JPS5240062A - Process for production of semiconductor devices - Google Patents

Process for production of semiconductor devices

Info

Publication number
JPS5240062A
JPS5240062A JP50115627A JP11562775A JPS5240062A JP S5240062 A JPS5240062 A JP S5240062A JP 50115627 A JP50115627 A JP 50115627A JP 11562775 A JP11562775 A JP 11562775A JP S5240062 A JPS5240062 A JP S5240062A
Authority
JP
Japan
Prior art keywords
production
semiconductor devices
electrode
standardize
simplification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50115627A
Other languages
English (en)
Inventor
Nobuhiro Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50115627A priority Critical patent/JPS5240062A/ja
Publication of JPS5240062A publication Critical patent/JPS5240062A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP50115627A 1975-09-26 1975-09-26 Process for production of semiconductor devices Pending JPS5240062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50115627A JPS5240062A (en) 1975-09-26 1975-09-26 Process for production of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50115627A JPS5240062A (en) 1975-09-26 1975-09-26 Process for production of semiconductor devices

Publications (1)

Publication Number Publication Date
JPS5240062A true JPS5240062A (en) 1977-03-28

Family

ID=14667319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50115627A Pending JPS5240062A (en) 1975-09-26 1975-09-26 Process for production of semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5240062A (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57114261A (en) * 1981-01-07 1982-07-16 Hitachi Ltd Lead frame structure
JPS5992556A (ja) * 1982-11-19 1984-05-28 Hitachi Ltd 半導体装置
JPS61218139A (ja) * 1985-03-25 1986-09-27 Hitachi Chiyou Lsi Eng Kk 半導体装置
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
JPH02158159A (ja) * 1988-12-12 1990-06-18 Mitsubishi Electric Corp 半導体集積回路装置及びその製造方法
US4984059A (en) * 1982-10-08 1991-01-08 Fujitsu Limited Semiconductor device and a method for fabricating the same
JPH03250654A (ja) * 1990-02-28 1991-11-08 Hitachi Ltd 樹脂封止型半導体装置及びリードフレーム
US5278101A (en) * 1989-06-28 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
JPH08227903A (ja) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp 半導体装置
JPH08227968A (ja) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp 半導体装置
JPH08227967A (ja) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp 半導体装置の製造方法
US5917242A (en) * 1996-05-20 1999-06-29 Micron Technology, Inc. Combination of semiconductor interconnect

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57114261A (en) * 1981-01-07 1982-07-16 Hitachi Ltd Lead frame structure
USRE35109E (en) * 1982-10-08 1995-12-05 Fujitsu Limited Semiconductor device and method for fabricating the same
US4984059A (en) * 1982-10-08 1991-01-08 Fujitsu Limited Semiconductor device and a method for fabricating the same
JPS5992556A (ja) * 1982-11-19 1984-05-28 Hitachi Ltd 半導体装置
JPS61218139A (ja) * 1985-03-25 1986-09-27 Hitachi Chiyou Lsi Eng Kk 半導体装置
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
JPH02158159A (ja) * 1988-12-12 1990-06-18 Mitsubishi Electric Corp 半導体集積回路装置及びその製造方法
US5278101A (en) * 1989-06-28 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
JPH03250654A (ja) * 1990-02-28 1991-11-08 Hitachi Ltd 樹脂封止型半導体装置及びリードフレーム
JPH08227903A (ja) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp 半導体装置
JPH08227968A (ja) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp 半導体装置
JPH08227967A (ja) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp 半導体装置の製造方法
US5917242A (en) * 1996-05-20 1999-06-29 Micron Technology, Inc. Combination of semiconductor interconnect
US6080264A (en) * 1996-05-20 2000-06-27 Micron Technology, Inc. Combination of semiconductor interconnect

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