JPS50143072A - - Google Patents
Info
- Publication number
- JPS50143072A JPS50143072A JP5031074A JP5031074A JPS50143072A JP S50143072 A JPS50143072 A JP S50143072A JP 5031074 A JP5031074 A JP 5031074A JP 5031074 A JP5031074 A JP 5031074A JP S50143072 A JPS50143072 A JP S50143072A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5031074A JPS50143072A (he) | 1974-05-08 | 1974-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5031074A JPS50143072A (he) | 1974-05-08 | 1974-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50143072A true JPS50143072A (he) | 1975-11-18 |
Family
ID=12855306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5031074A Pending JPS50143072A (he) | 1974-05-08 | 1974-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50143072A (he) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157555U (he) * | 1984-09-20 | 1986-04-17 | ||
| JPS61205145U (he) * | 1986-06-12 | 1986-12-24 | ||
| JPH0268981A (ja) * | 1988-09-02 | 1990-03-08 | Matsushita Electric Works Ltd | 金属ベース配線基板 |
| JPH05327152A (ja) * | 1992-05-18 | 1993-12-10 | Sanken Electric Co Ltd | 配線基板及びその製造方法 |
| JPH07142832A (ja) * | 1993-11-12 | 1995-06-02 | Nec Corp | プリント基板およびそれを用いた電子回路 |
| JP2012064914A (ja) * | 2010-09-16 | 2012-03-29 | Samsung Electro-Mechanics Co Ltd | 放熱基板及びその製造方法 |
-
1974
- 1974-05-08 JP JP5031074A patent/JPS50143072A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157555U (he) * | 1984-09-20 | 1986-04-17 | ||
| JPS61205145U (he) * | 1986-06-12 | 1986-12-24 | ||
| JPH0268981A (ja) * | 1988-09-02 | 1990-03-08 | Matsushita Electric Works Ltd | 金属ベース配線基板 |
| JPH05327152A (ja) * | 1992-05-18 | 1993-12-10 | Sanken Electric Co Ltd | 配線基板及びその製造方法 |
| JPH07142832A (ja) * | 1993-11-12 | 1995-06-02 | Nec Corp | プリント基板およびそれを用いた電子回路 |
| JP2012064914A (ja) * | 2010-09-16 | 2012-03-29 | Samsung Electro-Mechanics Co Ltd | 放熱基板及びその製造方法 |