JPS5418280A - Resin sealed semiconductor device - Google Patents

Resin sealed semiconductor device

Info

Publication number
JPS5418280A
JPS5418280A JP8344877A JP8344877A JPS5418280A JP S5418280 A JPS5418280 A JP S5418280A JP 8344877 A JP8344877 A JP 8344877A JP 8344877 A JP8344877 A JP 8344877A JP S5418280 A JPS5418280 A JP S5418280A
Authority
JP
Japan
Prior art keywords
semiconductor device
sealed semiconductor
resin sealed
secure
whole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8344877A
Other languages
Japanese (ja)
Inventor
Toshiaki Shinohara
Koji Yanagiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8344877A priority Critical patent/JPS5418280A/en
Publication of JPS5418280A publication Critical patent/JPS5418280A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To secure a high radiation effect for the semiconductor device when attached to the external heat sink by making expose part or whole of the heat block over the mold surface.
COPYRIGHT: (C)1979,JPO&Japio
JP8344877A 1977-07-11 1977-07-11 Resin sealed semiconductor device Pending JPS5418280A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8344877A JPS5418280A (en) 1977-07-11 1977-07-11 Resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8344877A JPS5418280A (en) 1977-07-11 1977-07-11 Resin sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5418280A true JPS5418280A (en) 1979-02-10

Family

ID=13802713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8344877A Pending JPS5418280A (en) 1977-07-11 1977-07-11 Resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5418280A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833859A (en) * 1981-08-21 1983-02-28 Mitsubishi Electric Corp Package for semiconductor device
US6117709A (en) * 1997-11-12 2000-09-12 Denso Corporation Resin sealing type semiconductor device and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833859A (en) * 1981-08-21 1983-02-28 Mitsubishi Electric Corp Package for semiconductor device
US6117709A (en) * 1997-11-12 2000-09-12 Denso Corporation Resin sealing type semiconductor device and method of manufacturing the same

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