JPS5432155A - Thermo compression bonding apparatus - Google Patents

Thermo compression bonding apparatus

Info

Publication number
JPS5432155A
JPS5432155A JP9801477A JP9801477A JPS5432155A JP S5432155 A JPS5432155 A JP S5432155A JP 9801477 A JP9801477 A JP 9801477A JP 9801477 A JP9801477 A JP 9801477A JP S5432155 A JPS5432155 A JP S5432155A
Authority
JP
Japan
Prior art keywords
compression bonding
thermo compression
bonding apparatus
thermo
coolatn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9801477A
Other languages
Japanese (ja)
Inventor
Kenichi Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9801477A priority Critical patent/JPS5432155A/en
Publication of JPS5432155A publication Critical patent/JPS5432155A/en
Pending legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To relieve the thermal stress of the circuit element. and to shorten the entire working time, in the thermo compression bonding apparatus, by installing the coolatn gas ejecting nozzle nearby the thermo compression bonding pressure device, when the terminal is connected to the circuit substrate.
COPYRIGHT: (C)1979,JPO&Japio
JP9801477A 1977-08-15 1977-08-15 Thermo compression bonding apparatus Pending JPS5432155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9801477A JPS5432155A (en) 1977-08-15 1977-08-15 Thermo compression bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9801477A JPS5432155A (en) 1977-08-15 1977-08-15 Thermo compression bonding apparatus

Publications (1)

Publication Number Publication Date
JPS5432155A true JPS5432155A (en) 1979-03-09

Family

ID=14207952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9801477A Pending JPS5432155A (en) 1977-08-15 1977-08-15 Thermo compression bonding apparatus

Country Status (1)

Country Link
JP (1) JPS5432155A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5940595A (en) * 1982-08-30 1984-03-06 松下電器産業株式会社 Method of producing circuit board
US5866867A (en) * 1997-05-29 1999-02-02 Sawtek Inc. Surface mount package seam welder apparatus and method
JP2016192461A (en) * 2015-03-31 2016-11-10 トヨタ自動車株式会社 Thermo-compression bonding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5940595A (en) * 1982-08-30 1984-03-06 松下電器産業株式会社 Method of producing circuit board
US5866867A (en) * 1997-05-29 1999-02-02 Sawtek Inc. Surface mount package seam welder apparatus and method
JP2016192461A (en) * 2015-03-31 2016-11-10 トヨタ自動車株式会社 Thermo-compression bonding device

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