JPS51150985A - Fabrication method of semiconductor device - Google Patents

Fabrication method of semiconductor device

Info

Publication number
JPS51150985A
JPS51150985A JP50074904A JP7490475A JPS51150985A JP S51150985 A JPS51150985 A JP S51150985A JP 50074904 A JP50074904 A JP 50074904A JP 7490475 A JP7490475 A JP 7490475A JP S51150985 A JPS51150985 A JP S51150985A
Authority
JP
Japan
Prior art keywords
semiconductor device
fabrication method
fabricate
wiring
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50074904A
Other languages
Japanese (ja)
Inventor
Shinichi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50074904A priority Critical patent/JPS51150985A/en
Publication of JPS51150985A publication Critical patent/JPS51150985A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Local Oxidation Of Silicon (AREA)

Abstract

PURPOSE: How to fabricate a semiconductor device which is excellent in durability against erosion and in securing separation of each wiring and also has a part of metal layer inside.
COPYRIGHT: (C)1976,JPO&Japio
JP50074904A 1975-06-19 1975-06-19 Fabrication method of semiconductor device Pending JPS51150985A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50074904A JPS51150985A (en) 1975-06-19 1975-06-19 Fabrication method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50074904A JPS51150985A (en) 1975-06-19 1975-06-19 Fabrication method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS51150985A true JPS51150985A (en) 1976-12-24

Family

ID=13560831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50074904A Pending JPS51150985A (en) 1975-06-19 1975-06-19 Fabrication method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS51150985A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235647A (en) * 1985-08-09 1987-02-16 Mitsubishi Electric Corp semiconductor equipment
JPS62222653A (en) * 1985-11-18 1987-09-30 Mitsubishi Electric Corp Semiconductor device and its manufacturing method
JPH02249230A (en) * 1988-11-25 1990-10-05 Fujitsu Ltd Forming method for metal electrode

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5186968A (en) * 1975-01-29 1976-07-30 Kyushu Nippon Electric HANDOTAISOCHINOSEIZOHOHO

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5186968A (en) * 1975-01-29 1976-07-30 Kyushu Nippon Electric HANDOTAISOCHINOSEIZOHOHO

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235647A (en) * 1985-08-09 1987-02-16 Mitsubishi Electric Corp semiconductor equipment
JPS62222653A (en) * 1985-11-18 1987-09-30 Mitsubishi Electric Corp Semiconductor device and its manufacturing method
JPH02249230A (en) * 1988-11-25 1990-10-05 Fujitsu Ltd Forming method for metal electrode

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