JPS545383A - Ultrasonic wire bonding method - Google Patents

Ultrasonic wire bonding method

Info

Publication number
JPS545383A
JPS545383A JP6982777A JP6982777A JPS545383A JP S545383 A JPS545383 A JP S545383A JP 6982777 A JP6982777 A JP 6982777A JP 6982777 A JP6982777 A JP 6982777A JP S545383 A JPS545383 A JP S545383A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding method
wire
ultrasonic wire
scissors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6982777A
Other languages
Japanese (ja)
Inventor
Yoshio Ohashi
Takafumi Kunishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6982777A priority Critical patent/JPS545383A/en
Publication of JPS545383A publication Critical patent/JPS545383A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To secure a good wire connection by holding the wire tip portion between by push-up of the scissors or drop-down of the capillary after cutting off the wire with the scissors, bending the wire orthogonally and performing a bonding by applying the ultrasonic vibration and the load to the capillary.
COPYRIGHT: (C)1979,JPO&Japio
JP6982777A 1977-06-15 1977-06-15 Ultrasonic wire bonding method Pending JPS545383A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6982777A JPS545383A (en) 1977-06-15 1977-06-15 Ultrasonic wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6982777A JPS545383A (en) 1977-06-15 1977-06-15 Ultrasonic wire bonding method

Publications (1)

Publication Number Publication Date
JPS545383A true JPS545383A (en) 1979-01-16

Family

ID=13413973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6982777A Pending JPS545383A (en) 1977-06-15 1977-06-15 Ultrasonic wire bonding method

Country Status (1)

Country Link
JP (1) JPS545383A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149015A (en) * 1981-03-10 1982-09-14 Sumitomo Metal Ind Ltd Plate thickness controlling device for tandem mill
JPS59147704A (en) * 1982-11-11 1984-08-24 デイビ−・マツキ−（シエフイ−ルド）リミテツド Control of vertically arranged rolling machine
US7918378B1 (en) * 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149015A (en) * 1981-03-10 1982-09-14 Sumitomo Metal Ind Ltd Plate thickness controlling device for tandem mill
JPS59147704A (en) * 1982-11-11 1984-08-24 デイビ−・マツキ−（シエフイ−ルド）リミテツド Control of vertically arranged rolling machine
US7918378B1 (en) * 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
US8267303B2 (en) * 2010-08-06 2012-09-18 National Semiconductor Corporation Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds

Similar Documents

Publication Publication Date Title
DE3586269D1 (en) METHOD FOR PRODUCING PREFORMED WIRE, SHEET AND TAPE FOR FIBER REINFORCED METALS AND ULTRASONIC WAVE VIBRATOR.
JP2008044969A (en) Melanoma cell lines expressing immunodominant shared melanoma antigen and methods of use thereof
FI852331A7 (en) Compositions and method for improving the penetration of topical and systemic agents through the skin and membranes.
DK270578A (en) ACID ALKALICITRATE K6NA6H3 (C607H5) 5.2-4 H2 /, AND PROCEDURE FOR PREPARING IT
JPS545383A (en) Ultrasonic wire bonding method
JPS51126063A (en) Wire bonding method
JPS5443588A (en) Jointing method of stranded copper wire
JPS558085A (en) Wire bonding method
JPS5312097A (en) Connector and electric wire pressure connection manufacturing method
JPS547869A (en) Lead bending method of semiconductor device
JPS5439343A (en) Bonding method
JPS53135573A (en) Wire bonding method of semiconductor element
JPS5279657A (en) Wire bonding device
JPS5396669A (en) Method and apparatus for wire bonding of covered wire
JPS5611836A (en) Bending method and apparatus of external lead wire for bulb
JPS5360572A (en) Ultrasonic wire bonding device
JPS52135266A (en) Wire bonding device
JPS52129280A (en) Wire bonding method
JPS53104166A (en) Ultrasonic wire bonding method and unit used in this method
JPS53137667A (en) Bonding method of semiconductor element
JPS5427364A (en) Metal wire bonding method for semiconductor device
JPS5370766A (en) Semiconductor device
JPS5336466A (en) Bonding method
JPS53129967A (en) Stem for transistors
JPS5580327A (en) Wirebonding