JPS50160773A - - Google Patents
Info
- Publication number
- JPS50160773A JPS50160773A JP49068765A JP6876574A JPS50160773A JP S50160773 A JPS50160773 A JP S50160773A JP 49068765 A JP49068765 A JP 49068765A JP 6876574 A JP6876574 A JP 6876574A JP S50160773 A JPS50160773 A JP S50160773A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49068765A JPS50160773A (it) | 1974-06-18 | 1974-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49068765A JPS50160773A (it) | 1974-06-18 | 1974-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50160773A true JPS50160773A (it) | 1975-12-26 |
Family
ID=13383147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49068765A Pending JPS50160773A (it) | 1974-06-18 | 1974-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50160773A (it) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57163919A (en) * | 1981-03-20 | 1982-10-08 | Philips Nv | Method of forming protruded contact |
| JPS5940537A (ja) * | 1982-08-28 | 1984-03-06 | Rohm Co Ltd | 半導体装置の製造方法 |
| JPS6254500A (ja) * | 1985-09-02 | 1987-03-10 | 松下電器産業株式会社 | ワイヤ接続方法 |
| JPS6266641A (ja) * | 1985-09-19 | 1987-03-26 | Rohm Co Ltd | 半導体ペレツトのダイボンデイング方法 |
| EP2768015A4 (en) * | 2012-12-21 | 2015-07-29 | Huawei Tech Co Ltd | EUTEKTICAL GOLD / SILICON CHIP SOLDERING PROCESS AND TRANSISTOR |
-
1974
- 1974-06-18 JP JP49068765A patent/JPS50160773A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57163919A (en) * | 1981-03-20 | 1982-10-08 | Philips Nv | Method of forming protruded contact |
| JPS5940537A (ja) * | 1982-08-28 | 1984-03-06 | Rohm Co Ltd | 半導体装置の製造方法 |
| JPS6254500A (ja) * | 1985-09-02 | 1987-03-10 | 松下電器産業株式会社 | ワイヤ接続方法 |
| JPS6266641A (ja) * | 1985-09-19 | 1987-03-26 | Rohm Co Ltd | 半導体ペレツトのダイボンデイング方法 |
| EP2768015A4 (en) * | 2012-12-21 | 2015-07-29 | Huawei Tech Co Ltd | EUTEKTICAL GOLD / SILICON CHIP SOLDERING PROCESS AND TRANSISTOR |