JPS522385A - Semiconductor device manufacturing method - Google Patents

Semiconductor device manufacturing method

Info

Publication number
JPS522385A
JPS522385A JP50077953A JP7795375A JPS522385A JP S522385 A JPS522385 A JP S522385A JP 50077953 A JP50077953 A JP 50077953A JP 7795375 A JP7795375 A JP 7795375A JP S522385 A JPS522385 A JP S522385A
Authority
JP
Japan
Prior art keywords
semiconductor device
device manufacturing
cracks
integration
leakage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50077953A
Other languages
Japanese (ja)
Inventor
Yoichi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwatsu Electric Co Ltd
Iwasaki Tsushinki KK
Original Assignee
Iwatsu Electric Co Ltd
Iwasaki Tsushinki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwatsu Electric Co Ltd, Iwasaki Tsushinki KK filed Critical Iwatsu Electric Co Ltd
Priority to JP50077953A priority Critical patent/JPS522385A/en
Publication of JPS522385A publication Critical patent/JPS522385A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: A simple manufacturing device designed to improve degree of integration and prevent occurrence of cracks and leakage of current.
COPYRIGHT: (C)1977,JPO&Japio
JP50077953A 1975-06-24 1975-06-24 Semiconductor device manufacturing method Pending JPS522385A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50077953A JPS522385A (en) 1975-06-24 1975-06-24 Semiconductor device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50077953A JPS522385A (en) 1975-06-24 1975-06-24 Semiconductor device manufacturing method

Publications (1)

Publication Number Publication Date
JPS522385A true JPS522385A (en) 1977-01-10

Family

ID=13648364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50077953A Pending JPS522385A (en) 1975-06-24 1975-06-24 Semiconductor device manufacturing method

Country Status (1)

Country Link
JP (1) JPS522385A (en)

Similar Documents

Publication Publication Date Title
JPS5238885A (en) Method for production of semiconductor device
JPS522385A (en) Semiconductor device manufacturing method
JPS51126083A (en) Manufacturing method of semi-conductor equpment
JPS51146192A (en) Diode device fabrication method
JPS5261960A (en) Production of semiconductor device
JPS5248978A (en) Process for production of semiconductor device
JPS51115777A (en) Manufacturing method of a semiconductor apparatus
JPS5258360A (en) Production of semiconductor device
JPS51111604A (en) Manufacturing method of small type rectifier
JPS51112266A (en) Semiconductor device production method
JPS51147968A (en) Method of manufacturing semiconductor device
JPS52179A (en) Method of fabricating semiconductor
JPS51151088A (en) Manufacturing method of a semiconductor integrated circuit apparatus
JPS51138388A (en) High voltage withstand semiconductor device
JPS528787A (en) Semiconductor device process
JPS5267580A (en) Semiconductor integrated circuit and manufacturing method thereof
JPS5377168A (en) Production of semiconductor device
JPS5216975A (en) Method of manufacturing semiconductor unit
JPS51121271A (en) Manufacturing method for semiconductor devices
JPS51142981A (en) Production method of semiconductor devices
JPS5211867A (en) Manufacturing method of a semiconductor device
JPS5314551A (en) Working method of wafers
JPS5333056A (en) Electrode forming method of semiconductor device
JPS51147268A (en) Manufacturing process of depression type field effect semiconductor de vice by ion-implantation
JPS5424575A (en) Handling method of wafer