JPS5216166A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5216166A
JPS5216166A JP50092773A JP9277375A JPS5216166A JP S5216166 A JPS5216166 A JP S5216166A JP 50092773 A JP50092773 A JP 50092773A JP 9277375 A JP9277375 A JP 9277375A JP S5216166 A JPS5216166 A JP S5216166A
Authority
JP
Japan
Prior art keywords
semiconductor device
thinning
projection
electrode
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50092773A
Other languages
Japanese (ja)
Other versions
JPS5712295B2 (en
Inventor
Masaharu Noyori
Isamu Kitahiro
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP50092773A priority Critical patent/JPS5216166A/en
Publication of JPS5216166A publication Critical patent/JPS5216166A/en
Publication of JPS5712295B2 publication Critical patent/JPS5712295B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To perform the electric connection easily without forming a projection at the connection of the electrode of the semiconductor element, and to make the thinning of the package possible.
COPYRIGHT: (C)1977,JPO&Japio
JP50092773A 1975-07-29 1975-07-29 Semiconductor device Granted JPS5216166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50092773A JPS5216166A (en) 1975-07-29 1975-07-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50092773A JPS5216166A (en) 1975-07-29 1975-07-29 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5216166A true JPS5216166A (en) 1977-02-07
JPS5712295B2 JPS5712295B2 (en) 1982-03-10

Family

ID=14063727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50092773A Granted JPS5216166A (en) 1975-07-29 1975-07-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5216166A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139972A (en) * 1977-05-13 1978-12-06 Matsushita Electric Ind Co Ltd Production of semiconductor device
JPS5630782A (en) * 1979-08-20 1981-03-27 Matsushita Electric Industrial Co Ltd Electronic circuit device and method of manufacturing same
US5452182A (en) * 1990-04-05 1995-09-19 Martin Marietta Corporation Flexible high density interconnect structure and flexibly interconnected system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59180798U (en) * 1983-05-18 1984-12-03 岡山日章プラント株式会社 Screen waste transfer hole

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139972A (en) * 1977-05-13 1978-12-06 Matsushita Electric Ind Co Ltd Production of semiconductor device
JPS5630782A (en) * 1979-08-20 1981-03-27 Matsushita Electric Industrial Co Ltd Electronic circuit device and method of manufacturing same
US5452182A (en) * 1990-04-05 1995-09-19 Martin Marietta Corporation Flexible high density interconnect structure and flexibly interconnected system

Also Published As

Publication number Publication date
JPS5712295B2 (en) 1982-03-10

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