JPS5029163A - - Google Patents
Info
- Publication number
- JPS5029163A JPS5029163A JP7991673A JP7991673A JPS5029163A JP S5029163 A JPS5029163 A JP S5029163A JP 7991673 A JP7991673 A JP 7991673A JP 7991673 A JP7991673 A JP 7991673A JP S5029163 A JPS5029163 A JP S5029163A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7991673A JPS5029163A (cs) | 1973-07-17 | 1973-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7991673A JPS5029163A (cs) | 1973-07-17 | 1973-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5029163A true JPS5029163A (cs) | 1975-03-25 |
Family
ID=13703605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7991673A Pending JPS5029163A (cs) | 1973-07-17 | 1973-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5029163A (cs) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53762U (cs) * | 1976-06-23 | 1978-01-06 | ||
| JPS58192354A (ja) * | 1982-05-07 | 1983-11-09 | Hitachi Ltd | 半導体装置 |
| JPH024263U (cs) * | 1988-06-20 | 1990-01-11 | ||
| JPH02271185A (ja) * | 1989-04-13 | 1990-11-06 | Fujitsu Ltd | バルブ機構 |
| JPH03152966A (ja) * | 1989-11-09 | 1991-06-28 | Nec Corp | 半導体装置用リードフレーム |
| JPH03256353A (ja) * | 1990-03-06 | 1991-11-15 | Toshiba Corp | 半導体装置 |
-
1973
- 1973-07-17 JP JP7991673A patent/JPS5029163A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53762U (cs) * | 1976-06-23 | 1978-01-06 | ||
| JPS58192354A (ja) * | 1982-05-07 | 1983-11-09 | Hitachi Ltd | 半導体装置 |
| JPH024263U (cs) * | 1988-06-20 | 1990-01-11 | ||
| JPH02271185A (ja) * | 1989-04-13 | 1990-11-06 | Fujitsu Ltd | バルブ機構 |
| JPH03152966A (ja) * | 1989-11-09 | 1991-06-28 | Nec Corp | 半導体装置用リードフレーム |
| JPH03256353A (ja) * | 1990-03-06 | 1991-11-15 | Toshiba Corp | 半導体装置 |