JPS51138163A - Production method of semiconductor device - Google Patents

Production method of semiconductor device

Info

Publication number
JPS51138163A
JPS51138163A JP50062374A JP6237475A JPS51138163A JP S51138163 A JPS51138163 A JP S51138163A JP 50062374 A JP50062374 A JP 50062374A JP 6237475 A JP6237475 A JP 6237475A JP S51138163 A JPS51138163 A JP S51138163A
Authority
JP
Japan
Prior art keywords
semiconductor device
production method
series
efficiency
improve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50062374A
Other languages
Japanese (ja)
Other versions
JPS589586B2 (en
Inventor
Tadashi Katsura
Katsuki Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50062374A priority Critical patent/JPS589586B2/en
Publication of JPS51138163A publication Critical patent/JPS51138163A/en
Publication of JPS589586B2 publication Critical patent/JPS589586B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the efficiency of manufacturing semiconductors through a series of continuous operations by performing several kinds of processes feeding the long lead wire material.
JP50062374A 1975-05-23 1975-05-23 hand tai souchi no seizou houhou Expired JPS589586B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50062374A JPS589586B2 (en) 1975-05-23 1975-05-23 hand tai souchi no seizou houhou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50062374A JPS589586B2 (en) 1975-05-23 1975-05-23 hand tai souchi no seizou houhou

Publications (2)

Publication Number Publication Date
JPS51138163A true JPS51138163A (en) 1976-11-29
JPS589586B2 JPS589586B2 (en) 1983-02-22

Family

ID=13198268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50062374A Expired JPS589586B2 (en) 1975-05-23 1975-05-23 hand tai souchi no seizou houhou

Country Status (1)

Country Link
JP (1) JPS589586B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59222692A (en) * 1983-06-01 1984-12-14 三菱樹脂株式会社 pipe fittings
JPS60184794A (en) * 1984-03-02 1985-09-20 動力炉・核燃料開発事業団 Remotely detachable joint

Also Published As

Publication number Publication date
JPS589586B2 (en) 1983-02-22

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