JPS5219076A - Production method of semiconductor package - Google Patents

Production method of semiconductor package

Info

Publication number
JPS5219076A
JPS5219076A JP9471675A JP9471675A JPS5219076A JP S5219076 A JPS5219076 A JP S5219076A JP 9471675 A JP9471675 A JP 9471675A JP 9471675 A JP9471675 A JP 9471675A JP S5219076 A JPS5219076 A JP S5219076A
Authority
JP
Japan
Prior art keywords
semiconductor package
production method
base
plate
noelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9471675A
Other languages
Japanese (ja)
Other versions
JPS5731296B2 (en
Inventor
Mitsuru Seto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9471675A priority Critical patent/JPS5219076A/en
Publication of JPS5219076A publication Critical patent/JPS5219076A/en
Publication of JPS5731296B2 publication Critical patent/JPS5731296B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: In order to simplify the process of production according to Pd noelectric field plating method, when producing a semiconductor package by forming the multilayer distribution on the surface of base-plate and the external lead use pad on the back of base-plate respectively.
COPYRIGHT: (C)1977,JPO&Japio
JP9471675A 1975-08-05 1975-08-05 Production method of semiconductor package Granted JPS5219076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9471675A JPS5219076A (en) 1975-08-05 1975-08-05 Production method of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9471675A JPS5219076A (en) 1975-08-05 1975-08-05 Production method of semiconductor package

Publications (2)

Publication Number Publication Date
JPS5219076A true JPS5219076A (en) 1977-01-14
JPS5731296B2 JPS5731296B2 (en) 1982-07-03

Family

ID=14117850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9471675A Granted JPS5219076A (en) 1975-08-05 1975-08-05 Production method of semiconductor package

Country Status (1)

Country Link
JP (1) JPS5219076A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59168659A (en) * 1983-03-15 1984-09-22 Furukawa Electric Co Ltd:The Lead frame for integrated circuit

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4957371A (en) * 1972-10-04 1974-06-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4957371A (en) * 1972-10-04 1974-06-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59168659A (en) * 1983-03-15 1984-09-22 Furukawa Electric Co Ltd:The Lead frame for integrated circuit

Also Published As

Publication number Publication date
JPS5731296B2 (en) 1982-07-03

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