JPS5429568A - Welded electrode for sealing of semiconductor device - Google Patents

Welded electrode for sealing of semiconductor device

Info

Publication number
JPS5429568A
JPS5429568A JP9593877A JP9593877A JPS5429568A JP S5429568 A JPS5429568 A JP S5429568A JP 9593877 A JP9593877 A JP 9593877A JP 9593877 A JP9593877 A JP 9593877A JP S5429568 A JPS5429568 A JP S5429568A
Authority
JP
Japan
Prior art keywords
semiconductor device
sealing
welded electrode
electrode
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9593877A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9593877A priority Critical patent/JPS5429568A/en
Publication of JPS5429568A publication Critical patent/JPS5429568A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0205—Non-consumable electrodes; C-electrodes

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To enable one shot welding, by providing the taper hole with the electrode to perform resistor welding for the seal frame and the metal cap for the semiconductor device package and by alternately arranging the conductor simultaneously contacting with the full circumference of the cap via the insulator.
COPYRIGHT: (C)1979,JPO&Japio
JP9593877A 1977-08-09 1977-08-09 Welded electrode for sealing of semiconductor device Pending JPS5429568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9593877A JPS5429568A (en) 1977-08-09 1977-08-09 Welded electrode for sealing of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9593877A JPS5429568A (en) 1977-08-09 1977-08-09 Welded electrode for sealing of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5429568A true JPS5429568A (en) 1979-03-05

Family

ID=14151197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9593877A Pending JPS5429568A (en) 1977-08-09 1977-08-09 Welded electrode for sealing of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5429568A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03221717A (en) * 1990-01-29 1991-09-30 Matsushita Electric Ind Co Ltd Combustion device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03221717A (en) * 1990-01-29 1991-09-30 Matsushita Electric Ind Co Ltd Combustion device

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