JPS51140565A - Semiconductor unit - Google Patents

Semiconductor unit

Info

Publication number
JPS51140565A
JPS51140565A JP50065591A JP6559175A JPS51140565A JP S51140565 A JPS51140565 A JP S51140565A JP 50065591 A JP50065591 A JP 50065591A JP 6559175 A JP6559175 A JP 6559175A JP S51140565 A JPS51140565 A JP S51140565A
Authority
JP
Japan
Prior art keywords
semiconductor unit
semiconductor
metal
adherence
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50065591A
Other languages
Japanese (ja)
Inventor
Yoshihiko Muraki
Mikio Takada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP50065591A priority Critical patent/JPS51140565A/en
Publication of JPS51140565A publication Critical patent/JPS51140565A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To provide a method for preventing the oxidation of the second metal coat layer and strengthen the adherence with solder in a semiconductor unit wherein metal plates or metal pieces are soldered to the electrodes of semiconductor.
COPYRIGHT: (C)1976,JPO&Japio
JP50065591A 1975-05-30 1975-05-30 Semiconductor unit Pending JPS51140565A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50065591A JPS51140565A (en) 1975-05-30 1975-05-30 Semiconductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50065591A JPS51140565A (en) 1975-05-30 1975-05-30 Semiconductor unit

Publications (1)

Publication Number Publication Date
JPS51140565A true JPS51140565A (en) 1976-12-03

Family

ID=13291400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50065591A Pending JPS51140565A (en) 1975-05-30 1975-05-30 Semiconductor unit

Country Status (1)

Country Link
JP (1) JPS51140565A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552227A (en) * 1978-10-12 1980-04-16 Toshiba Corp Semiconductor electrode structure
JPS59189625A (en) * 1983-04-13 1984-10-27 Nec Corp Manufacture of semiconductor device
JPS61248434A (en) * 1985-04-22 1986-11-05 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Semiconductor device
WO1994014190A1 (en) * 1992-12-10 1994-06-23 Kabushiki Kaisha Toyota Chuo Kenkyusho Surface structure for soldering and non-flux soldering method using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946872A (en) * 1972-09-08 1974-05-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946872A (en) * 1972-09-08 1974-05-07

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552227A (en) * 1978-10-12 1980-04-16 Toshiba Corp Semiconductor electrode structure
JPS59189625A (en) * 1983-04-13 1984-10-27 Nec Corp Manufacture of semiconductor device
JPS61248434A (en) * 1985-04-22 1986-11-05 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Semiconductor device
WO1994014190A1 (en) * 1992-12-10 1994-06-23 Kabushiki Kaisha Toyota Chuo Kenkyusho Surface structure for soldering and non-flux soldering method using the same

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