JPS5248468A - Process for production of semiconductor device - Google Patents

Process for production of semiconductor device

Info

Publication number
JPS5248468A
JPS5248468A JP12476875A JP12476875A JPS5248468A JP S5248468 A JPS5248468 A JP S5248468A JP 12476875 A JP12476875 A JP 12476875A JP 12476875 A JP12476875 A JP 12476875A JP S5248468 A JPS5248468 A JP S5248468A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
plasma
semiconductor substrate
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12476875A
Other languages
Japanese (ja)
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP12476875A priority Critical patent/JPS5248468A/en
Publication of JPS5248468A publication Critical patent/JPS5248468A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: To easily form a metal film by plasma or ion etching treatment of the surface of a semiconductor substrate.
COPYRIGHT: (C)1977,JPO&Japio
JP12476875A 1975-10-15 1975-10-15 Process for production of semiconductor device Pending JPS5248468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12476875A JPS5248468A (en) 1975-10-15 1975-10-15 Process for production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12476875A JPS5248468A (en) 1975-10-15 1975-10-15 Process for production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5248468A true JPS5248468A (en) 1977-04-18

Family

ID=14893628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12476875A Pending JPS5248468A (en) 1975-10-15 1975-10-15 Process for production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5248468A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5688318A (en) * 1979-11-30 1981-07-17 Gen Electric Method of manufacturing semiconductor device
JPS58169910A (en) * 1982-03-30 1983-10-06 Fujitsu Ltd Method for forming fine pattern
JPS6091631A (en) * 1983-10-25 1985-05-23 Toshiba Corp Metallic film forming process
JPS61121335A (en) * 1984-11-16 1986-06-09 Rohm Co Ltd Processing method for grounding surface of wafer
JPS61127136A (en) * 1984-11-26 1986-06-14 Rohm Co Ltd Method for treating wafer after grinding
JPS61139026A (en) * 1984-12-11 1986-06-26 Fujitsu Ltd Production of semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS493307A (en) * 1972-05-01 1974-01-12
JPS4947987A (en) * 1972-09-11 1974-05-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS493307A (en) * 1972-05-01 1974-01-12
JPS4947987A (en) * 1972-09-11 1974-05-09

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5688318A (en) * 1979-11-30 1981-07-17 Gen Electric Method of manufacturing semiconductor device
JPS58169910A (en) * 1982-03-30 1983-10-06 Fujitsu Ltd Method for forming fine pattern
JPS6091631A (en) * 1983-10-25 1985-05-23 Toshiba Corp Metallic film forming process
JPS61121335A (en) * 1984-11-16 1986-06-09 Rohm Co Ltd Processing method for grounding surface of wafer
JPS61127136A (en) * 1984-11-26 1986-06-14 Rohm Co Ltd Method for treating wafer after grinding
JPS61139026A (en) * 1984-12-11 1986-06-26 Fujitsu Ltd Production of semiconductor device

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