JPS51138179A - Semi-conductor device - Google Patents

Semi-conductor device

Info

Publication number
JPS51138179A
JPS51138179A JP50062193A JP6219375A JPS51138179A JP S51138179 A JPS51138179 A JP S51138179A JP 50062193 A JP50062193 A JP 50062193A JP 6219375 A JP6219375 A JP 6219375A JP S51138179 A JPS51138179 A JP S51138179A
Authority
JP
Japan
Prior art keywords
semi
conductor device
circuit
chip
constitute
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50062193A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5619101B2 (de
Inventor
Susumu Kotake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP50062193A priority Critical patent/JPS51138179A/ja
Priority to GB21179/76A priority patent/GB1552144A/en
Publication of JPS51138179A publication Critical patent/JPS51138179A/ja
Publication of JPS5619101B2 publication Critical patent/JPS5619101B2/ja
Priority to HK494/82A priority patent/HK49482A/xx
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
    • H10W20/493—Fuses, i.e. interconnections changeable from conductive to non-conductive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Electric Clocks (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP50062193A 1975-05-23 1975-05-23 Semi-conductor device Granted JPS51138179A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP50062193A JPS51138179A (en) 1975-05-23 1975-05-23 Semi-conductor device
GB21179/76A GB1552144A (en) 1975-05-23 1976-05-21 Semi-conductor device
HK494/82A HK49482A (en) 1975-05-23 1982-11-25 Semi-conductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50062193A JPS51138179A (en) 1975-05-23 1975-05-23 Semi-conductor device

Publications (2)

Publication Number Publication Date
JPS51138179A true JPS51138179A (en) 1976-11-29
JPS5619101B2 JPS5619101B2 (de) 1981-05-06

Family

ID=13193055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50062193A Granted JPS51138179A (en) 1975-05-23 1975-05-23 Semi-conductor device

Country Status (3)

Country Link
JP (1) JPS51138179A (de)
GB (1) GB1552144A (de)
HK (1) HK49482A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171152A (ja) * 1983-03-17 1984-09-27 Nec Corp 半導体装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2046024B (en) * 1979-03-30 1983-01-26 Ferranti Ltd Circuit assembly
US4484213A (en) * 1982-02-19 1984-11-20 Solitron Devices, Inc. Binary weighted resistor and package
FR2524707B1 (fr) * 1982-04-01 1985-05-31 Cit Alcatel Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus
FR2818404B1 (fr) * 2000-12-19 2003-03-21 Valeo Climatisation Procede de programmation de l'adresse d'un peripherique et peripherique pour sa mise en oeuvre

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171152A (ja) * 1983-03-17 1984-09-27 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPS5619101B2 (de) 1981-05-06
GB1552144A (en) 1979-09-12
HK49482A (en) 1982-12-03

Similar Documents

Publication Publication Date Title
JPS51139281A (en) Semi-conductor device
JPS528785A (en) Semiconductor device electrode structure
JPS5210074A (en) Intergrated circuit device
JPS5394875A (en) Package for semiconductor element
JPS51138179A (en) Semi-conductor device
JPS5251879A (en) Semiconductor integrated circuit
JPS522173A (en) Semiconductor integrated circuit
JPS5333574A (en) Semiconductor integrated circuit package
JPS5279658A (en) Semiconductor device
JPS5273693A (en) Display device
JPS52149481A (en) Semiconductor integrated circuit device and its production
JPS527676A (en) Semiconductor integrated circuit
JPS5432075A (en) Semiconductor device
JPS5348463A (en) Semiconductor integrated circuit support
JPS5279659A (en) Semiconductor device
JPS5252370A (en) Fabrication of glass-sealed semiconductor device
JPS51147921A (en) Memory device
JPS5250167A (en) Semiconductor device
JPS52125272A (en) Substrate to which semiconductor device is mounted
JPS5360170A (en) Input/output pads of ic chip
JPS5411673A (en) Semiconductor chip
JPS5325394A (en) Se miconductor device
JPS51139287A (en) Semi-conductor integrated circuit device
JPS542664A (en) Semiconductor device
JPS52117067A (en) Semiconductor device