JPS532079A - Frame structure for semiconductor device and its manufacture - Google Patents

Frame structure for semiconductor device and its manufacture

Info

Publication number
JPS532079A
JPS532079A JP7668876A JP7668876A JPS532079A JP S532079 A JPS532079 A JP S532079A JP 7668876 A JP7668876 A JP 7668876A JP 7668876 A JP7668876 A JP 7668876A JP S532079 A JPS532079 A JP S532079A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
frame structure
resin
stamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7668876A
Other languages
Japanese (ja)
Inventor
Yasumasa Ide
Kazuyoshi Tominaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments and Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments and Electronics Ltd filed Critical Seiko Instruments and Electronics Ltd
Priority to JP7668876A priority Critical patent/JPS532079A/en
Publication of JPS532079A publication Critical patent/JPS532079A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To ensure a resin sealing by producing a resin flow preventing frame through stamp or print of Si-group resin.
COPYRIGHT: (C)1978,JPO&Japio
JP7668876A 1976-06-29 1976-06-29 Frame structure for semiconductor device and its manufacture Pending JPS532079A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7668876A JPS532079A (en) 1976-06-29 1976-06-29 Frame structure for semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7668876A JPS532079A (en) 1976-06-29 1976-06-29 Frame structure for semiconductor device and its manufacture

Publications (1)

Publication Number Publication Date
JPS532079A true JPS532079A (en) 1978-01-10

Family

ID=13612385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7668876A Pending JPS532079A (en) 1976-06-29 1976-06-29 Frame structure for semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS532079A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5579545U (en) * 1978-11-27 1980-05-31
JPS58151838U (en) * 1982-04-06 1983-10-12 株式会社東洋精機製作所 Plate impact test equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5579545U (en) * 1978-11-27 1980-05-31
JPS58151838U (en) * 1982-04-06 1983-10-12 株式会社東洋精機製作所 Plate impact test equipment

Similar Documents

Publication Publication Date Title
JPS5380966A (en) Manufacture of electrode fdr semiconductor device
JPS532078A (en) Sealing structure for semiconductor device
JPS5351971A (en) Manufacture for semiconductor
JPS5231673A (en) Resin sealing method of semiconductor device
JPS5275180A (en) Package for integrated circuits
JPS5339067A (en) Production of semiconductor device
JPS5254373A (en) Packaging construction for semiconductor element
JPS5310964A (en) Electron tube
JPS5233534A (en) Photograph print device
JPS534477A (en) Production of semiconductor device
JPS54577A (en) Resin seal semiconductor device
JPS53142176A (en) Manufacture of semiconductor device
JPS5338974A (en) Manufacture of semiconductor device
JPS5332674A (en) Sealing structure of semiconductor device and its production
JPS5347770A (en) Production of semiconductor device
JPS5390763A (en) Semiconductor element and mask for producing semiconductor element
JPS5368172A (en) Production of semiconductor device
JPS5383463A (en) Packaging method of semiconductor device
JPS5339869A (en) Semiconductor chip mounting base plate
JPS52179A (en) Method of fabricating semiconductor
JPS52117067A (en) Semiconductor device
JPS5411672A (en) Manufacture for semiconductor device
JPS5374368A (en) Package for semiconductor device
JPS52119862A (en) Semi-conductor device and its manufacture
JPS51135164A (en) Device of changing the direction of wind