JPS5414675A - Bonding method for semiconductor elements - Google Patents
Bonding method for semiconductor elementsInfo
- Publication number
- JPS5414675A JPS5414675A JP7987777A JP7987777A JPS5414675A JP S5414675 A JPS5414675 A JP S5414675A JP 7987777 A JP7987777 A JP 7987777A JP 7987777 A JP7987777 A JP 7987777A JP S5414675 A JPS5414675 A JP S5414675A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor elements
- bonding method
- tin
- metal
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000002184 metal Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 150000001879 copper Chemical class 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000008188 pellet Substances 0.000 abstract 1
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To make the accurate connection between a bump electrode of a semiconductor pellet, formed of a material obtained by covering the surface of this copper metal with tin-system metal, and a conductor layer by using a composite plate of gold and tin system metals.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7987777A JPS5414675A (en) | 1977-07-06 | 1977-07-06 | Bonding method for semiconductor elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7987777A JPS5414675A (en) | 1977-07-06 | 1977-07-06 | Bonding method for semiconductor elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5414675A true JPS5414675A (en) | 1979-02-03 |
Family
ID=13702450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7987777A Pending JPS5414675A (en) | 1977-07-06 | 1977-07-06 | Bonding method for semiconductor elements |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5414675A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209742A (en) * | 1988-09-16 | 1990-08-21 | Natl Semiconductor Corp <Ns> | Gold/tin entectic bonding for tape automaization bonding process |
-
1977
- 1977-07-06 JP JP7987777A patent/JPS5414675A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209742A (en) * | 1988-09-16 | 1990-08-21 | Natl Semiconductor Corp <Ns> | Gold/tin entectic bonding for tape automaization bonding process |
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