JPS5454569A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5454569A
JPS5454569A JP12097577A JP12097577A JPS5454569A JP S5454569 A JPS5454569 A JP S5454569A JP 12097577 A JP12097577 A JP 12097577A JP 12097577 A JP12097577 A JP 12097577A JP S5454569 A JPS5454569 A JP S5454569A
Authority
JP
Japan
Prior art keywords
bonding
leads
wire
semiconductor device
deriving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12097577A
Other languages
Japanese (ja)
Inventor
Takeshi Hashimoto
Hideyo Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12097577A priority Critical patent/JPS5454569A/en
Publication of JPS5454569A publication Critical patent/JPS5454569A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To surely perform wire bonding by roughening the wire bonding surfaces of electrode deriving leads. CONSTITUTION:Recesses of V- , semi-circular or other type are provided in the portions of deriving leads to be wire-bonded by driving blade forms to create rough surfaces. Then, the compression-bonding areas of the bonding parts of bonding wires and leads increase and therefore sure bonding may be performed under lower pressing force and temperature.
JP12097577A 1977-10-11 1977-10-11 Semiconductor device Pending JPS5454569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12097577A JPS5454569A (en) 1977-10-11 1977-10-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12097577A JPS5454569A (en) 1977-10-11 1977-10-11 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5454569A true JPS5454569A (en) 1979-04-28

Family

ID=14799661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12097577A Pending JPS5454569A (en) 1977-10-11 1977-10-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5454569A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6242254U (en) * 1985-08-31 1987-03-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6242254U (en) * 1985-08-31 1987-03-13

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