JPS54110784A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54110784A
JPS54110784A JP1780978A JP1780978A JPS54110784A JP S54110784 A JPS54110784 A JP S54110784A JP 1780978 A JP1780978 A JP 1780978A JP 1780978 A JP1780978 A JP 1780978A JP S54110784 A JPS54110784 A JP S54110784A
Authority
JP
Japan
Prior art keywords
substrate
layer
sio
film
breakdown
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1780978A
Other languages
English (en)
Japanese (ja)
Other versions
JPS612300B2 (2
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1780978A priority Critical patent/JPS54110784A/ja
Publication of JPS54110784A publication Critical patent/JPS54110784A/ja
Publication of JPS612300B2 publication Critical patent/JPS612300B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/283—Reinforcing structures, e.g. bump collars

Landscapes

  • Wire Bonding (AREA)
JP1780978A 1978-02-17 1978-02-17 Semiconductor device Granted JPS54110784A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1780978A JPS54110784A (en) 1978-02-17 1978-02-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1780978A JPS54110784A (en) 1978-02-17 1978-02-17 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS54110784A true JPS54110784A (en) 1979-08-30
JPS612300B2 JPS612300B2 (2) 1986-01-23

Family

ID=11954046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1780978A Granted JPS54110784A (en) 1978-02-17 1978-02-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54110784A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018159872A (ja) * 2017-03-23 2018-10-11 住友電気工業株式会社 半導体光素子及びその製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367695U (2) * 1989-11-06 1991-07-02
JPH0680497U (ja) * 1993-04-27 1994-11-15 丹 井上 算数つみき

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5072588A (2) * 1973-10-29 1975-06-16
JPS5131185A (ja) * 1974-09-10 1976-03-17 Nippon Electric Co Denkaikokahandotaisochi

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5072588A (2) * 1973-10-29 1975-06-16
JPS5131185A (ja) * 1974-09-10 1976-03-17 Nippon Electric Co Denkaikokahandotaisochi

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018159872A (ja) * 2017-03-23 2018-10-11 住友電気工業株式会社 半導体光素子及びその製造方法

Also Published As

Publication number Publication date
JPS612300B2 (2) 1986-01-23

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