JPS51150277A - Manufacturing method of semiconductor device - Google Patents

Manufacturing method of semiconductor device

Info

Publication number
JPS51150277A
JPS51150277A JP50074777A JP7477775A JPS51150277A JP S51150277 A JPS51150277 A JP S51150277A JP 50074777 A JP50074777 A JP 50074777A JP 7477775 A JP7477775 A JP 7477775A JP S51150277 A JPS51150277 A JP S51150277A
Authority
JP
Japan
Prior art keywords
manufacturing
semiconductor device
minimum
reduced
heat radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50074777A
Other languages
Japanese (ja)
Inventor
Yasuo Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP50074777A priority Critical patent/JPS51150277A/en
Publication of JPS51150277A publication Critical patent/JPS51150277A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Junction Field-Effect Transistors (AREA)

Abstract

PURPOSE:A manufacturing method of a semiconductor device, including a power transistor requiring heat radiating property, by which material loss due to defective products is reduced to minimum.
JP50074777A 1975-06-18 1975-06-18 Manufacturing method of semiconductor device Pending JPS51150277A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50074777A JPS51150277A (en) 1975-06-18 1975-06-18 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50074777A JPS51150277A (en) 1975-06-18 1975-06-18 Manufacturing method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS51150277A true JPS51150277A (en) 1976-12-23

Family

ID=13557050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50074777A Pending JPS51150277A (en) 1975-06-18 1975-06-18 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS51150277A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4818954B1 (en) * 1969-09-13 1973-06-09
JPS4969084A (en) * 1972-11-08 1974-07-04

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4818954B1 (en) * 1969-09-13 1973-06-09
JPS4969084A (en) * 1972-11-08 1974-07-04

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