JPS5443477A - Pattern formation method - Google Patents

Pattern formation method

Info

Publication number
JPS5443477A
JPS5443477A JP11019677A JP11019677A JPS5443477A JP S5443477 A JPS5443477 A JP S5443477A JP 11019677 A JP11019677 A JP 11019677A JP 11019677 A JP11019677 A JP 11019677A JP S5443477 A JPS5443477 A JP S5443477A
Authority
JP
Japan
Prior art keywords
pattern
metal film
substrate
resin
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11019677A
Other languages
Japanese (ja)
Other versions
JPS5719860B2 (en
Inventor
Kenzo Hatada
Takeshi Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11019677A priority Critical patent/JPS5443477A/en
Publication of JPS5443477A publication Critical patent/JPS5443477A/en
Publication of JPS5719860B2 publication Critical patent/JPS5719860B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)

Abstract

PURPOSE: To increase the tolerance of the correlation between the thickness of the resin and metal films by spraying the pressed solution onto the surface of the substrate to which the sensitive resin pattern and the metal film are formed to remove the both films simultaneously, and thus to realize formation of a minute pattern with a high yield.
CONSTITUTION: Pattern 22 of the sensitive resin is formed on substrate 21 with which the element formation is through, and metal film 23 and 23' are sticked to make corner 24 thin. The substrate is then soaked into the solution to dissolve only the resin film or part of the metal film, and then boiled. After this, the same solution is sprayed through the nozzle onto the substrate surface for scanning. In this way, the metal film is dissolved a little, and resin pattern 22 is dissolved away. At the same time, metal film 23' is removed forcedly to obtain pattern 23. This method features a higher yield than the method of the acetone ultrasonic vibration, ensuring formation of a minute pattern with a high accuracy.
COPYRIGHT: (C)1979,JPO&Japio
JP11019677A 1977-09-12 1977-09-12 Pattern formation method Granted JPS5443477A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11019677A JPS5443477A (en) 1977-09-12 1977-09-12 Pattern formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11019677A JPS5443477A (en) 1977-09-12 1977-09-12 Pattern formation method

Publications (2)

Publication Number Publication Date
JPS5443477A true JPS5443477A (en) 1979-04-06
JPS5719860B2 JPS5719860B2 (en) 1982-04-24

Family

ID=14529474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11019677A Granted JPS5443477A (en) 1977-09-12 1977-09-12 Pattern formation method

Country Status (1)

Country Link
JP (1) JPS5443477A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149424A (en) * 1984-08-17 1986-03-11 Matsushita Electronics Corp Pattern forming method of film
JP2013029670A (en) * 2011-07-28 2013-02-07 Denso Corp Method of manufacturing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149424A (en) * 1984-08-17 1986-03-11 Matsushita Electronics Corp Pattern forming method of film
JP2013029670A (en) * 2011-07-28 2013-02-07 Denso Corp Method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPS5719860B2 (en) 1982-04-24

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