JPS54573A - Transistor - Google Patents
TransistorInfo
- Publication number
- JPS54573A JPS54573A JP6554677A JP6554677A JPS54573A JP S54573 A JPS54573 A JP S54573A JP 6554677 A JP6554677 A JP 6554677A JP 6554677 A JP6554677 A JP 6554677A JP S54573 A JPS54573 A JP S54573A
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- insulating substrate
- base
- holes provided
- improve workability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6554677A JPS54573A (en) | 1977-06-02 | 1977-06-02 | Transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6554677A JPS54573A (en) | 1977-06-02 | 1977-06-02 | Transistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54573A true JPS54573A (en) | 1979-01-05 |
Family
ID=13290113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6554677A Pending JPS54573A (en) | 1977-06-02 | 1977-06-02 | Transistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54573A (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030539U (ja) * | 1983-08-09 | 1985-03-01 | 富士電機株式会社 | 半導体装置 |
| US4876102A (en) * | 1987-12-30 | 1989-10-24 | The Procter & Gamble Company | Potato based dough containing highly pectinated cellulosic fibers |
-
1977
- 1977-06-02 JP JP6554677A patent/JPS54573A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030539U (ja) * | 1983-08-09 | 1985-03-01 | 富士電機株式会社 | 半導体装置 |
| US4876102A (en) * | 1987-12-30 | 1989-10-24 | The Procter & Gamble Company | Potato based dough containing highly pectinated cellulosic fibers |
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