JPS52147067A - Connecting method of semiconductor device - Google Patents

Connecting method of semiconductor device

Info

Publication number
JPS52147067A
JPS52147067A JP6361376A JP6361376A JPS52147067A JP S52147067 A JPS52147067 A JP S52147067A JP 6361376 A JP6361376 A JP 6361376A JP 6361376 A JP6361376 A JP 6361376A JP S52147067 A JPS52147067 A JP S52147067A
Authority
JP
Japan
Prior art keywords
brazing material
semiconductor device
connecting method
fuse
disperse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6361376A
Other languages
Japanese (ja)
Inventor
Mikio Hirano
Tetsuya Hayashida
Hiroshi Yamamoto
Yukiyoshi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6361376A priority Critical patent/JPS52147067A/en
Publication of JPS52147067A publication Critical patent/JPS52147067A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To perform satisfactory connection by heating under pressure leads and bump electrodes via brazing material to fuse the brazing material and allow the fused brazing material to penetrate and disperse into both electrodes thereby forming diffused alloy phase.
COPYRIGHT: (C)1977,JPO&Japio
JP6361376A 1976-06-02 1976-06-02 Connecting method of semiconductor device Pending JPS52147067A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6361376A JPS52147067A (en) 1976-06-02 1976-06-02 Connecting method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6361376A JPS52147067A (en) 1976-06-02 1976-06-02 Connecting method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS52147067A true JPS52147067A (en) 1977-12-07

Family

ID=13234317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6361376A Pending JPS52147067A (en) 1976-06-02 1976-06-02 Connecting method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS52147067A (en)

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