JPS5366172A - Resin mold element - Google Patents

Resin mold element

Info

Publication number
JPS5366172A
JPS5366172A JP14126276A JP14126276A JPS5366172A JP S5366172 A JPS5366172 A JP S5366172A JP 14126276 A JP14126276 A JP 14126276A JP 14126276 A JP14126276 A JP 14126276A JP S5366172 A JPS5366172 A JP S5366172A
Authority
JP
Japan
Prior art keywords
resin mold
mold element
wire
resin
exist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14126276A
Other languages
Japanese (ja)
Inventor
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14126276A priority Critical patent/JPS5366172A/en
Publication of JPS5366172A publication Critical patent/JPS5366172A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent fatigue disconnection of wire by controlling sealing resin so that a junction wire may not exist on the boundary face of chip covering resin.
COPYRIGHT: (C)1978,JPO&Japio
JP14126276A 1976-11-26 1976-11-26 Resin mold element Pending JPS5366172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14126276A JPS5366172A (en) 1976-11-26 1976-11-26 Resin mold element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14126276A JPS5366172A (en) 1976-11-26 1976-11-26 Resin mold element

Publications (1)

Publication Number Publication Date
JPS5366172A true JPS5366172A (en) 1978-06-13

Family

ID=15287803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14126276A Pending JPS5366172A (en) 1976-11-26 1976-11-26 Resin mold element

Country Status (1)

Country Link
JP (1) JPS5366172A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114363A (en) * 1980-02-15 1981-09-08 Toshiba Corp Semiconductor device sealed with resin
US4766095A (en) * 1985-01-04 1988-08-23 Oki Electric Industry Co., Ltd. Method of manufacturing eprom device
US5358905A (en) * 1993-04-02 1994-10-25 Texas Instruments Incorporated Semiconductor device having die pad locking to substantially reduce package cracking
WO2023095745A1 (en) * 2021-11-25 2023-06-01 ローム株式会社 Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114363A (en) * 1980-02-15 1981-09-08 Toshiba Corp Semiconductor device sealed with resin
US4766095A (en) * 1985-01-04 1988-08-23 Oki Electric Industry Co., Ltd. Method of manufacturing eprom device
US5358905A (en) * 1993-04-02 1994-10-25 Texas Instruments Incorporated Semiconductor device having die pad locking to substantially reduce package cracking
WO2023095745A1 (en) * 2021-11-25 2023-06-01 ローム株式会社 Semiconductor device

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