JPS54577A - Resin seal semiconductor device - Google Patents

Resin seal semiconductor device

Info

Publication number
JPS54577A
JPS54577A JP6483277A JP6483277A JPS54577A JP S54577 A JPS54577 A JP S54577A JP 6483277 A JP6483277 A JP 6483277A JP 6483277 A JP6483277 A JP 6483277A JP S54577 A JPS54577 A JP S54577A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin seal
seal semiconductor
substrate
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6483277A
Other languages
Japanese (ja)
Inventor
Kazutaka Narita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6483277A priority Critical patent/JPS54577A/en
Publication of JPS54577A publication Critical patent/JPS54577A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To facilitate influx of sealing resin in the clearance between a chip and a substrate by providing a through-hole in the substrate at the portion opposing to the semiconductor chip.
COPYRIGHT: (C)1979,JPO&Japio
JP6483277A 1977-06-03 1977-06-03 Resin seal semiconductor device Pending JPS54577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6483277A JPS54577A (en) 1977-06-03 1977-06-03 Resin seal semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6483277A JPS54577A (en) 1977-06-03 1977-06-03 Resin seal semiconductor device

Publications (1)

Publication Number Publication Date
JPS54577A true JPS54577A (en) 1979-01-05

Family

ID=13269604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6483277A Pending JPS54577A (en) 1977-06-03 1977-06-03 Resin seal semiconductor device

Country Status (1)

Country Link
JP (1) JPS54577A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5182853A (en) * 1990-11-06 1993-02-02 Fujitsu Limited Method for encapsulting IC chip
US6483190B1 (en) 1999-10-20 2002-11-19 Fujitsu Limited Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5182853A (en) * 1990-11-06 1993-02-02 Fujitsu Limited Method for encapsulting IC chip
US6483190B1 (en) 1999-10-20 2002-11-19 Fujitsu Limited Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method
US7436062B2 (en) 1999-10-20 2008-10-14 Fujitsu Limited Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method

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