JPS5437181A - Preparation of copper-clad laminate - Google Patents

Preparation of copper-clad laminate

Info

Publication number
JPS5437181A
JPS5437181A JP10356977A JP10356977A JPS5437181A JP S5437181 A JPS5437181 A JP S5437181A JP 10356977 A JP10356977 A JP 10356977A JP 10356977 A JP10356977 A JP 10356977A JP S5437181 A JPS5437181 A JP S5437181A
Authority
JP
Japan
Prior art keywords
copper
clad laminate
preparation
polybutadiene
laminating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10356977A
Other languages
Japanese (ja)
Inventor
Norio Saruwatari
Katsura Adachi
Takenori Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10356977A priority Critical patent/JPS5437181A/en
Publication of JPS5437181A publication Critical patent/JPS5437181A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To prepare a copper-clad laminate having excellent electrical properties and heat resistance, useful manufacturing high-density printed circuit, by laminating a copper foil coated with cyclic cis-1, 4-polybutadiene, to a prepreg sheet.
COPYRIGHT: (C)1979,JPO&Japio
JP10356977A 1977-08-31 1977-08-31 Preparation of copper-clad laminate Pending JPS5437181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10356977A JPS5437181A (en) 1977-08-31 1977-08-31 Preparation of copper-clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10356977A JPS5437181A (en) 1977-08-31 1977-08-31 Preparation of copper-clad laminate

Publications (1)

Publication Number Publication Date
JPS5437181A true JPS5437181A (en) 1979-03-19

Family

ID=14357423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10356977A Pending JPS5437181A (en) 1977-08-31 1977-08-31 Preparation of copper-clad laminate

Country Status (1)

Country Link
JP (1) JPS5437181A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003020000A1 (en) * 2001-08-22 2003-03-06 World Properties Inc. Method for improving bonding of circuit substrates to metal and articles formed thereby

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003020000A1 (en) * 2001-08-22 2003-03-06 World Properties Inc. Method for improving bonding of circuit substrates to metal and articles formed thereby

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