JPS5087587A - - Google Patents

Info

Publication number
JPS5087587A
JPS5087587A JP49139419A JP13941974A JPS5087587A JP S5087587 A JPS5087587 A JP S5087587A JP 49139419 A JP49139419 A JP 49139419A JP 13941974 A JP13941974 A JP 13941974A JP S5087587 A JPS5087587 A JP S5087587A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49139419A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5087587A publication Critical patent/JPS5087587A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/411Chip-supporting parts, e.g. die pads
    • H10W70/415Leadframe inner leads serving as die pads
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/421Shapes or dispositions
    • H10W70/424Cross-sectional shapes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/15Containers comprising an insulating or insulated base
    • H10W76/157Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
JP49139419A 1973-12-03 1974-12-03 Pending JPS5087587A (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42100473A 1973-12-03 1973-12-03

Publications (1)

Publication Number Publication Date
JPS5087587A true JPS5087587A (2) 1975-07-14

Family

ID=23668787

Family Applications (2)

Application Number Title Priority Date Filing Date
JP49139419A Pending JPS5087587A (2) 1973-12-03 1974-12-03
JP1982102415U Pending JPS5860940U (ja) 1973-12-03 1982-07-06 半導体パツケイジ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP1982102415U Pending JPS5860940U (ja) 1973-12-03 1982-07-06 半導体パツケイジ

Country Status (7)

Country Link
JP (2) JPS5087587A (2)
CA (1) CA1032276A (2)
CH (1) CH585968A5 (2)
DE (1) DE2456951A1 (2)
FR (1) FR2253282B1 (2)
GB (1) GB1458846A (2)
SE (1) SE403852B (2)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2485262A1 (fr) * 1980-06-19 1981-12-24 Thomson Csf Boitier d'encapsulation resistant a de fortes pressions externes
US4577214A (en) * 1981-05-06 1986-03-18 At&T Bell Laboratories Low-inductance power/ground distribution in a package for a semiconductor chip
JPH04120765A (ja) * 1990-09-12 1992-04-21 Seiko Epson Corp 半導体装置とその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4727491U (2) * 1971-04-17 1972-11-28
JPS4836983A (2) * 1971-09-10 1973-05-31

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3436810A (en) * 1967-07-17 1969-04-08 Jade Corp Method of packaging integrated circuits
DE2003423C3 (de) * 1970-01-27 1975-11-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren von Halbleiteranordnungen
US3668770A (en) * 1970-05-25 1972-06-13 Rca Corp Method of connecting semiconductor device to terminals of package
US3659035A (en) * 1971-04-26 1972-04-25 Rca Corp Semiconductor device package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4727491U (2) * 1971-04-17 1972-11-28
JPS4836983A (2) * 1971-09-10 1973-05-31

Also Published As

Publication number Publication date
SE7415064L (2) 1975-06-04
JPS5860940U (ja) 1983-04-25
CA1032276A (en) 1978-05-30
FR2253282A1 (2) 1975-06-27
DE2456951A1 (de) 1975-06-05
CH585968A5 (2) 1977-03-15
SE403852B (sv) 1978-09-04
FR2253282B1 (2) 1980-09-12
GB1458846A (en) 1976-12-15

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