JPS5393780A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5393780A
JPS5393780A JP833677A JP833677A JPS5393780A JP S5393780 A JPS5393780 A JP S5393780A JP 833677 A JP833677 A JP 833677A JP 833677 A JP833677 A JP 833677A JP S5393780 A JPS5393780 A JP S5393780A
Authority
JP
Japan
Prior art keywords
production
elements
semiconductor device
solder
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP833677A
Other languages
Japanese (ja)
Other versions
JPS575055B2 (en
Inventor
Taku Aoki
Shigeo Mizogami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP833677A priority Critical patent/JPS5393780A/en
Publication of JPS5393780A publication Critical patent/JPS5393780A/en
Publication of JPS575055B2 publication Critical patent/JPS575055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To improve the reliablity of semiconductor devices by vertically moving the elements thereby improving the fitting between the elements and solder members and further effectively removing released gas in the process of solder mounting the semiconductor elements to stems.
COPYRIGHT: (C)1978,JPO&Japio
JP833677A 1977-01-27 1977-01-27 Production of semiconductor device Granted JPS5393780A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP833677A JPS5393780A (en) 1977-01-27 1977-01-27 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP833677A JPS5393780A (en) 1977-01-27 1977-01-27 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5393780A true JPS5393780A (en) 1978-08-17
JPS575055B2 JPS575055B2 (en) 1982-01-28

Family

ID=11690341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP833677A Granted JPS5393780A (en) 1977-01-27 1977-01-27 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5393780A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244732A (en) * 1989-03-17 1990-09-28 Sanken Electric Co Ltd Fixing method for electronic element
JPH02244731A (en) * 1989-03-17 1990-09-28 Sanken Electric Co Ltd Fixing method for electronic component
US5601493A (en) * 1992-10-22 1997-02-11 Sumitomo Chemical Company Limited Drive shaft made of fiber reinforced plastics, and method for connecting pipe made of fire-reinforced plastics

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622652U (en) * 1985-06-20 1987-01-09

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244732A (en) * 1989-03-17 1990-09-28 Sanken Electric Co Ltd Fixing method for electronic element
JPH02244731A (en) * 1989-03-17 1990-09-28 Sanken Electric Co Ltd Fixing method for electronic component
US5601493A (en) * 1992-10-22 1997-02-11 Sumitomo Chemical Company Limited Drive shaft made of fiber reinforced plastics, and method for connecting pipe made of fire-reinforced plastics

Also Published As

Publication number Publication date
JPS575055B2 (en) 1982-01-28

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