JPS5361973A - Production of semiconductor element - Google Patents

Production of semiconductor element

Info

Publication number
JPS5361973A
JPS5361973A JP13760776A JP13760776A JPS5361973A JP S5361973 A JPS5361973 A JP S5361973A JP 13760776 A JP13760776 A JP 13760776A JP 13760776 A JP13760776 A JP 13760776A JP S5361973 A JPS5361973 A JP S5361973A
Authority
JP
Japan
Prior art keywords
production
semiconductor element
solder
spacers
uniform thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13760776A
Other languages
Japanese (ja)
Inventor
Hiroshi Kamijo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP13760776A priority Critical patent/JPS5361973A/en
Publication of JPS5361973A publication Critical patent/JPS5361973A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To form a solder layer of a uniform thickness by using the metal grains enclosed in a solder foil as spacers.
COPYRIGHT: (C)1978,JPO&Japio
JP13760776A 1976-11-16 1976-11-16 Production of semiconductor element Pending JPS5361973A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13760776A JPS5361973A (en) 1976-11-16 1976-11-16 Production of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13760776A JPS5361973A (en) 1976-11-16 1976-11-16 Production of semiconductor element

Publications (1)

Publication Number Publication Date
JPS5361973A true JPS5361973A (en) 1978-06-02

Family

ID=15202632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13760776A Pending JPS5361973A (en) 1976-11-16 1976-11-16 Production of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5361973A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002049797A1 (en) * 2000-12-21 2002-06-27 Hitachi, Ltd. Solder foil and semiconductor device and electronic device
JP2005129886A (en) * 2003-10-03 2005-05-19 Fuji Electric Holdings Co Ltd Semiconductor device and manufacturing method thereof
JP2007201286A (en) * 2006-01-27 2007-08-09 Kyocera Corp Surface mount module manufacturing method and surface mount module
JPWO2020202970A1 (en) * 2019-03-29 2020-10-08

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002049797A1 (en) * 2000-12-21 2002-06-27 Hitachi, Ltd. Solder foil and semiconductor device and electronic device
US7722962B2 (en) 2000-12-21 2010-05-25 Renesas Technology Corp. Solder foil, semiconductor device and electronic device
JP2005129886A (en) * 2003-10-03 2005-05-19 Fuji Electric Holdings Co Ltd Semiconductor device and manufacturing method thereof
JP2007201286A (en) * 2006-01-27 2007-08-09 Kyocera Corp Surface mount module manufacturing method and surface mount module
JPWO2020202970A1 (en) * 2019-03-29 2020-10-08
WO2020202970A1 (en) * 2019-03-29 2020-10-08 三井金属鉱業株式会社 Bonded body and method for manufacturing same
CN113614894A (en) * 2019-03-29 2021-11-05 三井金属矿业株式会社 Bonded body and method for producing same
US12030125B2 (en) 2019-03-29 2024-07-09 Mitsui Mining & Smelting Co., Ltd. Bonded body and method for manufacturing same

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