JPS5429567A - Welded electrode for air tight sealing of semiconductor device package - Google Patents

Welded electrode for air tight sealing of semiconductor device package

Info

Publication number
JPS5429567A
JPS5429567A JP9593777A JP9593777A JPS5429567A JP S5429567 A JPS5429567 A JP S5429567A JP 9593777 A JP9593777 A JP 9593777A JP 9593777 A JP9593777 A JP 9593777A JP S5429567 A JPS5429567 A JP S5429567A
Authority
JP
Japan
Prior art keywords
semiconductor device
device package
air tight
tight sealing
welded electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9593777A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9593777A priority Critical patent/JPS5429567A/en
Publication of JPS5429567A publication Critical patent/JPS5429567A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To perform airtight sealing with one shot, by providing a plurality of electrodes around the cap placed on the seal frame and by applying power through simultaneous contact and weight applied.
COPYRIGHT: (C)1979,JPO&Japio
JP9593777A 1977-08-09 1977-08-09 Welded electrode for air tight sealing of semiconductor device package Pending JPS5429567A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9593777A JPS5429567A (en) 1977-08-09 1977-08-09 Welded electrode for air tight sealing of semiconductor device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9593777A JPS5429567A (en) 1977-08-09 1977-08-09 Welded electrode for air tight sealing of semiconductor device package

Publications (1)

Publication Number Publication Date
JPS5429567A true JPS5429567A (en) 1979-03-05

Family

ID=14151170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9593777A Pending JPS5429567A (en) 1977-08-09 1977-08-09 Welded electrode for air tight sealing of semiconductor device package

Country Status (1)

Country Link
JP (1) JPS5429567A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103056500A (en) * 2012-11-30 2013-04-24 北京时代民芯科技有限公司 Welding method for semiconductor ceramic shell sealing cap

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103056500A (en) * 2012-11-30 2013-04-24 北京时代民芯科技有限公司 Welding method for semiconductor ceramic shell sealing cap

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