JPS5445573A - Pressure welding type semiconductor device - Google Patents
Pressure welding type semiconductor deviceInfo
- Publication number
- JPS5445573A JPS5445573A JP11160577A JP11160577A JPS5445573A JP S5445573 A JPS5445573 A JP S5445573A JP 11160577 A JP11160577 A JP 11160577A JP 11160577 A JP11160577 A JP 11160577A JP S5445573 A JPS5445573 A JP S5445573A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- type semiconductor
- pressure welding
- welding type
- location shift
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000005493 welding type Methods 0.000 title abstract 2
- 239000004809 Teflon Substances 0.000 abstract 1
- 229920006362 Teflon® Polymers 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000011241 protective layer Substances 0.000 abstract 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11160577A JPS5445573A (en) | 1977-09-19 | 1977-09-19 | Pressure welding type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11160577A JPS5445573A (en) | 1977-09-19 | 1977-09-19 | Pressure welding type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5445573A true JPS5445573A (en) | 1979-04-10 |
Family
ID=14565572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11160577A Pending JPS5445573A (en) | 1977-09-19 | 1977-09-19 | Pressure welding type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5445573A (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57100737A (en) * | 1980-12-16 | 1982-06-23 | Toshiba Corp | Semiconductor device |
| US8745571B2 (en) | 2011-02-14 | 2014-06-03 | International Business Machines Corporation | Analysis of compensated layout shapes |
-
1977
- 1977-09-19 JP JP11160577A patent/JPS5445573A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57100737A (en) * | 1980-12-16 | 1982-06-23 | Toshiba Corp | Semiconductor device |
| US4587550A (en) * | 1980-12-16 | 1986-05-06 | Tokyo Shibaura Denki Kabushiki Kaisha | Press-packed semiconductor device with lateral fixing member |
| US8745571B2 (en) | 2011-02-14 | 2014-06-03 | International Business Machines Corporation | Analysis of compensated layout shapes |
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