28 日本電信電話株式会社 機械「ろ」波器用変換子の製造方法
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
JPS5491178A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS5491180A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS54121673A (en) * 1978-03-15 1979-09-20 Hitachi Ltd Insulator coating material and semiconductor device using the said material
JPS5582125A (en) * 1978-12-19 1980-06-20 Dainippon Toryo Co Ltd Preparation of resin particle
GB2097998B (en) * 1981-05-06 1985-05-30 Standard Telephones Cables Ltd Mounting of integrated circuits
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink

Also Published As

Publication number Publication date
FR2186732A1 (2) 1974-01-11
IT981202B (it) 1974-10-10
JPS4931747A (2) 1974-03-22
GB1419163A (en) 1975-12-24
DE2315714A1 (de) 1973-12-20

Similar Documents

Publication Publication Date Title
JPS6436496A (en) Carrier element incorporated into identification card
MY139067A (en) High performance chip packaging method
JPS521738B2 (2)
EP0204568A3 (en) Low power circuitry components
CA939094A (en) Phenoxy, epoxy resin adhesive for making printed circuit board
JPS56161696A (en) Board
JPS59188955A (ja) 半導体装置
JPS5943554A (ja) 樹脂封止半導体装置
JPS5277587A (en) Wiring of integrated circuit outside chip
JPS6476741A (en) Semiconductor device
IE850184L (en) Circuit boards made of laminates
GB1282394A (en) Printed circuit assembly
JPS57204154A (en) Structure of chip carrier
JP2661101B2 (ja) Ｉｃカード
ES295772Y (es) Un encapsulado plano para pastillas de memoria de circuito integrado, de aplicacion especial a circuitos de aviacion
JPS5243838A (en) Electro-conductive adhesive
JPS6489356A (en) Hybrid integrated circuit
GB1509344A (en) Assembly of an integrated circuit chip and printed circuit board
JPS58111946U (ja) 電子部品
JPS6355943A (ja) チツプキヤリア
ATE51455T1 (de) Datenverarbeitungssystem in einer karte und verfahren zu dessen herstellung.
JPS5872871U (ja) 電子部品
JPS58204545A (ja) Ｉｃの封止方法
JPS62133742A (ja) パツケ−ジ
JPH027546A (ja) 樹脂封止型混成集積回路装置