JPS5244566A - Method of alloying semiconductor pellet - Google Patents

Method of alloying semiconductor pellet

Info

Publication number
JPS5244566A
JPS5244566A JP50120430A JP12043075A JPS5244566A JP S5244566 A JPS5244566 A JP S5244566A JP 50120430 A JP50120430 A JP 50120430A JP 12043075 A JP12043075 A JP 12043075A JP S5244566 A JPS5244566 A JP S5244566A
Authority
JP
Japan
Prior art keywords
semiconductor pellet
pellet
alloying
alloying semiconductor
thicken
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50120430A
Other languages
Japanese (ja)
Inventor
Masaaki Sadamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50120430A priority Critical patent/JPS5244566A/en
Publication of JPS5244566A publication Critical patent/JPS5244566A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To thicken a soldering material on the portions which mate and contact with the circumferential edges of a pellet, thereby firmly alloy and bond the pellet to a substrate while preventing cavity or penetration.
COPYRIGHT: (C)1977,JPO&Japio
JP50120430A 1975-10-06 1975-10-06 Method of alloying semiconductor pellet Pending JPS5244566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50120430A JPS5244566A (en) 1975-10-06 1975-10-06 Method of alloying semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50120430A JPS5244566A (en) 1975-10-06 1975-10-06 Method of alloying semiconductor pellet

Publications (1)

Publication Number Publication Date
JPS5244566A true JPS5244566A (en) 1977-04-07

Family

ID=14786008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50120430A Pending JPS5244566A (en) 1975-10-06 1975-10-06 Method of alloying semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS5244566A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62501546A (en) * 1984-12-27 1987-06-25 ヒュ−ズ・エアクラフト・カンパニ− Soldering equipment and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62501546A (en) * 1984-12-27 1987-06-25 ヒュ−ズ・エアクラフト・カンパニ− Soldering equipment and method

Similar Documents

Publication Publication Date Title
JPS51121795A (en) Ag-tin oxide-system electric contact material
JPS522277A (en) Soldering device
JPS5380966A (en) Manufacture of electrode fdr semiconductor device
JPS51126050A (en) Semi-conductor equipment
JPS51111084A (en) Semiconductor device manufucturing proceso
JPS5219105A (en) Nonoxidative sintering and forging method
JPS5272570A (en) Formation of electrode of semiconductor deviced
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS51140565A (en) Semiconductor unit
JPS5228262A (en) Process for assembling semiconductor device
JPS5321570A (en) Bonding method of semiconductor substrates
JPS5324779A (en) Clamper of wire bonder
JPS53140967A (en) Production of electrodes of semiconductor device
JPS5364467A (en) Electrode
JPS5228271A (en) Collet for pellet bonding
JPS5214351A (en) Semiconductor device
JPS51126762A (en) Integrated circuit manufacturing process
JPS51145269A (en) Semiconductor device
JPS53124067A (en) Pellet bonding method
JPS51112268A (en) Semiconductor device and its production method
JPS51133739A (en) Construction of plug-shaped disconnecting path section and method of a sembling the same
JPS5235496A (en) Anti-smoke sealing method
JPS5228270A (en) Heatsink for the semiconductive device
JPS5215406A (en) Bimetal material
JPS5345969A (en) Schottky barrier semiconductor device