JPS51114870A - Semiconductor device manufacturing method - Google Patents

Semiconductor device manufacturing method

Info

Publication number
JPS51114870A
JPS51114870A JP3908475A JP3908475A JPS51114870A JP S51114870 A JPS51114870 A JP S51114870A JP 3908475 A JP3908475 A JP 3908475A JP 3908475 A JP3908475 A JP 3908475A JP S51114870 A JPS51114870 A JP S51114870A
Authority
JP
Japan
Prior art keywords
semiconductor device
device manufacturing
frames
improve
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3908475A
Other languages
Japanese (ja)
Other versions
JPS5842617B2 (en
Inventor
Tsutomu Mimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50039084A priority Critical patent/JPS5842617B2/en
Publication of JPS51114870A publication Critical patent/JPS51114870A/en
Publication of JPS5842617B2 publication Critical patent/JPS5842617B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: Improve the heating effect of frames in the semiconductor device manufacturing equipment which has heating blocks to heat frames made by punching metal plates on which semiconductor devices are to be mounted.
COPYRIGHT: (C)1976,JPO&Japio
JP50039084A 1975-04-02 1975-04-02 hand tai souchi no seizou sochi Expired JPS5842617B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50039084A JPS5842617B2 (en) 1975-04-02 1975-04-02 hand tai souchi no seizou sochi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50039084A JPS5842617B2 (en) 1975-04-02 1975-04-02 hand tai souchi no seizou sochi

Publications (2)

Publication Number Publication Date
JPS51114870A true JPS51114870A (en) 1976-10-08
JPS5842617B2 JPS5842617B2 (en) 1983-09-21

Family

ID=12543213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50039084A Expired JPS5842617B2 (en) 1975-04-02 1975-04-02 hand tai souchi no seizou sochi

Country Status (1)

Country Link
JP (1) JPS5842617B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111767A (en) * 1978-02-21 1979-09-01 Nec Corp Manufacture for semiconductor device
JPS56108238A (en) * 1980-01-31 1981-08-27 Toshiba Corp Assembling apparatus for semiconductor
JPS56139244U (en) * 1980-03-19 1981-10-21

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111767A (en) * 1978-02-21 1979-09-01 Nec Corp Manufacture for semiconductor device
JPS56108238A (en) * 1980-01-31 1981-08-27 Toshiba Corp Assembling apparatus for semiconductor
JPS56139244U (en) * 1980-03-19 1981-10-21

Also Published As

Publication number Publication date
JPS5842617B2 (en) 1983-09-21

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